P87C51X2FA,512

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of P87C51X2FA,512Last Revision (GMT):
Monday, 10 April 2023, 10:21:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P87C51X2FA,512SOT187PLCC442353.336020 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 696 055122023-11-25133 / 168 hours24530 sec.3 / 168 hours22520 sec.3External manufacturing;Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000130.0020000.000000
Gold and its compoundsGold, metal7440-57-50.62423498.8400000.026526
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000510.0080000.000002
Palladium and its compoundsPalladium, metal7440-05-30.0072631.1500000.000309
Subtotal0.631560100.00000000.026837
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-8484.21467597.42750020.575671
Iron and its compoundsIron, metal7439-89-611.6795002.3500000.496296
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0745500.0150000.003168
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.4100250.0825000.017423
Zinc and its compoundsZinc, metal7440-66-60.6212500.1250000.026399
Subtotal497.000000100.000000021.118956
Die EncapsulantDie EncapsulantEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-254.7500003.0000002.326485
Epoxy ResinsOther Non-halogenated Epoxy resins127.7500007.0000005.428464
Inorganic Silicon compoundsSilica, vitreous60676-86-01587.75000087.00000067.468053
Inorganic compoundsCarbon Black1333-86-49.1250000.5000000.387747
Phenols and Phenolic ResinsOther phenolic resins45.6250002.5000001.938737
Subtotal1825.000000100.000000077.549487
Epoxy AdhesiveEpoxy AdhesivePolymersProprietary Material-Other acrylic/epoxy resin mixture0.34200019.0000000.014533
Silver and its compoundsSilver, metal7440-22-41.45800081.0000000.061955
Subtotal1.800000100.00000000.076487
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0006600.0030000.000028
Bismuth and its compoundsBismuth, metal7440-69-90.0002200.0010000.000009
Copper and its compoundsCopper, metal7440-50-80.0002200.0010000.000009
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0011000.0050000.000047
Tin and its compoundsTin, metal7440-31-521.99780099.9900000.934750
Subtotal22.000000100.00000000.934843
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0001200.0100000.000005
Silver and its compoundsSilver, metal7440-22-41.19988099.9900000.050986
Subtotal1.200000100.00000000.050991
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-35.59037198.0000000.237551
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1140892.0000000.004848
Subtotal5.704460100.00000000.242399
Total2353.336020100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P87C51X2FA,512
Product content declaration of P87C51X2FA,512
上次修订 Last Revision (GMT):
Monday, 10 April 2023, 10:21:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P87C51X2FA,512Last Revision (GMT):
Monday, 10 April 2023, 10:21:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Copper Lead-FrameAG PLATINGTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
C194Test Report
5 Feb 2024
Test Report
5 Feb 2024
Test Report
5 Feb 2024
Test Report
5 Feb 2024
Die EncapsulantTest Report
12 Apr 2023
Test Report
12 Apr 2023
Test Report
12 Apr 2023
Test Report
12 Apr 2023
Epoxy AdhesiveTest Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
31 Dec 2020
Post-plating - Lead FreeTest Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Pre-plating - Precious metal - AgTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Semiconductor DieTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.