P1010NSE5DFA

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of P1010NSE5DFALast Revision (GMT):
Tuesday, 27 February 2024, 10:55:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P1010NSE5DFASOT1714-1FBGA425987.049172 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 171 935572024-02-0653 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-55.18365499.9900000.525167
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0005180.0100000.000053
Subtotal5.184172100.00000000.525219
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins24.2850005.0000002.460364
Inorganic Silicon compoundsSilica, vitreous60676-86-0325.41900067.00000032.968874
Inorganic Silicon compoundsSilicon dioxide7631-86-9121.42500025.00000012.301819
Inorganic compoundsCarbon Black1333-86-42.4285000.5000000.246036
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins12.1425002.5000001.230182
Subtotal485.700000100.000000049.207275
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.02400012.0000000.002432
Epoxy ResinsProprietary Material-Other Epoxy resins0.0140007.0000000.001418
Silver and its compoundsSilver, metal7440-22-40.16200081.0000000.016413
Subtotal0.200000100.00000000.020262
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped24.50000098.0000002.482146
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5000002.0000000.050656
Subtotal25.000000100.00000002.532802
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0035350.0032000.000358
Antimony and its compoundsAntimony, metal7440-36-00.0138080.0125000.001399
Arsenic and its compoundsArsenic, metal7440-38-20.0082850.0075000.000839
Bismuth and its compoundsBismuth, metal7440-69-90.0207670.0188000.002104
Cadmium and its compoundsCadmium, metal7440-43-90.0014360.0013000.000146
Copper and its compoundsCopper, metal7440-50-80.0069590.0063000.000705
Gold and its compoundsGold, metal7440-57-50.0069590.0063000.000705
Indium and its compoundsIndium, metal7440-74-60.0069590.0063000.000705
Inorganic compoundsSulfur7704-34-90.0011050.0010000.000112
Iron and its compoundsIron, metal7439-89-60.0138080.0125000.001399
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0345760.0313000.003503
Nickel and its compoundsNickel, metal7440-02-00.0035350.0032000.000358
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0069590.0063000.000705
Silver and its compoundsSilver, metal7440-22-43.8664963.5002000.391723
Tin and its compoundsTin, metal7440-31-5106.46771496.38140010.786465
Zinc and its compoundsZinc, metal7440-66-60.0020990.0019000.000213
Subtotal110.465000100.000000011.191438
Substrate, Pre-plated NiAuCopper Foil 1Copper and its compoundsCopper, metal7440-50-819.65609999.9900001.991400
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0019660.0100000.000199
Subtotal19.658065100.00000001.991599
Copper Foil 2Copper and its compoundsCopper, metal7440-50-8185.81916699.99000018.825725
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0185840.0100000.001883
Subtotal185.837750100.000000018.827608
Copper PlatingCopper and its compoundsCopper, metal7440-50-812.28461199.9900001.244579
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0012290.0100000.000124
Subtotal12.285840100.00000001.244704
Gold PlatingGold and its compoundsGold, metal7440-57-50.68488299.9900000.069387
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000680.0100000.000007
Subtotal0.684950100.00000000.069394
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0002310.0100000.000023
Nickel and its compoundsNickel, metal7440-02-02.31417999.9900000.234454
Subtotal2.314410100.00000000.234478
Solder MaskBarium and its compoundsBarium sulfate7727-43-75.05015129.1000000.511641
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1041270.6000000.010549
Magnesium and its compoundsTalc14807-96-60.5206343.0000000.052747
Organic compoundsOther organic compounds.0.6247613.6000000.063296
PolymersPlastic: EP - Epoxide, Epoxy3.40147619.6000000.344611
PolymersPlastic: PAK7.65332144.1000000.775374
Subtotal17.354470100.00000001.758217
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-313.05183032.0000001.322308
Inorganic Silicon compoundsSilica, vitreous60676-86-02.4472186.0000000.247933
PolymersPlastic: PI - Polyimide25.28792162.0000002.561972
Subtotal40.786970100.00000004.132213
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-330.18369237.0000003.057972
Inorganic Silicon compoundsSilica, vitreous60676-86-013.05240716.0000001.322367
PolymersPlastic: PI - Polyimide38.34144647.0000003.884451
Subtotal81.577545100.00000008.264790
Total987.049172100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P1010NSE5DFA
Product content declaration of P1010NSE5DFA
上次修订 Last Revision (GMT):
Tuesday, 27 February 2024, 10:55:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P1010NSE5DFALast Revision (GMT):
Tuesday, 27 February 2024, 10:55:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
6 May 2023
Test Report
6 May 2023
Test Report
6 May 2023
Test Report
6 May 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
AUS308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
COPPERTest Report
28 Apr 2022
Test Report
28 Apr 2022
Test Report
28 Apr 2022
Test Report
28 Apr 2022
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.