P2040NSN1MMB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of P2040NSN1MMBLast Revision (GMT):
Tuesday, 03 October 2023, 04:49:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P2040NSN1MMBSOT1639-1FBGA7804027.353600 mg YesNoYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 146 675572023-11-245Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-79.32800040.0000000.231616
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-63.49800015.0000000.086856
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-210.49400045.0000000.260568
Subtotal23.320000100.00000000.579040
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-82290.65781698.44670056.877494
Nickel and its compoundsNickel, metal7440-02-036.1421841.5533000.897418
Subtotal2326.800000100.000000057.774912
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped305.66075889.1000007.589618
Lead and its compoundsLead, metallic lead and lead alloys7439-92-132.3077599.4177000.802208
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.0874820.9000000.076663
Nickel and its compoundsNickel, metal7440-02-00.2830190.0825000.007027
Tin and its compoundsTin, metal7440-31-51.7001740.4956000.042216
Titanium and its compoundsTitanium, metal7440-32-60.0144080.0042000.000358
Subtotal343.053600100.00000008.518090
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.9684000.5000000.024046
Silver and its compoundsSilver, metal7440-22-45.8104003.0000000.144273
Tin and its compoundsTin, metal7440-31-5186.90120096.5000004.640794
Subtotal193.680000100.00000004.809113
SubstrateSubstrateAcrylonitrile compoundsProprietary Material-Other acrylonitrile compounds102.7684179.1545002.551760
Arsenic and its compoundsArsenic, metal7440-38-20.0112260.0010000.000279
Barium and its compoundsBarium sulfate7727-43-785.0436867.5756002.111652
Copper and its compoundsCopper, metal7440-50-8518.68385946.20380012.879024
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3305.28321227.1943007.580244
Inorganic Silicon compoundsSilicon dioxide7631-86-954.1429984.8230001.344381
Lead and its compoundsLead, metallic lead and lead alloys7439-92-12.5606510.2281000.063581
Silver and its compoundsSilver, metal7440-22-40.3491290.0311000.008669
Tin and its compoundsTin, metal7440-31-553.7568244.7886001.334793
Subtotal1122.600000100.000000027.874384
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-56.44400072.0000000.160006
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1790002.0000000.004445
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones0.7160008.0000000.017778
Zinc and its compoundsZinc oxide1314-13-21.61100018.0000000.040002
Subtotal8.950000100.00000000.222230
UnderfillUnderfillAliphatic AminesProprietary Material-Other aliphatic amines0.6265007.0000000.015556
Aniline and its saltsp-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline5026-74-40.89500010.0000000.022223
Bismuth and its compoundsBismuth nitrate10361-44-10.0358000.4000000.000889
Bismuth and its compoundsBismuth trioxide1304-76-30.0358000.4000000.000889
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.89500010.0000000.022223
Inorganic Silicon compoundsSilica, vitreous60676-86-05.81750065.0000000.144450
Inorganic compoundsCarbon Black1333-86-40.0895001.0000000.002222
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1969002.2000000.004889
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.3580004.0000000.008889
Subtotal8.950000100.00000000.222230
Total4027.353600100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P2040NSN1MMB
Product content declaration of P2040NSN1MMB
上次修订 Last Revision (GMT):
Tuesday, 03 October 2023, 04:49:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
XOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P2040NSN1MMBLast Revision (GMT):
Tuesday, 03 October 2023, 04:49:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Heat SpreaderC1100Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
NI PLATINGTest Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
SubstrateNot AvailableNot AvailableNot AvailableNot Available
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
6 Dec 2022
Test Report
6 Dec 2022
Test Report
6 Dec 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.