P1014NXE5HHB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of P1014NXE5HHBLast Revision (GMT):
Thursday, 07 March 2024, 11:30:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P1014NXE5HHBSOT1714-1FBGA425984.269299 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 248 815572023-11-24153 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-82.34743797.6350000.238495
Gold and its compoundsGold, metal7440-57-50.0040780.1696000.000414
Palladium and its compoundsPalladium, metal7440-05-30.0527842.1954000.005363
Subtotal2.404299100.00000000.244273
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins24.2850005.0000002.467313
Inorganic Silicon compoundsSilica, vitreous60676-86-0325.41900067.00000033.061988
Inorganic Silicon compoundsSilicon dioxide7631-86-9121.42500025.00000012.336563
Inorganic compoundsCarbon Black1333-86-42.4285000.5000000.246731
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins12.1425002.5000001.233656
Subtotal485.700000100.000000049.346251
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.02400012.0000000.002438
Epoxy ResinsProprietary Material-Other Epoxy resins0.0140007.0000000.001422
Silver and its compoundsSilver, metal7440-22-40.16200081.0000000.016459
Subtotal0.200000100.00000000.020320
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped24.50000098.0000002.489156
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5000002.0000000.050799
Subtotal25.000000100.00000002.539955
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0035350.0032000.000359
Antimony and its compoundsAntimony, metal7440-36-00.0138080.0125000.001403
Arsenic and its compoundsArsenic, metal7440-38-20.0082850.0075000.000842
Bismuth and its compoundsBismuth, metal7440-69-90.0207670.0188000.002110
Cadmium and its compoundsCadmium, metal7440-43-90.0014360.0013000.000146
Copper and its compoundsCopper, metal7440-50-80.0069590.0063000.000707
Gold and its compoundsGold, metal7440-57-50.0069590.0063000.000707
Indium and its compoundsIndium, metal7440-74-60.0069590.0063000.000707
Inorganic compoundsSulfur7704-34-90.0011050.0010000.000112
Iron and its compoundsIron, metal7439-89-60.0138080.0125000.001403
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0345760.0313000.003513
Nickel and its compoundsNickel, metal7440-02-00.0035350.0032000.000359
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0069590.0063000.000707
Silver and its compoundsSilver, metal7440-22-43.8664963.5002000.392829
Tin and its compoundsTin, metal7440-31-5106.46771496.38140010.816929
Zinc and its compoundsZinc, metal7440-66-60.0020990.0019000.000213
Subtotal110.465000100.000000011.223046
Substrate, Pre-plated NiAuCopper Foil 1Copper and its compoundsCopper, metal7440-50-819.65609999.9900001.997024
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0019660.0100000.000200
Subtotal19.658065100.00000001.997224
Copper Foil 2Copper and its compoundsCopper, metal7440-50-8185.81916699.99000018.878895
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0185840.0100000.001888
Subtotal185.837750100.000000018.880783
Copper PlatingCopper and its compoundsCopper, metal7440-50-812.28461199.9900001.248095
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0012290.0100000.000125
Subtotal12.285840100.00000001.248219
Gold PlatingGold and its compoundsGold, metal7440-57-50.68488299.9900000.069583
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000680.0100000.000007
Subtotal0.684950100.00000000.069590
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0002310.0100000.000023
Nickel and its compoundsNickel, metal7440-02-02.31417999.9900000.235116
Subtotal2.314410100.00000000.235140
Solder MaskBarium and its compoundsBarium sulfate7727-43-75.05015129.1000000.513086
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1041270.6000000.010579
Magnesium and its compoundsTalc14807-96-60.5206343.0000000.052895
Organic compoundsOther organic compounds.0.6247613.6000000.063475
PolymersPlastic: EP - Epoxide, Epoxy3.40147619.6000000.345584
PolymersPlastic: PAK7.65332144.1000000.777564
Subtotal17.354470100.00000001.763183
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-313.05183032.0000001.326043
Inorganic Silicon compoundsSilica, vitreous60676-86-02.4472186.0000000.248633
PolymersPlastic: PI - Polyimide25.28792162.0000002.569208
Subtotal40.786970100.00000004.143883
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-330.18369237.0000003.066609
Inorganic Silicon compoundsSilica, vitreous60676-86-013.05240716.0000001.326101
PolymersPlastic: PI - Polyimide38.34144647.0000003.895422
Subtotal81.577545100.00000008.288133
Total984.269299100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P1014NXE5HHB
Product content declaration of P1014NXE5HHB
上次修订 Last Revision (GMT):
Thursday, 07 March 2024, 11:30:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P1014NXE5HHBLast Revision (GMT):
Thursday, 07 March 2024, 11:30:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
AUS308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
COPPERTest Report
28 Apr 2022
Test Report
28 Apr 2022
Test Report
28 Apr 2022
Test Report
28 Apr 2022
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.