P5021NXN72QC

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of P5021NXN72QCLast Revision (GMT):
Tuesday, 27 December 2022, 12:54:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P5021NXN72QCSOT1629-1BGA129518914.195000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 236 335572021-09-1183 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-74.61040040.0000000.024375
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.72890015.0000000.009141
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-25.18670045.0000000.027422
Subtotal11.526000100.00000000.060938
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-812628.46852299.67850066.767148
Nickel and its compoundsNickel, metal7440-02-040.7314780.3215000.215349
Subtotal12669.200000100.000000066.982496
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-3352.30720089.6000001.862660
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.5388000.9000000.018710
Nickel and its compoundsNickel, metal7440-02-01.9660000.5000000.010394
Silver and its compoundsSilver, metal7440-22-41.2385800.3150000.006548
Tin and its compoundsTin, metal7440-31-534.1494208.6850000.180549
Subtotal393.200000100.00000002.078862
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-85.4360670.5009000.028741
Silver and its compoundsSilver, metal7440-22-432.6164043.0054000.172444
Tin and its compoundsTin, metal7440-31-51047.20752996.4937005.536622
Subtotal1085.260000100.00000005.737807
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-81262.32880899.9000006.673976
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2635920.1000000.006681
Subtotal1263.592400100.00000006.680657
Solder BallCopper and its compoundsCopper, metal7440-50-80.2718910.5000000.001437
Silver and its compoundsSilver, metal7440-22-41.6313463.0000000.008625
Tin and its compoundsTin, metal7440-31-552.47496396.5000000.277437
Subtotal54.378200100.00000000.287499
Solder MaskBarium and its compoundsBarium sulfate7727-43-720.04985931.1000000.106004
Copper and its compoundsCopper phthalocyanine147-14-80.1289380.2000000.000682
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3223450.5000000.001704
Magnesium and its compoundsTalc14807-96-62.3208843.6000000.012271
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7091591.1000000.003749
Organic compoundsProprietary Material-Other organic compounds.0.0644690.1000000.000341
PolymersPlastic: EP - Epoxide, Epoxy40.87334663.4000000.216099
Subtotal64.469000100.00000000.340850
Substrate Build UpEpoxy ResinsBisphenol A diglycidyl ether1675-54-336.08694310.4500000.190793
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-536.08694310.4500000.190793
Inorganic Silicon compoundsSilicon dioxide7631-86-9144.52043841.8500000.764085
PolymersPlastic: EP - Epoxide, Epoxy128.63527637.2500000.680099
Subtotal345.329600100.00000001.825769
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3537.61540050.0000002.842391
Inorganic Silicon compoundsSilica, vitreous60676-86-0215.04616020.0000001.136956
PolymersPlastic: EP - Epoxide, Epoxy322.56924030.0000001.705435
Subtotal1075.230800100.00000005.684782
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-51358.17632072.0000007.180725
Miscellaneous substancesProprietary Material-Other miscellaneous substances.18.8635601.0000000.099732
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones169.7720409.0000000.897591
Zinc and its compoundsZinc oxide1314-13-2339.54408018.0000001.795181
Subtotal1886.356000100.00000009.973229
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-039.39180060.0000000.208266
Inorganic compoundsCarbon Black1333-86-40.0656530.1000000.000347
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.5908770.9000000.003124
PolymersPlastic: EP - Epoxide, Epoxy25.60467039.0000000.135373
Subtotal65.653000100.00000000.347110
Total18914.195000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P5021NXN72QC
Product content declaration of P5021NXN72QC
上次修订 Last Revision (GMT):
Tuesday, 27 December 2022, 12:54:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P5021NXN72QCLast Revision (GMT):
Tuesday, 27 December 2022, 12:54:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Heat SpreaderC1100Test Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
NI PLATINGTest Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
Test Report
10 Jun 2022
Semiconductor DieTest Report
27 Apr 2022
Test Report
27 Apr 2022
Test Report
27 Apr 2022
Test Report
27 Apr 2022
Solder Ball - SAC, Lead FreeTest Report
23 Feb 2022
Test Report
23 Feb 2022
Test Report
23 Feb 2022
Test Report
23 Feb 2022
SubstrateAUS 703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
E700GRTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
GX-13Test Report
20 Jul 2022Test Report
30 Jul 2021
Test Report
20 Jul 2022Test Report
30 Jul 2021
Test Report
20 Jul 2022Test Report
30 Jul 2021
Test Report
20 Jul 2022Test Report
30 Jul 2021
PHP-900 IR-6Test Report
17 Feb 2022
Test Report
19 Aug 2021
Test Report
18 Jun 2021
Test Report
16 Jul 2020
Thermally Conductive GelTest Report
3 Aug 2022
Test Report
3 Aug 2022
Test Report
3 Aug 2022
Test Report
3 Aug 2022
UnderfillTest Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.