P3041NSE7MMC

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of P3041NSE7MMCLast Revision (GMT):
Thursday, 07 March 2024, 11:24:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P3041NSE7MMCSOT1629-1BGA129518732.695000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 246 225572023-11-24143 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-74.61040040.0000000.024612
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.72890015.0000000.009229
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-25.18670045.0000000.027688
Subtotal11.526000100.00000000.061529
Heat SpreaderCopper AlloyCopper and its compoundsCopper, metal7440-50-812460.35457399.90000066.516615
Miscellaneous substancesOther miscellaneous substances (less than 10%).12.4728270.1000000.066583
Subtotal12472.827400100.000000066.583198
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.3927450.2000000.002097
Nickel and its compoundsNickel, metal7440-02-0195.97985599.8000001.046191
Subtotal196.372600100.00000001.048288
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped189.68320089.6000001.012578
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.9053000.9000000.010171
Nickel and its compoundsNickel, metal7440-02-01.0585000.5000000.005651
Silver and its compoundsSilver, metal7440-22-40.6668550.3150000.003560
Tin and its compoundsTin, metal7440-31-518.3861458.6850000.098150
Subtotal211.700000100.00000001.130110
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-85.4360670.5009000.029019
Silver and its compoundsSilver, metal7440-22-432.6164043.0054000.174115
Tin and its compoundsTin, metal7440-31-51047.20752996.4937005.590266
Subtotal1085.260000100.00000005.793400
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-81235.72693699.9000006.596632
Epoxy ResinsOther Epoxy resins1.2369640.1000000.006603
Subtotal1236.963900100.00000006.603235
SolderCopper and its compoundsCopper, metal7440-50-80.0266280.5000000.000142
Silver and its compoundsSilver, metal7440-22-40.1597713.0000000.000853
Tin and its compoundsTin, metal7440-31-55.13930196.5000000.027435
Subtotal5.325700100.00000000.028430
Solder BallCopper and its compoundsCopper, metal7440-50-80.2200350.5000000.001175
Silver and its compoundsSilver, metal7440-22-41.3202133.0000000.007048
Tin and its compoundsTin, metal7440-31-542.46685196.5000000.226699
Subtotal44.007100100.00000000.234921
Solder MaskBarium and its compoundsBarium sulfate7727-43-726.61444431.1311000.142075
Copper and its compoundsCopper phthalocyanine147-14-80.0855770.1001000.000457
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4278850.5005000.002284
Magnesium and its compoundsTalc14807-96-63.0807723.6036000.016446
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.0269241.2012000.005482
PolymersPlastic: EP - Epoxide, Epoxy54.25589863.4635000.289632
Subtotal85.491500100.00000000.456376
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3526.82385050.0000002.812323
Inorganic Silicon compoundsSilica, vitreous60676-86-052.6823855.0000000.281232
PolymersPlastic: EP - Epoxide, Epoxy474.14146545.0000002.531090
Subtotal1053.647700100.00000005.624646
Substrate PrepregEpoxy ResinsBisphenol A diglycidyl ether1675-54-378.68435820.8400000.420038
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-539.30442310.4100000.209817
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-619.6333335.2000000.104808
Inorganic Silicon compoundsSilicon dioxide7631-86-978.68435820.8400000.420038
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-411.7800003.1200000.062885
PolymersPlastic: EP - Epoxide, Epoxy149.47762739.5900000.797951
Subtotal377.564100100.00000002.015535
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-51358.17632072.0000007.250299
Miscellaneous substancesProprietary Material-Other miscellaneous substances.37.7271202.0000000.201397
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones150.9084808.0000000.805589
Zinc and its compoundsZinc oxide1314-13-2339.54408018.0000001.812575
Subtotal1886.356000100.000000010.069859
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-039.39180060.0000000.210284
Inorganic compoundsCarbon Black1333-86-40.0656530.1000000.000351
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.5908770.9000000.003154
PolymersPlastic: EP - Epoxide, Epoxy25.60467039.0000000.136684
Subtotal65.653000100.00000000.350473
Total18732.695000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P3041NSE7MMC
Product content declaration of P3041NSE7MMC
上次修订 Last Revision (GMT):
Thursday, 07 March 2024, 11:24:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
铜合金
Copper Alloy
OOOOOO

镀镍层
Nickel Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P3041NSE7MMCLast Revision (GMT):
Thursday, 07 March 2024, 11:24:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
2 Mar 2023
Test Report
2 Mar 2023
Test Report
2 Mar 2023
Test Report
2 Mar 2023
Heat SpreaderC1100Test Report
27 Oct 2021
Test Report
27 Oct 2021
Test Report
27 Oct 2021
Test Report
27 Oct 2021
NI PLATINGTest Report
16 Jun 2021
Test Report
16 Jun 2021
Test Report
16 Jun 2021
Test Report
16 Jun 2021
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
SubstrateCU FOILTest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
E679 SERIESNot AvailableTest Report
14 Dec 2022
Not AvailableNot Available
E679FG SERIESTest Report
14 Dec 2022
Not AvailableTest Report
21 Dec 2021
Test Report
21 Dec 2021
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.