NTM88H145T1

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NXP Semiconductors
Product content declaration of NTM88H145T1Last Revision (GMT):
Thursday, 07 December 2023, 06:28:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
NTM88H145T1SOT1931HQFN24113.050000 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 002 335282023-11-24133 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Bangkok, Thailand;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.03999699.9900000.035379
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.0100000.000003
Subtotal0.040000100.00000000.035382
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.08689596.5500000.076864
Gold and its compoundsGold, metal7440-57-50.0003150.3500000.000279
Palladium and its compoundsPalladium, metal7440-05-30.0027903.1000000.002468
Subtotal0.090000100.00000000.079611
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-823.71987896.54000020.981759
Gold and its compoundsGold, metal7440-57-50.0024570.0100000.002173
Iron and its compoundsIron, metal7439-89-60.5601962.2800000.495529
Nickel and its compoundsNickel, metal7440-02-00.2334150.9500000.206471
Palladium and its compoundsPalladium, metal7440-05-30.0098280.0400000.008693
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0073710.0300000.006520
Zinc and its compoundsZinc, metal7440-66-60.0368550.1500000.032601
Subtotal24.570000100.000000021.733746
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins3.3754007.0000002.985759
Inorganic Silicon compoundsSilica, vitreous60676-86-038.43134079.70000033.994993
Inorganic Silicon compoundsSilicon dioxide7631-86-94.82200010.0000004.265369
Inorganic compoundsCarbon Black1333-86-40.1446600.3000000.127961
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins1.4466003.0000001.279611
Subtotal48.220000100.000000042.653693
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.01860093.0000000.016453
Organic Silicon compounds(3,4-Epoxycyclohexyl)ethyltrimethoxysilane3388-04-30.0004002.0000000.000354
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0010005.0000000.000885
Subtotal0.020000100.00000000.017691
Epoxy Adhesive 2Epoxy AdhesiveEpoxy ResinsOther Epoxy resins2.88090099.0000002.548341
Inorganic compoundsCarbon Black1333-86-40.0291001.0000000.025741
Subtotal2.910000100.00000002.574082
Epoxy Adhesive 3Epoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.0015005.0000000.001327
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.00450015.0000000.003980
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01500050.0000000.013269
PolymersCopolymer of ethylacrylate, buthylacrylate, acrylnitrile, glycidylmethacrylate58152-79-70.00450015.0000000.003980
PolymersFormaldehyde, polymer with 4,4'-(1-methylethylidene)bis[phenol]25085-75-00.00450015.0000000.003980
Subtotal0.030000100.00000000.026537
Epoxy Adhesive 4Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.19500075.0000000.172490
Organic compoundsOther organic compounds.0.0039001.5000000.003450
PolymersPlastic: EP - Epoxide, Epoxy0.06110023.5000000.054047
Subtotal0.260000100.00000000.229987
LidLidChromium and Chromium III compoundsChromium, metal7440-47-34.56421719.0255004.037344
Inorganic Silicon compoundsSilicon7440-21-30.2402121.0013000.212483
Inorganic compoundsCarbon7440-44-00.0120190.0501000.010632
Inorganic compoundsSulfur7704-34-90.0047980.0200000.004244
Iron and its compoundsIron, metal7439-89-616.57917769.10870014.665349
Manganese and its compoundsManganese, metal7439-96-50.3603301.5020000.318735
Nickel and its compoundsNickel, metal7440-02-02.2220509.2624001.965546
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0071970.0300000.006366
Subtotal23.990000100.000000021.220699
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-30.58800098.0000000.520124
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0120002.0000000.010615
Subtotal0.600000100.00000000.530739
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-30.60760098.0000000.537461
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0124002.0000000.010969
Subtotal0.620000100.00000000.548430
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon7440-21-36.56600098.0000005.808050
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1340002.0000000.118532
Subtotal6.700000100.00000005.926581
Thermally Conductive Gel 1Thermally Conductive GelOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0600006.0000000.053074
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-60.27000027.0000000.238832
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.67000067.0000000.592658
Subtotal1.000000100.00000000.884564
Thermally Conductive Gel 2Thermally Conductive GelOrganic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.45454436.3636001.286638
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.42424460.6061002.144400
Organic Silicon compoundsTetra (trimethylsiloxy) silane3555-47-30.1212123.0303000.107220
Subtotal4.000000100.00000003.538257
Total113.050000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 NTM88H145T1
Product content declaration of NTM88H145T1
上次修订 Last Revision (GMT):
Thursday, 07 December 2023, 06:28:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 4
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
导热凝胶
Thermally Conductive Gel 1
导热凝胶
Thermally Conductive Gel
OOOOOO
导热凝胶
Thermally Conductive Gel 2
导热凝胶
Thermally Conductive Gel
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of NTM88H145T1Last Revision (GMT):
Thursday, 07 December 2023, 06:28:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
CDA 194Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
NI PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
PD PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Die EncapsulantTest Report
18 Apr 2023
Test Report
18 Apr 2023
Test Report
18 Apr 2023
Test Report
18 Apr 2023
Epoxy Adhesive 1Test Report
28 Jul 2023
Test Report
28 Jul 2023
Test Report
28 Jul 2023
Test Report
28 Jul 2023
Epoxy Adhesive 2Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Epoxy Adhesive 3Not AvailableNot AvailableNot AvailableNot Available
Epoxy Adhesive 4Test Report
30 Mar 2023
Test Report
30 Mar 2023
Not AvailableNot Available
LidTest Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2018
Test Report
3 Jan 2018
Semiconductor Die 1Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 2Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Semiconductor Die 3Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Thermally Conductive Gel 1Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
Thermally Conductive Gel 2Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.