PN5180A0ET/C2J

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of PN5180A0ET/C2JLast Revision (GMT):
Saturday, 06 April 2024, 01:13:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PN5180A0ET/C2JSOT1336TFBGA6463.419230 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 087 461182023-11-2541 / Unlimited26030 sec.1 / Unlimited24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000050.0020000.000008
Gold and its compoundsGold, metal7440-57-50.23721698.8400000.374044
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000190.0080000.000030
Palladium and its compoundsPalladium, metal7440-05-30.0027601.1500000.004352
Subtotal0.240000100.00000000.378434
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins3.70800010.3000005.846807
Inorganic Silicon compoundsOther silica compounds32.29200089.70000050.918310
Subtotal36.000000100.000000056.765117
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.03000010.0000000.047304
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0060002.0000000.009461
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.03000010.0000000.047304
Silver and its compoundsSilver, metal7440-22-40.23400078.0000000.368973
Subtotal0.300000100.00000000.473043
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-32.82164598.0000004.449195
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0575852.0000000.090800
Subtotal2.879230100.00000004.539995
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0350000.5000000.055188
Silver and its compoundsSilver, metal7440-22-40.0700001.0000000.110377
Tin and its compoundsTin, metal7440-31-56.89500098.50000010.872097
Subtotal7.000000100.000000011.037662
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-83.73628799.8000005.891410
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0074880.2000000.011806
Subtotal3.743774100.00000005.903216
Copper PlatingCopper and its compoundsCopper, metal7440-50-83.26803799.7500005.153070
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0081910.2500000.012915
Subtotal3.276228100.00000005.165985
Gold PlatingGold and its compoundsGold, metal7440-57-50.09666799.7500000.152426
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002420.2500000.000382
Subtotal0.096910100.00000000.152808
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0025460.2500000.004015
Nickel and its compoundsNickel, metal7440-02-01.01585699.7500001.601810
Subtotal1.018402100.00000001.605825
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.62734229.1000000.989199
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0129350.6000000.020396
Magnesium and its compoundsTalc14807-96-60.0646743.0000000.101979
Organic compoundsOther organic compounds.0.0776093.6000000.122375
PolymersPlastic: EP - Epoxide, Epoxy0.42254019.6000000.666265
PolymersPlastic: PAK0.95071544.1000001.499095
Subtotal2.155816100.00000003.399309
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-61.46253421.8000002.306136
Inorganic Silicon compoundsFibrous-glass-wool65997-17-33.00557444.8000004.739216
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0805061.2000000.126943
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4293686.4000000.677031
Phenols - SpecificBisphenol A80-05-70.0670891.0000000.105786
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)0.96607714.4000001.523319
PolymersPlastic: EP - Epoxide, Epoxy0.69772310.4000001.100175
Subtotal6.708871100.000000010.578607
Total63.419230100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 PN5180A0ET/C2J
Product content declaration of PN5180A0ET/C2J
上次修订 Last Revision (GMT):
Saturday, 06 April 2024, 01:13:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of PN5180A0ET/C2JLast Revision (GMT):
Saturday, 06 April 2024, 01:13:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Semiconductor DieTest Report
6 Jun 2023
Test Report
6 Jun 2023
Test Report
6 Jun 2023
Test Report
6 Jun 2023
Solder Ball - SAC, Lead FreeTest Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
SubstrateAU PLATINGTest Report
17 Feb 2023
Test Report
17 Feb 2023
Test Report
17 Feb 2023
Test Report
17 Feb 2023
AUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
7 Oct 2023
Test Report
7 Oct 2023
COPPERTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
CU PLATINGTest Report
2 Nov 2023
Test Report
2 Nov 2023
Test Report
2 Nov 2023
Test Report
2 Nov 2023
HL832NXATest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
8 Feb 2023
Test Report
29 Dec 2023
NI PLATINGTest Report
15 Feb 2023
Test Report
15 Feb 2023
Test Report
15 Feb 2023
Test Report
15 Feb 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.