NX3L2267GM,115

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of NX3L2267GM,115Last Revision (GMT):
Friday, 22 December 2023, 10:44:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
NX3L2267GM,115SOT1049XQFN10(U)5.228528 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 889 491152023-11-2521 / Unlimited26030 sec.1 / Unlimited24020 sec.3Bangkok, Thailand
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000010.0010000.000010
Calcium and its compoundsCalcium7440-70-20.0000010.0020000.000020
Copper and its compoundsCopper, metal7440-50-80.0000010.0010000.000010
Gold and its compoundsGold, metal7440-57-50.05263898.8420001.006809
Iron and its compoundsIron, metal7439-89-60.0000010.0010000.000010
Magnesium and its compoundsMagnesium, metal7439-95-40.0000010.0010000.000010
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0010000.000010
Palladium and its compoundsPalladium, metal7440-05-30.0006121.1500000.011714
Silver and its compoundsSilver, metal7440-22-40.0000010.0010000.000010
Subtotal0.053258100.00000001.018604
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-82.11640796.20030040.478058
Inorganic Silicon compoundsSilicon7440-21-30.0143000.6500000.273500
Magnesium and its compoundsMagnesium, metal7439-95-40.0033020.1501000.063157
Nickel and its compoundsNickel, metal7440-02-00.0659912.9996001.262137
Subtotal2.200000100.000000042.076852
Die EncapsulantDie EncapsulantEpoxy ResinsOther Non-halogenated Epoxy resins0.0865733.6072001.655778
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-60.0371021.5459000.709599
Inorganic Silicon compoundsSilica, vitreous60676-86-02.04913785.38070039.191466
Inorganic compoundsCarbon Black1333-86-40.0043660.1819000.083496
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.0860883.5870001.646505
Organic Phosphorus compoundsOther organic phosphorous compounds0.0019030.0793000.036400
Phenols and Phenolic Resins1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol25917-04-80.0075860.3161000.145096
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.0872333.6347001.668401
Zinc and its compoundsZinc Hydroxide20427-58-10.0400131.6672000.765278
Subtotal2.400000100.000000045.902021
Epoxy AdhesiveEpoxy AdhesiveAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.04000040.0000000.765034
Organic compoundsOther organic compounds.0.0050005.0000000.095629
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.01000010.0000000.191258
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-30.01500015.0000000.286888
PolymersPlastic: EP - Epoxide, Epoxy0.03000030.0000000.573775
Subtotal0.100000100.00000001.912584
Pre-plating - Precious metal - NiPdAuPre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0005001.0000000.009563
Nickel and its compoundsNickel, metal7440-02-00.04850097.0000000.927603
Palladium and its compoundsPalladium, metal7440-05-30.0010002.0000000.019126
Subtotal0.050000100.00000000.956292
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.41676598.0000007.970974
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0085052.0000000.162673
Subtotal0.425270100.00000008.133647
Total5.228528100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 NX3L2267GM,115
Product content declaration of NX3L2267GM,115
上次修订 Last Revision (GMT):
Friday, 22 December 2023, 10:44:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of NX3L2267GM,115Last Revision (GMT):
Friday, 22 December 2023, 10:44:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
C7025Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
NI PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
PD PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Pre-plating - Precious metal - NiPdAuTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Semiconductor DieTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.