QN9030THN/001Z

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of QN9030THN/001ZLast Revision (GMT):
Friday, 08 March 2024, 01:24:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
QN9030THN/001ZSOT618HVQFN4098.140080 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 830 835152023-11-2553 / 168 hours26030 sec.3 / 168 hours24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000010.0020000.000000
Gold and its compoundsGold, metal7440-57-50.00592998.8400000.006043
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0080000.000000
Palladium and its compoundsPalladium, metal7440-05-30.0000691.1500000.000070
Subtotal0.006000100.00000000.006114
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.00293697.8650000.002992
Gold and its compoundsGold, metal7440-57-50.0000040.1350000.000004
Palladium and its compoundsPalladium, metal7440-05-30.0000602.0000000.000061
Subtotal0.003000100.00000000.003057
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-840.17824097.52000040.939685
Iron and its compoundsIron, metal7439-89-60.9476002.3000000.965559
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0123600.0300000.012594
Zinc and its compoundsZinc, metal7440-66-60.0618000.1500000.062971
Subtotal41.200000100.000000041.980809
Die EncapsulantDie EncapsulantEpoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-61.8756923.6400001.911239
Inorganic Silicon compoundsSilica, vitreous60676-86-040.50773378.61000041.275423
Inorganic Silicon compoundsSilicon dioxide7631-86-94.5037228.7400004.589075
Inorganic compoundsCarbon Black1333-86-40.0876010.1700000.089261
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.6025833.1100001.632955
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-61.9890583.8600002.026754
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.1597430.3100000.162770
PolymersPlastic: EP - Epoxide, Epoxy0.8038681.5600000.819103
Subtotal51.530000100.000000052.506580
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.1154209.9500000.117607
Palladium and its compoundsProprietary Material-Other palladium compounds0.0005800.0500000.000591
PolymersAmines, C36-alkylenedi-, maleated682800-79-90.11600010.0000000.118198
Silver and its compoundsSilver, metal7440-22-40.92800080.0000000.945587
Subtotal1.160000100.00000001.181984
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.01500075.0000000.015284
Organic compoundsOther organic compounds.0.0003001.5000000.000306
PolymersPlastic: EP - Epoxide, Epoxy0.00470023.5000000.004789
Subtotal0.020000100.00000000.020379
Pre-plating - Precious metal - NiPdAuPre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0089001.0000000.009069
Nickel and its compoundsNickel, metal7440-02-00.80990091.0000000.825249
Palladium and its compoundsPalladium, metal7440-05-30.0712008.0000000.072549
Subtotal0.890000100.00000000.906867
Semiconductor Die 1Semiconductor Die 1Gold and its compoundsGold, metal7440-57-50.0030232.0000000.003080
Inorganic Silicon compoundsSilicon7440-21-30.14811798.0000000.150924
Subtotal0.151140100.00000000.154004
Semiconductor Die 2Inorganic Silicon compoundsSilicon7440-21-30.14811798.0000000.150924
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0030232.0000000.003080
Subtotal0.151140100.00000000.154004
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-32.96822498.0000003.024477
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0605762.0000000.061724
Subtotal3.028800100.00000003.086201
Total98.140080100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 QN9030THN/001Z
Product content declaration of QN9030THN/001Z
上次修订 Last Revision (GMT):
Friday, 08 March 2024, 01:24:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die 1
OOOOOO

半导体芯片
Semiconductor Die 2
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of QN9030THN/001ZLast Revision (GMT):
Friday, 08 March 2024, 01:24:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Bonding Wire - CuPdAuTest Report
10 Apr 2023
Test Report
10 Apr 2023
Test Report
10 Apr 2023
Test Report
10 Apr 2023
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
CDA 194Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
NI PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
PD PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy Adhesive 1Test Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Test Report
1 Dec 2023
Epoxy Adhesive 2Test Report
7 Mar 2024
Test Report
7 Mar 2024
Test Report
7 Mar 2024
Test Report
30 Mar 2023
Pre-plating - Precious metal - NiPdAuTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
29 Dec 2023
Not Available
Semiconductor Die 1AU BUMPTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
AU UBMTest Report
16 Dec 2022
Test Report
16 Dec 2022
Test Report
16 Dec 2022
Test Report
16 Dec 2022
DIETest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
TIW UBMTest Report
13 Apr 2023
Test Report
13 Apr 2023
Test Report
13 Apr 2023
Test Report
13 Apr 2023
Semiconductor Die 2Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.