PCA9517DP,118

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of PCA9517DP,118Last Revision (GMT):
Monday, 15 August 2022, 11:14:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PCA9517DP,118SOT505TSSOP829.004380 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 767 651182020-10-171 / Unlimited26030 sec.1 / Unlimited24020 sec.3External manufacturing;Bangkok, Thailand;Suzhou, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000010.0020000.000004
Gold and its compoundsGold, metal7440-57-50.06363398.8400000.219392
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000050.0080000.000018
Palladium and its compoundsPalladium, metal7440-05-30.0007401.1500000.002553
Subtotal0.064380100.00000000.221967
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-814.55000097.00000050.164837
Nickel and its compoundsNickel, metal7440-02-00.4500003.0000001.551490
Subtotal15.000000100.000000051.716327
Die EncapsulantDie EncapsulantBoron and its compoundsTetraphenylphosphonium tetraphenylborate15525-15-20.0650000.5000000.224104
Epoxy Resins2,5-Di-tert-butyl-1,4-phenylenebis(oxymethyloxirane)64777-22-60.2600002.0000000.896416
Epoxy ResinsProprietary Material-Other Epoxy resins0.2600002.0000000.896416
Inorganic Silicon compoundsSilica, vitreous60676-86-011.18000086.00000038.545902
Inorganic compoundsCarbon Black1333-86-40.0650000.5000000.224104
Magnesium and its compoundsMagnesium Aluminum Hydroxide Carbonate11097-59-90.0650000.5000000.224104
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.1950001.5000000.672312
Organic Silicon compoundsOther organic Silicon Compounds0.0650000.5000000.224104
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.0650000.5000000.224104
Organic compoundsOther organic compounds.0.0650000.5000000.224104
Phenols and Phenolic ResinsPhenol polymer with 4, 4'- bis (methoxymethyl)- 1, 1'-bisphenyl205830-20-20.5200004.0000001.792833
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.1300001.0000000.448208
Zinc and its compoundsZinc Hydroxide20427-58-10.0650000.5000000.224104
Subtotal13.000000100.000000044.820817
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0033093.3094000.011410
AcrylatesProprietary Material-Other acrylates0.0088258.8252000.030427
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0033093.3094000.011410
Palladium and its compoundsPalladium, metal7440-05-30.0001660.1655000.000571
PolymersProprietary Material-Other polymers0.0016551.6547000.005705
Silver and its compoundsSilver, metal7440-22-40.08273682.7358000.285253
Subtotal0.100000100.00000000.344776
Pre-plating - Precious metal - NiPdAuPre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0030001.0000000.010343
Nickel and its compoundsNickel, metal7440-02-00.29100097.0000001.003297
Palladium and its compoundsPalladium, metal7440-05-30.0060002.0000000.020687
Subtotal0.300000100.00000001.034326
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.52920098.0000001.824552
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0108002.0000000.037236
Subtotal0.540000100.00000001.861788
Total29.004380100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 PCA9517DP,118
Product content declaration of PCA9517DP,118
上次修订 Last Revision (GMT):
Monday, 15 August 2022, 11:14:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of PCA9517DP,118Last Revision (GMT):
Monday, 15 August 2022, 11:14:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
C7025Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
NI PLATINGTest Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
PD PLATINGTest Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Die EncapsulantTest Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Epoxy AdhesiveTest Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Pre-plating - Precious metal - NiPdAuNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.