RW612ET/A2IY

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of RW612ET/A2IYLast Revision (GMT):
Friday, 08 March 2024, 04:56:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
RW612ET/A2IYSOT2153TFBGA145131.777676 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 547 425182024-02-0543 / 168 hours26030 sec.NA / Not Available020 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.60418597.8650000.458488
Gold and its compoundsGold, metal7440-57-50.0008330.1350000.000633
Palladium and its compoundsPalladium, metal7440-05-30.0123472.0000000.009370
Subtotal0.617366100.00000000.468491
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins3.7013505.0000002.808784
Inorganic Silicon compoundsSilica, vitreous60676-86-055.66830475.20000042.244108
Inorganic Silicon compoundsSilicon dioxide7631-86-911.10405015.0000008.426351
Inorganic compoundsCarbon Black1333-86-40.2220810.3000000.168527
Phenols and Phenolic ResinsOther phenolic resins3.3312154.5000002.527905
Subtotal74.027000100.000000056.175676
Epoxy AdhesiveEpoxy AdhesiveAcrylatesTrimethylolpropane triacrylate15625-89-50.30070010.0000000.228187
Azo compounds1,3,5-Triazine-2,4,6(1H,3H,5H)-trione, compd. with 6-(2-(2-methyl-1H-imidazol-1-yl)ethyl)-1,3,5-triazine-2,4-diamine (1:1)68490-66-40.0045100.1500000.003423
Epoxy ResinsEpikote 86228064-14-40.2405608.0000000.182550
Glycidyl ethers2-ethylhexyl glycidyl ether2461-15-60.0255590.8500000.019396
Silver and its compoundsSilver, metal7440-22-42.43567081.0000001.848318
Subtotal3.007000100.00000002.281874
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-38.35186498.0000006.337844
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1704462.0000000.129344
Subtotal8.522310100.00000006.467188
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0001510.0010000.000115
Antimony and its compoundsAntimony, metal7440-36-00.0075680.0500000.005743
Arsenic and its compoundsArsenic, metal7440-38-20.0045410.0300000.003446
Bismuth and its compoundsBismuth, metal7440-69-90.0151360.1000000.011486
Cadmium and its compoundsCadmium, metal7440-43-90.0003030.0020000.000230
Copper and its compoundsCopper, metal7440-50-80.0756800.5000000.057430
Germanium and its compoundsGermanium7440-56-40.0015140.0100000.001149
Indium and its compoundsIndium, metal7440-74-60.0015140.0100000.001149
Inorganic compoundsSulfur7704-34-90.0001510.0010000.000115
Iron and its compoundsIron, metal7439-89-60.0030270.0200000.002297
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0075680.0500000.005743
Nickel and its compoundsNickel, metal7440-02-00.0075680.0500000.005743
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0001510.0010000.000115
Silver and its compoundsSilver, metal7440-22-40.4540803.0000000.344580
Tin and its compoundsTin, metal7440-31-514.55689796.17400011.046557
Zinc and its compoundsZinc, metal7440-66-60.0001510.0010000.000115
Subtotal15.136000100.000000011.486012
Substrate, Pre-plated NiAuCopper Foil 1Copper and its compoundsCopper, metal7440-50-82.37694599.7500001.803754
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0059570.2500000.004521
Subtotal2.382902100.00000001.808275
Copper Foil 2Arsenic and its compoundsArsenic, metal7440-38-20.0036980.0400000.002806
Copper and its compoundsCopper, metal7440-50-89.22702499.8000007.001963
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0064720.0700000.004911
Nickel and its compoundsNickel, metal7440-02-00.0083210.0900000.006314
Subtotal9.245515100.00000007.015995
Copper PlatingCopper and its compoundsCopper, metal7440-50-87.12475799.7500005.406649
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0178570.2500000.013551
Subtotal7.142613100.00000005.420200
Gold PlatingGold and its compoundsGold, metal7440-57-50.06838299.7500000.051892
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001710.2500000.000130
Subtotal0.068553100.00000000.052022
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0013370.2500000.001015
Nickel and its compoundsNickel, metal7440-02-00.53368199.7500000.404986
Subtotal0.535018100.00000000.406001
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.55218629.1000000.419029
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0113850.6000000.008640
Magnesium and its compoundsTalc14807-96-60.0569263.0000000.043199
Organic compoundsOther organic compounds.0.0683123.6000000.051839
PolymersPlastic: EP - Epoxide, Epoxy0.37191919.6000000.282232
PolymersPlastic: PAK0.83681844.1000000.635023
Subtotal1.897547100.00000001.439961
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-60.91148521.8000000.691684
Inorganic Silicon compoundsFibrous-glass-wool65997-17-31.87314344.8000001.421442
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0501741.2000000.038074
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2675926.4000000.203063
Phenols - SpecificBisphenol A80-05-70.0418111.0000000.031729
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)0.60208214.4000000.456892
PolymersPlastic: EP - Epoxide, Epoxy0.43483710.4000000.329978
Subtotal4.181124100.00000003.172862
Substrate PrepregAluminum and its compoundsAluminum hydroxide oxide24623-77-61.46931529.3000001.114996
Inorganic Silicon compoundsFibrous-glass-wool65997-17-31.30382926.0000000.989416
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0852501.7000000.064693
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4112088.2000000.312047
Phenols - SpecificBisphenol A80-05-70.0501471.0000000.038054
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)0.98790119.7000000.749673
PolymersPlastic: EP - Epoxide, Epoxy0.70707714.1000000.536568
Subtotal5.014728100.00000003.805446
Total131.777676100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 RW612ET/A2IY
Product content declaration of RW612ET/A2IY
上次修订 Last Revision (GMT):
Friday, 08 March 2024, 04:56:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of RW612ET/A2IYLast Revision (GMT):
Friday, 08 March 2024, 04:56:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
9 Apr 2024
Test Report
9 Apr 2024
Test Report
9 Apr 2024
Test Report
9 Apr 2024
Die EncapsulantTest Report
21 Apr 2023
Test Report
21 Apr 2023
Test Report
21 Apr 2023
Test Report
21 Apr 2023
Epoxy AdhesiveTest Report
28 Sep 2023
Test Report
28 Sep 2023
Test Report
28 Sep 2023
Test Report
28 Sep 2023
Semiconductor DieTest Report
17 Jan 2024
Test Report
17 Jan 2024
Test Report
17 Jan 2024
Test Report
17 Jan 2024
Solder Ball - SAC, Lead FreeTest Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Substrate, Pre-plated NiAuAU PLATINGTest Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
CORE_PREPREGTest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
8 Feb 2023
Test Report
29 Dec 2023
CU FOIL 1Test Report
24 May 2023
Test Report
24 May 2023
Test Report
24 May 2023
Test Report
24 May 2023
CU FOIL 2Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
CU PLATINGTest Report
1 Apr 2024
Test Report
1 Apr 2024
Test Report
1 Apr 2024
Test Report
1 Apr 2024
NI PLATINGTest Report
7 Feb 2024
Test Report
7 Feb 2024
Test Report
7 Feb 2024
Test Report
7 Feb 2024
SOLDER MASKTest Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.