P4040NSN7PNAC

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of P4040NSN7PNACLast Revision (GMT):
Tuesday, 05 March 2024, 06:45:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P4040NSN7PNACSOT1629-1BGA129535108.204000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 111 575572023-11-2473 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-74.61040040.0000000.013132
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.72890015.0000000.004925
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-25.18670045.0000000.014774
Subtotal11.526000100.00000000.032830
Heat Spreader 1Copper AlloyCopper and its compoundsCopper, metal7440-50-812460.35457399.90000035.491290
Miscellaneous substancesOther miscellaneous substances (less than 10%).12.4728270.1000000.035527
Subtotal12472.827400100.000000035.526817
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.3927450.2000000.001119
Nickel and its compoundsNickel, metal7440-02-0195.97985599.8000000.558217
Subtotal196.372600100.00000000.559335
Heat Spreader 2Heat SpreaderCopper and its compoundsCopper, metal7440-50-812628.46852299.67850035.970135
Nickel and its compoundsNickel, metal7440-02-040.7314780.3215000.116017
Subtotal12669.200000100.000000036.086152
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped352.30720089.6000001.003490
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.5388000.9000000.010080
Nickel and its compoundsNickel, metal7440-02-01.9660000.5000000.005600
Silver and its compoundsSilver, metal7440-22-41.2385800.3150000.003528
Tin and its compoundsTin, metal7440-31-534.1494208.6850000.097269
Subtotal393.200000100.00000001.119966
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped352.30720089.6000001.003490
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.5388000.9000000.010080
Nickel and its compoundsNickel, metal7440-02-01.9660000.5000000.005600
Silver and its compoundsSilver, metal7440-22-41.2385800.3150000.003528
Tin and its compoundsTin, metal7440-31-534.1494208.6850000.097269
Subtotal393.200000100.00000001.119966
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon7440-21-3352.30720089.6000001.003490
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.5388000.9000000.010080
Nickel and its compoundsNickel, metal7440-02-01.9660000.5000000.005600
Silver and its compoundsSilver, metal7440-22-41.2385800.3150000.003528
Tin and its compoundsTin, metal7440-31-534.1494208.6850000.097269
Subtotal393.200000100.00000001.119966
Semiconductor Die 4Semiconductor DieInorganic Silicon compoundsSilicon7440-21-3385.33600098.0000001.097567
Miscellaneous substancesOther miscellaneous substances (less than 10%).7.8640002.0000000.022399
Subtotal393.200000100.00000001.119966
Semiconductor Die 5Semiconductor DieInorganic Silicon compoundsSilicon7440-21-3352.30720089.6000001.003490
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.5388000.9000000.010080
Nickel and its compoundsNickel, metal7440-02-01.9660000.5000000.005600
Silver and its compoundsSilver, metal7440-22-41.2385800.3150000.003528
Tin and its compoundsTin, metal7440-31-534.1494208.6850000.097269
Subtotal393.200000100.00000001.119966
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-85.4360670.5009000.015484
Silver and its compoundsSilver, metal7440-22-432.6164043.0054000.092902
Tin and its compoundsTin, metal7440-31-51047.20752996.4937002.982800
Subtotal1085.260000100.00000003.091186
SubstrateSubstrateBarium and its compoundsBarium sulfate7727-43-714.9063540.5318000.042458
Copper and its compoundsCopper phthalocyanine147-14-80.1009080.0036000.000287
Copper and its compoundsCopper, metal7440-50-81294.02457146.1657003.685818
Epoxy ResinsOther Epoxy resins30.9619381.1046000.088190
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-535.9344601.2820000.102354
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3545.65160119.4667001.554200
Inorganic Silicon compoundsSilicon dioxide7631-86-9446.98039515.9465001.273151
Magnesium and its compoundsTalc14807-96-61.7238450.0615000.004910
Organic compoundsOxirane, 2,2,2,2-[1,2-ethanediylidenetetrakis(4,1phenyleneoxymethylene)]tetrakis7328-97-4203.2819697.2523000.579016
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-635.9344601.2820000.102354
PolymersOther polymers161.7050705.7690000.460591
