NTM88H125T1

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of NTM88H125T1Last Revision (GMT):
Wednesday, 19 January 2022, 12:07:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
NTM88H125T1SOT1931HQFN24118.030000 mg YesNoYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 075 765282022-01-182Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.03999699.9900000.033886
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.0100000.000003
Subtotal0.040000100.00000000.033890
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.08817397.9700000.074704
Gold and its compoundsGold, metal7440-57-50.0001620.1800000.000137
Palladium and its compoundsPalladium, metal7440-05-30.0016651.8500000.001411
Subtotal0.090000100.00000000.076252
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-823.71987896.54000020.096482
Gold and its compoundsGold, metal7440-57-50.0024570.0100000.002082
Iron and its compoundsIron, metal7439-89-60.5601962.2800000.474622
Nickel and its compoundsNickel, metal7440-02-00.2334150.9500000.197759
Palladium and its compoundsPalladium, metal7440-05-30.0098280.0400000.008327
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0073710.0300000.006245
Zinc and its compoundsZinc, metal7440-66-60.0368550.1500000.031225
Subtotal24.570000100.000000020.816741
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.2055002.5000001.021351
Inorganic Silicon compoundsSilica, vitreous60676-86-038.57600080.00000032.683216
Inorganic Silicon compoundsSilicon dioxide7631-86-94.5809009.5000003.881132
Inorganic compoundsCarbon Black1333-86-40.2411000.5000000.204270
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins3.6165007.5000003.064052
Subtotal48.220000100.000000040.854020
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.01860093.0000000.015759
Organic Silicon compounds(3,4-Epoxycyclohexyl)ethyltrimethoxysilane3388-04-30.0004002.0000000.000339
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0010005.0000000.000847
Subtotal0.020000100.00000000.016945
Epoxy Adhesive 2Epoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.10140039.0000000.085910
Inorganic Silicon compoundsSilicon dioxide7631-86-90.15600060.0000000.132170
Organic Silicon compoundsOther organosilane compounds0.0026001.0000000.002203
Subtotal0.260000100.00000000.220283
Epoxy Adhesive 3Epoxy AdhesiveEpoxy ResinsOther Epoxy resins2.88090099.0000002.440820
Inorganic compoundsCarbon Black1333-86-40.0291001.0000000.024655
Subtotal2.910000100.00000002.465475
Epoxy Adhesive 4Epoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.0015005.0000000.001271
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.00450015.0000000.003813
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01500050.0000000.012709
PolymersCopolymer of ethylacrylate, buthylacrylate, acrylnitrile, glycidylmethacrylate58152-79-70.00450015.0000000.003813
PolymersFormaldehyde, polymer with 4,4'-(1-methylethylidene)bis[phenol]25085-75-00.00450015.0000000.003813
Subtotal0.030000100.00000000.025417
LidLidChromium and Chromium III compoundsChromium, metal7440-47-34.56421719.0255003.866998
Inorganic Silicon compoundsSilicon7440-21-30.2402121.0013000.203518
Inorganic compoundsCarbon7440-44-00.0120190.0501000.010183
Inorganic compoundsSulfur7704-34-90.0047980.0200000.004065
Iron and its compoundsIron, metal7439-89-616.57917769.10870014.046579
Manganese and its compoundsManganese, metal7439-96-50.3603301.5020000.305287
Nickel and its compoundsNickel, metal7440-02-02.2220509.2624001.882614
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0071970.0300000.006098
Subtotal23.990000100.000000020.325341
Semiconductor Die 1DieInorganic Silicon compoundsSilicon7440-21-34.08645598.0000003.462217
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0833972.0000000.070657
Subtotal4.169852100.00000003.532875
GlassInorganic Silicon compoundsFibrous-glass-wool65997-17-30.04275532.8510000.036224
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.04463834.2980000.037819
Organic compounds2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate25265-77-40.04275532.8510000.036224
Subtotal0.130148100.00000000.110267
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-34.21400098.0000003.570279
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0860002.0000000.072863
Subtotal4.300000100.00000003.643142
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon7440-21-34.21400098.0000003.570279
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0860002.0000000.072863
Subtotal4.300000100.00000003.643142
Thermally Conductive Gel 1Thermally Conductive GelOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0600006.0000000.050834
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-60.27000027.0000000.228755
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.67000067.0000000.567652
Subtotal1.000000100.00000000.847242
Thermally Conductive Gel 2Thermally Conductive GelOrganic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.45454436.3636001.232351
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.42424460.6061002.053922
Organic Silicon compoundsTetra (trimethylsiloxy) silane3555-47-30.1212123.0303000.102696
Subtotal4.000000100.00000003.388969
Total118.030000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 NTM88H125T1
Product content declaration of NTM88H125T1
上次修订 Last Revision (GMT):
Wednesday, 19 January 2022, 12:07:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 4
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Die
OOOOOO

玻璃
Glass
XOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
导热凝胶
Thermally Conductive Gel 1
导热凝胶
Thermally Conductive Gel
OOOOOO
导热凝胶
Thermally Conductive Gel 2
导热凝胶
Thermally Conductive Gel
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of NTM88H125T1Last Revision (GMT):
Wednesday, 19 January 2022, 12:07:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Bonding Wire - CuPdAuTest Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
10 May 2021
Test Report
10 May 2021
Test Report
10 May 2021
Test Report
10 May 2021
CDA 194Test Report
26 Feb 2021
Test Report
26 Feb 2021
Test Report
26 Feb 2021
Test Report
26 Feb 2021
NI PLATINGTest Report
10 May 2021
Test Report
10 May 2021
Test Report
10 May 2021
Test Report
10 May 2021
PD PLATINGTest Report
10 May 2021
Test Report
10 May 2021
Test Report
10 May 2021
Test Report
10 May 2021
Die EncapsulantTest Report
16 Aug 2021
Test Report
16 Aug 2021
Test Report
16 Aug 2021
Test Report
16 Aug 2021
Epoxy Adhesive 1Test Report
6 Oct 2020
Test Report
6 Oct 2020
Test Report
6 Oct 2020
Test Report
6 Oct 2020
Epoxy Adhesive 2Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Epoxy Adhesive 3Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Epoxy Adhesive 4Test Report
29 Jan 2021
Test Report
29 Jan 2021
Test Report
29 Jan 2021
Test Report
29 Jan 2021
LidTest Report
4 Jan 2021
Test Report
4 Jan 2021
Test Report
3 Jan 2018
Test Report
3 Jan 2018
Semiconductor Die 1Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Semiconductor Die 2Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Semiconductor Die 3Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Thermally Conductive Gel 1Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Thermally Conductive Gel 2Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.