PCA8576CT/Q900/1Y

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of PCA8576CT/Q900/1YLast Revision (GMT):
Wednesday, 28 June 2023, 04:55:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PCA8576CT/Q900/1YSOT190-1VSO561461.559198 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 016 735182023-11-2543 / 168 hours24530 sec.3 / 168 hours22520 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.29653196.9000000.020289
Palladium and its compoundsPalladium, metal7440-05-30.0094873.1000000.000649
Subtotal0.306018100.00000000.020938
Copper Lead-Frame, Pre-Plated AgCopper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-8221.80402297.29100015.175849
Iron and its compoundsIron, metal7439-89-65.4031262.3700000.369682
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0387570.0170000.002652
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3784470.1660000.025893
Tin and its compoundsTin, metal7440-31-50.0683940.0300000.004679
Zinc and its compoundsZinc, metal7440-66-60.2872550.1260000.019654
Subtotal227.980000100.000000015.598410
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins18.8760001.5600001.291497
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-644.0440003.6400003.013494
Inorganic Silicon compoundsSilica, vitreous60676-86-0951.18100078.61000065.079882
Inorganic Silicon compoundsSilicon dioxide7631-86-9105.7540008.7400007.235697
Inorganic compoundsCarbon Black1333-86-42.0570000.1700000.140740
Miscellaneous substancesOther miscellaneous substances (less than 10%).37.6310003.1100002.574716
Phenols and Phenolic ResinsOther phenolic resins3.7510000.3100000.256644
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-646.7060003.8600003.195628
Subtotal1210.000000100.000000082.788299
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.1990009.9500000.013616
Palladium and its compoundsProprietary Material-Other palladium compounds0.0010000.0500000.000068
PolymersAmines, C36-alkylenedi-, maleated682800-79-90.20000010.0000000.013684
Silver and its compoundsSilver, metal7440-22-41.60000080.0000000.109472
Subtotal2.000000100.00000000.136840
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0003300.0030000.000023
Bismuth and its compoundsBismuth, metal7440-69-90.0001100.0010000.000008
Copper and its compoundsCopper, metal7440-50-80.0001100.0010000.000008
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0005500.0050000.000038
Tin and its compoundsTin, metal7440-31-510.99890099.9900000.752546
Subtotal11.000000100.00000000.752621
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0002000.0100000.000014
Silver and its compoundsSilver, metal7440-22-41.99980099.9900000.136826
Subtotal2.000000100.00000000.136840
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-38.10771698.0000000.554731
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1654642.0000000.011321
Subtotal8.273180100.00000000.566052
Total1461.559198100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 PCA8576CT/Q900/1Y
Product content declaration of PCA8576CT/Q900/1Y
上次修订 Last Revision (GMT):
Wednesday, 28 June 2023, 04:55:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of PCA8576CT/Q900/1YLast Revision (GMT):
Wednesday, 28 June 2023, 04:55:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Copper Lead-Frame, Pre-Plated AgNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Post-plating - Lead FreeTest Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
Test Report
31 May 2023
Pre-plating - Precious metal - AgTest Report
29 Dec 2022
Test Report
29 Dec 2022
Test Report
29 Dec 2022
Test Report
29 Dec 2022
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.