P1015NXE5DFB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of P1015NXE5DFBLast Revision (GMT):
Tuesday, 05 November 2024, 06:07:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P1015NXE5DFBSOT1718-1FBGA5611570.525774 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 255 515572023-11-24103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-86.47536297.6350000.412305
Gold and its compoundsGold, metal7440-57-50.0112480.1696000.000716
Palladium and its compoundsPalladium, metal7440-05-30.1456042.1954000.009271
Subtotal6.632214100.00000000.422293
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins38.8100005.0000002.471147
Inorganic Silicon compoundsSilica, vitreous60676-86-0520.05400067.00000033.113369
Inorganic Silicon compoundsSilicon dioxide7631-86-9194.05000025.00000012.355735
Inorganic compoundsCarbon Black1333-86-43.8810000.5000000.247115
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins19.4050002.5000001.235574
Subtotal776.200000100.000000049.422939
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.68400012.0000000.043552
Epoxy ResinsProprietary Material-Other Epoxy resins0.3990007.0000000.025406
Silver and its compoundsSilver, metal7440-22-44.61700081.0000000.293978
Subtotal5.700000100.00000000.362936
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped41.72796998.0000002.656943
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8515912.0000000.054223
Subtotal42.579560100.00000002.711166
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0046660.0032000.000297
Antimony and its compoundsAntimony, metal7440-36-00.0182270.0125000.001161
Arsenic and its compoundsArsenic, metal7440-38-20.0109360.0075000.000696
Bismuth and its compoundsBismuth, metal7440-69-90.0274130.0188000.001746
Cadmium and its compoundsCadmium, metal7440-43-90.0018960.0013000.000121
Copper and its compoundsCopper, metal7440-50-80.0091860.0063000.000585
Gold and its compoundsGold, metal7440-57-50.0091860.0063000.000585
Indium and its compoundsIndium, metal7440-74-60.0091860.0063000.000585
Inorganic compoundsSulfur7704-34-90.0014580.0010000.000093
Iron and its compoundsIron, metal7439-89-60.0182270.0125000.001161
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0456400.0313000.002906
Nickel and its compoundsNickel, metal7440-02-00.0046660.0032000.000297
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0091860.0063000.000585
Silver and its compoundsSilver, metal7440-22-45.1037823.5002000.324973
Tin and its compoundsTin, metal7440-31-5140.53757596.3814008.948441
Zinc and its compoundsZinc, metal7440-66-60.0027700.0019000.000176
Subtotal145.814000100.00000009.284407
Substrate, Pre-plated NiAuCopper Foil 1Copper and its compoundsCopper, metal7440-50-832.28829099.9900002.055890
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0032290.0100000.000206
Subtotal32.291519100.00000002.056096
Copper Foil 2Copper and its compoundsCopper, metal7440-50-8312.98272299.99000019.928531
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0313010.0100000.001993
Subtotal313.014024100.000000019.930525
Copper PlatingCopper and its compoundsCopper, metal7440-50-814.80275599.9900000.942535
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0014800.0100000.000094
Subtotal14.804236100.00000000.942629
Gold PlatingGold and its compoundsGold, metal7440-57-51.01494399.9900000.064624
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001020.0100000.000006
Subtotal1.015044100.00000000.064631
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0003430.0100000.000022
Nickel and its compoundsNickel, metal7440-02-03.43062999.9900000.218438
Subtotal3.430972100.00000000.218460
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0312230.1000000.001988
Barium and its compoundsBarium sulfate7727-43-79.08590629.1000000.578526
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1873380.6000000.011928
Magnesium and its compoundsTalc14807-96-60.9366913.0000000.059642
Organic compoundsOther organic compounds.1.1240303.6000000.071570
PolymersPlastic: EP - Epoxide, Epoxy6.08849419.5000000.387672
PolymersPlastic: PAK13.76936344.1000000.876736
Subtotal31.223045100.00000001.988063
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-321.10155732.0000001.343598
Inorganic Silicon compoundsSilica, vitreous60676-86-03.9565426.0000000.251925
PolymersPlastic: PI - Polyimide40.88426662.0000002.603222
Subtotal65.942365100.00000004.198745
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-348.79515437.0000003.106931
Inorganic Silicon compoundsSilica, vitreous60676-86-021.10060716.0000001.343538
PolymersPlastic: PI - Polyimide61.98303347.0000003.946642
Subtotal131.878794100.00000008.397111
Total1570.525774100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P1015NXE5DFB
Product content declaration of P1015NXE5DFB
上次修订 Last Revision (GMT):
Tuesday, 05 November 2024, 06:07:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P1015NXE5DFBLast Revision (GMT):
Tuesday, 05 November 2024, 06:07:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Solder Ball - Lead FreeTest Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Substrate, Pre-plated NiAuAU PLATINGTest Report
12 Jan 2022
Test Report
12 Jan 2022
Test Report
12 Jan 2022
Test Report
12 Jan 2022
AUS308Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGNot AvailableNot AvailableNot AvailableNot Available
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.