NX5P3001UKZ

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of NX5P3001UKZLast Revision (GMT):
Tuesday, 25 July 2023, 06:55:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
NX5P3001UKZOL-NX5P3001WLCSP1.524990 mg YesYesYesNot ApplicableNot ApplicableNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 022 220122023-11-2571 / Unlimited030 sec.1 / Unlimited020 sec.3NA
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-30.88880098.00000058.282357
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0181392.0000001.189436
Subtotal0.906939100.000000059.471793
Polyimide CoatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0002462.0000000.016162
PolymersPolyimide Resin39355-34-50.01207798.0000000.791929
Subtotal0.012323100.00000000.808091
Protective CoatingAcrylatesAcrylic polymers9065-11-60.02515021.3000001.649204
Epoxy ResinsCycloaliphatic Epoxy Resin244772-00-70.02515021.3000001.649204
Inorganic Silicon compoundsSilicon dioxide7631-86-90.06777657.4000004.444332
Subtotal0.118076100.00000007.742739
Solder BallCopper and its compoundsCopper, metal7440-50-80.0024180.5000000.158580
Nickel and its compoundsNickel, metal7440-02-00.0003870.0800000.025373
Silver and its compoundsSilver, metal7440-22-40.0048371.0000000.317159
Tin and its compoundsTin, metal7440-31-50.47602398.42000031.214814
Subtotal0.483665100.000000031.715926
Under Bump MetalCopper and its compoundsCopper, metal7440-50-80.00260165.2287000.170541
Nickel and its compoundsNickel, metal7440-02-00.00097824.5340000.064144
Titanium and its compoundsTitanium, metal7440-32-60.0003348.3907000.021938
Vanadium and its compoundsVanadium, metal7440-62-20.0000741.8466000.004828
Subtotal0.003987100.00000000.261451
Total1.524990100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 NX5P3001UKZ
Product content declaration of NX5P3001UKZ
上次修订 Last Revision (GMT):
Tuesday, 25 July 2023, 06:55:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

聚酰亚胺涂料
Polyimide Coating
OOOOOO

防护涂料
Protective Coating
OOOOOO

焊锡球
Solder Ball
XOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of NX5P3001UKZLast Revision (GMT):
Tuesday, 25 July 2023, 06:55:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieCOATINGTest Report
5 May 2023
Test Report
5 May 2023
Test Report
5 May 2023
Test Report
5 May 2023
DIETest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
POLYIMIDETest Report
8 Nov 2022
Test Report
8 Nov 2022
Test Report
8 Nov 2022
Not Available
SOLDER BALLTest Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
UBM CUTest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
UBM NIVTest Report
19 Jan 2023
Test Report
19 Jan 2023
Test Report
19 Jan 2023
Test Report
19 Jan 2023
UBM TITest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.