P1012NXN2HFB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of P1012NXN2HFBLast Revision (GMT):
Tuesday, 12 September 2023, 05:29:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P1012NXN2HFBSOT1745-1HBGA6895245.248220 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 172 855572023-11-24113 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-85.93392397.6350000.113129
Gold and its compoundsGold, metal7440-57-50.0103080.1696000.000197
Palladium and its compoundsPalladium, metal7440-05-30.1334292.1954000.002544
Subtotal6.077660100.00000000.115870
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins75.5950005.0000001.441209
Inorganic Silicon compoundsSilica, vitreous60676-86-01012.97300067.00000019.312203
Inorganic Silicon compoundsSilicon dioxide7631-86-9377.97500025.0000007.206046
Inorganic compoundsCarbon Black1333-86-47.5595000.5000000.144121
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins37.7975002.5000000.720605
Subtotal1511.900000100.000000028.824184
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.00400012.0000000.038206
Epoxy ResinsProprietary Material-Other Epoxy resins1.1690007.0000000.022287
Silver and its compoundsSilver, metal7440-22-413.52700081.0000000.257891
Subtotal16.700000100.00000000.318383
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsProprietary Material-Other silica compounds39.41407921.2819000.751425
Inorganic Silicon compoundsQuartz14808-60-71.4838220.8012000.028289
Inorganic Silicon compoundsSilica, vitreous60676-86-039.41407921.2819000.751425
Inorganic compoundsCarbon Black1333-86-41.4838220.8012000.028289
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-718.54778010.0150000.353611
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-210.6649275.7586000.203325
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-274.19149040.0602001.414451
Subtotal185.200000100.00000003.530815
Heat SpreaderBlack OxideCopper and its compoundsCopper, metal7440-50-810.83222287.0000000.206515
Copper and its compoundsCupric oxide1317-38-01.24508310.0000000.023737
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3735253.0000000.007121
Subtotal12.450830100.00000000.237374
Copper AlloyCopper and its compoundsCopper, metal7440-50-81196.16580699.97000022.804751
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3589570.0300000.006843
Subtotal1196.524763100.000000022.811595
EpoxyInorganic compoundsCarbon Black1333-86-44.33288912.0000000.082606
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-331.77451888.0000000.605777
Subtotal36.107407100.00000000.688383
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped41.72796998.0000000.795539
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8515912.0000000.016235
Subtotal42.579560100.00000000.811774
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-420.2301753.5000000.385686
Tin and its compoundsTin, metal7440-31-5557.77482596.50000010.633907
Subtotal578.005000100.000000011.019593
Substrate, Pre-plated NiAuCopper Foil 1Copper and its compoundsCopper, metal7440-50-8101.18298599.9900001.929041
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0101190.0100000.000193
Subtotal101.193104100.00000001.929234
Copper Foil 2Copper and its compoundsCopper, metal7440-50-8872.65968199.99000016.637148
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0872750.0100000.001664
Subtotal872.746956100.000000016.638811
Copper PlatingCopper and its compoundsCopper, metal7440-50-871.65952299.9900001.366180
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0071670.0100000.000137
Subtotal71.666689100.00000001.366316
Gold PlatingGold and its compoundsGold, metal7440-57-52.27358299.9900000.043346
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002270.0100000.000004
Subtotal2.273810100.00000000.043350
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0007700.0100000.000015
Nickel and its compoundsNickel, metal7440-02-07.70033599.9900000.146806
Subtotal7.701105100.00000000.146821
Solder MaskBarium and its compoundsBarium sulfate7727-43-722.79175029.1000000.434522
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4699330.6000000.008959
Magnesium and its compoundsTalc14807-96-62.3496653.0000000.044796
Organic compoundsOther organic compounds.2.8195983.6000000.053755
PolymersPlastic: EP - Epoxide, Epoxy15.35114419.6000000.292668
PolymersPlastic: PAK34.54007544.1000000.658502
Subtotal78.322165100.00000001.493202
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-356.08524732.0000001.069258
Inorganic Silicon compoundsSilica, vitreous60676-86-010.5159846.0000000.200486
PolymersPlastic: PI - Polyimide108.66516662.0000002.071688
Subtotal175.266396100.00000003.341432
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-3129.69712737.0000002.472659
Inorganic Silicon compoundsSilica, vitreous60676-86-056.08524416.0000001.069258
PolymersPlastic: PI - Polyimide164.75040547.0000003.140946
Subtotal350.532776100.00000006.682863
Total5245.248220100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P1012NXN2HFB
Product content declaration of P1012NXN2HFB
上次修订 Last Revision (GMT):
Tuesday, 12 September 2023, 05:29:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
氧化黑
Black Oxide
OOOOOO

铜合金
Copper Alloy
OOOOOO

环氧胶
Epoxy
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P1012NXN2HFBLast Revision (GMT):
Tuesday, 12 September 2023, 05:29:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy Adhesive 1Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Epoxy Adhesive 2Test Report
20 Sep 2023
Test Report
20 Sep 2023
Test Report
20 Sep 2023
Test Report
20 Sep 2023
Heat SpreaderBLACK OXIDETest Report
28 Jun 2023
Test Report
28 Jun 2023
Test Report
28 Jun 2023
Test Report
28 Jun 2023
C1100Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
12 Jan 2022
Test Report
12 Jan 2022
Test Report
12 Jan 2022
Test Report
12 Jan 2022
AUS308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGNot AvailableNot AvailableNot AvailableNot Available
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.