PM823UK/A0CZ

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of PM823UK/A0CZLast Revision (GMT):
Thursday, 27 October 2022, 12:40:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PM823UK/A0CZSOT2063WLCSP122.538620 mg YesYesYesNot ApplicableNot ApplicableNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 190 890922021-03-0121 / Unlimited26030 sec.1 / Unlimited24020 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-31.58831598.00000062.566091
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0324152.0000001.276859
Subtotal1.620730100.000000063.842950
Plastic CoatingAcrylatesOther acrylates0.00018618.5714000.007315
AcrylatesProprietary Material-Other acrylates0.0000202.0000000.000788
Glycol Ethers and Acetates - Specific2-Methoxyethanol109-86-40.0000010.0051000.000002
Inorganic Silicon compoundsSilica, vitreous60676-86-00.00053553.7075000.021156
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0000606.0000000.002364
Inorganic compoundsCarbon Black1333-86-40.0000202.0000000.000788
Inorganic compoundsChlorine, atomic22537-15-10.0000010.0017000.000001
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.00011111.1429000.004389
PolymersPoly[(phenyl glycidyl ether)-co-dicyclopentadiene]119345-05-00.0000666.5714000.002589
Subtotal0.001000100.00000000.039392
Polyimide Coating 1Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000510.5000000.001989
PolymersPlastic: PI - Polyimide0.01004999.5000000.395865
Subtotal0.010100100.00000000.397854
Polyimide Coating 2Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000450.5000000.001773
PolymersPlastic: PI - Polyimide0.00895599.5000000.352751
Subtotal0.009000100.00000000.354523
Redistribution MetalCopper and its compoundsCopper, metal7440-50-80.03900097.5000001.536268
Titanium and its compoundsTitanium, metal7440-32-60.0010002.5000000.039392
Subtotal0.040000100.00000001.575659
Solder BallAluminum and its compoundsAluminum, metal7429-90-50.0000170.0020000.000656
Antimony and its compoundsAntimony, metal7440-36-00.0004160.0500000.016387
Arsenic and its compoundsArsenic, metal7440-38-20.0000830.0100000.003277
Bismuth and its compoundsBismuth, metal7440-69-90.0291193.4999001.147047
Cadmium and its compoundsCadmium, metal7440-43-90.0000080.0010000.000328
Cobalt and its compoundsCobalt, metal7440-48-40.0000420.0050000.001639
Copper and its compoundsCopper, metal7440-50-80.0041600.5000000.163869
Germanium and its compoundsGermanium7440-56-40.0000580.0070000.002294
Gold and its compoundsGold, metal7440-57-50.0000420.0050000.001639
Indium and its compoundsIndium, metal7440-74-60.0000830.0100000.003277
Inorganic compoundsSulfur7704-34-90.0000080.0010000.000328
Iron and its compoundsIron, metal7439-89-60.0001250.0150000.004916
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0004160.0500000.016387
Nickel and its compoundsNickel, metal7440-02-00.0004160.0500000.016387
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0000080.0010000.000328
Silver and its compoundsSilver, metal7440-22-40.0332793.9999001.310916
Tin and its compoundsTin, metal7440-31-50.76370391.79120030.083387
Zinc and its compoundsZinc, metal7440-66-60.0000170.0020000.000656
Subtotal0.832000100.000000032.773716
Under Bump MetalCopper and its compoundsCopper, metal7440-50-80.02562099.3408001.009209
Titanium and its compoundsTitanium, metal7440-32-60.0001700.6592000.006697
Subtotal0.025790100.00000001.015906
Total2.538620100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 PM823UK/A0CZ
Product content declaration of PM823UK/A0CZ
上次修订 Last Revision (GMT):
Thursday, 27 October 2022, 12:40:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

塑料层
Plastic Coating
OOOOOO

聚酰亚胺涂料
Polyimide Coating 1
OOOOOO

聚酰亚胺涂料
Polyimide Coating 2
OOOOOO

电气再分配
Redistribution Metal
OOOOOO

焊锡球
Solder Ball
OOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of PM823UK/A0CZLast Revision (GMT):
Thursday, 27 October 2022, 12:40:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieDIETest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
PLASTIC COATINGTest Report
24 Jun 2021
Test Report
24 Jun 2021
Test Report
24 Jun 2021
Test Report
24 Jun 2021
POLYIMIDETest Report
15 Nov 2021
Test Report
15 Nov 2021
Test Report
15 Nov 2021
Test Report
15 Nov 2021
RDL CU PLATINGTest Report
5 Aug 2021
Test Report
5 Aug 2021
Test Report
5 Aug 2021
Test Report
5 Aug 2021
RDL CU TARGETTest Report
20 Dec 2021
Test Report
20 Dec 2021
Test Report
20 Dec 2021
Test Report
20 Dec 2021
RDL TITest Report
20 Dec 2021
Test Report
20 Dec 2021
Test Report
20 Dec 2021
Test Report
20 Dec 2021
SOLDER BALLTest Report
17 Nov 2021
Test Report
17 Nov 2021
Test Report
17 Nov 2021
Test Report
17 Nov 2021
UBM CU PLATINGTest Report
5 Aug 2021
Test Report
5 Aug 2021
Test Report
5 Aug 2021
Test Report
5 Aug 2021
UBM CU TARGETTest Report
20 Dec 2021
Test Report
20 Dec 2021
Test Report
20 Dec 2021
Test Report
20 Dec 2021
UBM TITest Report
20 Dec 2021
Test Report
20 Dec 2021
Test Report
20 Dec 2021
Test Report
20 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.