P1022NSE2HFB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of P1022NSE2HFBLast Revision (GMT):
Tuesday, 12 September 2023, 12:14:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P1022NSE2HFBSOT1745-1HBGA6895349.665660 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 215 155572023-11-24133 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-85.93392397.6350000.110921
Gold and its compoundsGold, metal7440-57-50.0103080.1696000.000193
Palladium and its compoundsPalladium, metal7440-05-30.1334292.1954000.002494
Subtotal6.077660100.00000000.113608
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins75.5950005.0000001.413079
Inorganic Silicon compoundsSilica, vitreous60676-86-01012.97300067.00000018.935258
Inorganic Silicon compoundsSilicon dioxide7631-86-9377.97500025.0000007.065395
Inorganic compoundsCarbon Black1333-86-47.5595000.5000000.141308
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins37.7975002.5000000.706539
Subtotal1511.900000100.000000028.261579
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.00400012.0000000.037460
Epoxy ResinsProprietary Material-Other Epoxy resins1.1690007.0000000.021852
Silver and its compoundsSilver, metal7440-22-413.52700081.0000000.252857
Subtotal16.700000100.00000000.312169
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsProprietary Material-Other silica compounds39.41407921.2819000.736758
Inorganic Silicon compoundsQuartz14808-60-71.4838220.8012000.027737
Inorganic Silicon compoundsSilica, vitreous60676-86-039.41407921.2819000.736758
Inorganic compoundsCarbon Black1333-86-41.4838220.8012000.027737
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-718.54778010.0150000.346709
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-210.6649275.7586000.199357
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-274.19149040.0602001.386843
Subtotal185.200000100.00000003.461899
Heat SpreaderBlack OxideCopper and its compoundsCopper, metal7440-50-810.83222287.0000000.202484
Copper and its compoundsCupric oxide1317-38-01.24508310.0000000.023274
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3735253.0000000.006982
Subtotal12.450830100.00000000.232740
Copper AlloyCopper and its compoundsCopper, metal7440-50-81196.16580699.97000022.359637
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3589570.0300000.006710
Subtotal1196.524763100.000000022.366347
EpoxyInorganic compoundsCarbon Black1333-86-44.33288912.0000000.080994
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-331.77451888.0000000.593953
Subtotal36.107407100.00000000.674947
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped52.62600098.0000000.983725
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.0740002.0000000.020076
Subtotal53.700000100.00000001.003801
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-420.2301753.5000000.378158
Tin and its compoundsTin, metal7440-31-5557.77482596.50000010.426349
Subtotal578.005000100.000000010.804507
Substrate, Pre-plated NiAuCopper Foil 1Copper and its compoundsCopper, metal7440-50-899.54291599.9900001.860731
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0099550.0100000.000186
Subtotal99.552870100.00000001.860918
Copper Foil 2Copper and its compoundsCopper, metal7440-50-8885.75490699.99000016.557201
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0885840.0100000.001656
Subtotal885.843490100.000000016.558857
Copper PlatingCopper and its compoundsCopper, metal7440-50-845.62602799.9900000.852876
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0045630.0100000.000085
Subtotal45.630590100.00000000.852962
Gold PlatingGold and its compoundsGold, metal7440-57-523.52290799.9900000.439708
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0023520.0100000.000044
Subtotal23.525260100.00000000.439752
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0079620.0100000.000149
Nickel and its compoundsNickel, metal7440-02-079.61329899.9900001.488192
Subtotal79.621260100.00000001.488341
Solder MaskBarium and its compoundsBarium sulfate7727-43-723.32792529.1000000.436063
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4809880.6000000.008991
Magnesium and its compoundsTalc14807-96-62.4049413.0000000.044955
Organic compoundsOther organic compounds.2.8859293.6000000.053946
PolymersPlastic: EP - Epoxide, Epoxy15.71227919.6000000.293706
PolymersPlastic: PAK35.35262844.1000000.660838
Subtotal80.164690100.00000001.498499
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-357.45913332.0000001.074070
Inorganic Silicon compoundsSilica, vitreous60676-86-010.7735876.0000000.201388
PolymersPlastic: PI - Polyimide111.32707062.0000002.081010
Subtotal179.559790100.00000003.356468
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-3132.86775937.0000002.483665
Inorganic Silicon compoundsSilica, vitreous60676-86-057.45632816.0000001.074017
PolymersPlastic: PI - Polyimide168.77796347.0000003.154926
Subtotal359.102050100.00000006.712607
Total5349.665660100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P1022NSE2HFB
Product content declaration of P1022NSE2HFB
上次修订 Last Revision (GMT):
Tuesday, 12 September 2023, 12:14:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
氧化黑
Black Oxide
OOOOOO

铜合金
Copper Alloy
OOOOOO

环氧胶
Epoxy
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P1022NSE2HFBLast Revision (GMT):
Tuesday, 12 September 2023, 12:14:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy Adhesive 1Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Epoxy Adhesive 2Test Report
20 Sep 2023
Test Report
20 Sep 2023
Test Report
20 Sep 2023
Test Report
20 Sep 2023
Heat SpreaderBLACK OXIDETest Report
28 Jun 2023
Test Report
28 Jun 2023
Test Report
28 Jun 2023
Test Report
28 Jun 2023
C1100Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
12 Jan 2022
Test Report
12 Jan 2022
Test Report
12 Jan 2022
Test Report
12 Jan 2022
AUS308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
COPPERTest Report
28 Apr 2022
Test Report
28 Apr 2022
Test Report
28 Apr 2022
Test Report
28 Apr 2022
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
12 Jan 2022
Test Report
12 Jan 2022
Test Report
12 Jan 2022
Test Report
12 Jan 2022
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
12 Jan 2022
Test Report
12 Jan 2022
Test Report
12 Jan 2022
Test Report
12 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.