Silver and its compoundsSilver, metal7440-22-40.9586260.0342000.002730
Tin and its compoundsTin, metal7440-31-530.8358031.1001000.087831
Subtotal2803.000000100.00000007.983889
Thermally Conductive Gel 1Thermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-51358.17632072.0000003.868544
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones188.63560010.0000000.537298
Zinc and its compoundsZinc oxide1314-13-2339.54408018.0000000.967136
Subtotal1886.356000100.00000005.372978
Thermally Conductive Gel 2Thermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-51358.17632072.0000003.868544
Miscellaneous substancesProprietary Material-Other miscellaneous substances.37.7271202.0000000.107460
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones150.9084808.0000000.429838
Zinc and its compoundsZinc oxide1314-13-2339.54408018.0000000.967136
Subtotal1886.356000100.00000005.372978
Underfill 1UnderfillAliphatic AminesProprietary Material-Other aliphatic amines4.5957107.0000000.013090
Aniline and its saltsp-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline5026-74-46.56530010.0000000.018700
Bismuth and its compoundsBismuth nitrate10361-44-10.2626120.4000000.000748
Bismuth and its compoundsBismuth trioxide1304-76-30.2626120.4000000.000748
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-56.56530010.0000000.018700
Inorganic Silicon compoundsSilica, vitreous60676-86-042.67445065.0000000.121551
Inorganic compoundsCarbon Black1333-86-40.6565301.0000000.001870
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.4443662.2000000.004114
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-62.6261204.0000000.007480
Subtotal65.653000100.00000000.187002
Underfill 2UnderfillInorganic Silicon compoundsSilica, vitreous60676-86-039.39180060.0000000.112201
Inorganic compoundsCarbon Black1333-86-40.0656530.1000000.000187
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.5908770.9000000.001683
PolymersPlastic: EP - Epoxide, Epoxy25.60467039.0000000.072931
Subtotal65.653000100.00000000.187002
Total35108.204000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P4040NSN7PNAC
Product content declaration of P4040NSN7PNAC
上次修订 Last Revision (GMT):
Tuesday, 05 March 2024, 06:45:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader 1
铜合金
Copper Alloy
OOOOOO

镀镍层
Nickel Plating
OOOOOO
散热片
Heat Spreader 2
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 5
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
导热凝胶
Thermally Conductive Gel 1
导热凝胶
Thermally Conductive Gel
OOOOOO
导热凝胶
Thermally Conductive Gel 2
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill 1
底注
Underfill
OOOOOO
底注
Underfill 2
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P4040NSN7PNACLast Revision (GMT):
Tuesday, 05 March 2024, 06:45:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Heat Spreader 1C1100Test Report
27 Oct 2021
Test Report
27 Oct 2021
Test Report
27 Oct 2021
Test Report
27 Oct 2021
NI PLATINGTest Report
16 Jun 2021
Test Report
16 Jun 2021
Test Report
16 Jun 2021
Test Report
16 Jun 2021
Heat Spreader 2C1100Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
NI PLATINGTest Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Semiconductor Die 1Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Semiconductor Die 2Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Semiconductor Die 3Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Semiconductor Die 4Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Semiconductor Die 5Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
SubstrateABF-GX13Test Report
28 Apr 2023
Not AvailableTest Report
28 Apr 2023
Test Report
20 Jul 2022
AUS 703Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E700GRTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
EUTECTIC SOLDERTest Report
18 Mar 2019
Test Report
18 Mar 2019
Test Report
18 Mar 2019
Test Report
18 Mar 2019
PHP-900 IR-6Test Report
20 Apr 2023
Test Report
18 Jun 2023Test Report
18 Jun 2023
Test Report
20 Apr 2023
Test Report
16 Jul 2020
Thermally Conductive Gel 1Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Thermally Conductive Gel 2Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Underfill 1Test Report
6 Dec 2022
Test Report
6 Dec 2022
Test Report
6 Dec 2022
Test Report
17 Jan 2022
Underfill 2Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.