S32K314EHT1MMMST

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of S32K314EHT1MMMSTLast Revision (GMT):
Tuesday, 17 September 2024, 12:40:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
S32K314EHT1MMMSTSOT1547LFBGA257521.241426 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 322 095572023-11-2483 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.11973998.1000000.214821
Gold and its compoundsGold, metal7440-57-50.0011410.1000000.000219
Palladium and its compoundsPalladium, metal7440-05-30.0205461.8000000.003942
Subtotal1.141426100.00000000.218982
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins13.4800005.0000002.586134
Inorganic Silicon compoundsSilica, vitreous60676-86-0180.63200067.00000034.654191
Inorganic Silicon compoundsSilicon dioxide7631-86-967.40000025.00000012.930668
Inorganic compoundsCarbon Black1333-86-41.3480000.5000000.258613
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins6.7400002.5000001.293067
Subtotal269.600000100.000000051.722673
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.45000045.0000000.086332
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001000.0100000.000019
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0500005.0000000.009593
PolymersPlastic: EP - Epoxide, Epoxy0.49990049.9900000.095906
Subtotal1.000000100.00000000.191850
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-319.99200098.0000003.835459
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4080002.0000000.078275
Subtotal20.400000100.00000003.913734
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0028900.0032000.000554
Antimony and its compoundsAntimony, metal7440-36-00.0112880.0125000.002165
Arsenic and its compoundsArsenic, metal7440-38-20.0067720.0075000.001299
Bismuth and its compoundsBismuth, metal7440-69-90.0169760.0188000.003257
Cadmium and its compoundsCadmium, metal7440-43-90.0011740.0013000.000225
Copper and its compoundsCopper, metal7440-50-80.0056890.0063000.001091
Gold and its compoundsGold, metal7440-57-50.0056890.0063000.001091
Indium and its compoundsIndium, metal7440-74-60.0056890.0063000.001091
Inorganic compoundsSulfur7704-34-90.0009030.0010000.000173
Iron and its compoundsIron, metal7439-89-60.0112880.0125000.002165
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0282640.0313000.005422
Nickel and its compoundsNickel, metal7440-02-00.0028900.0032000.000554
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0056890.0063000.001091
Silver and its compoundsSilver, metal7440-22-43.1606813.5002000.606376
Tin and its compoundsTin, metal7440-31-587.03240496.38140016.697139
Zinc and its compoundsZinc, metal7440-66-60.0017160.0019000.000329
Subtotal90.300000100.000000017.324026
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-841.97278799.9800008.052466
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0083960.0200000.001611
Subtotal41.981183100.00000008.054076
Copper PlatingCopper and its compoundsCopper, metal7440-50-835.52721699.9800006.815885
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0071070.0200000.001363
Subtotal35.534323100.00000006.817248
Gold PlatingGold and its compoundsGold, metal7440-57-50.66620399.9900000.127811
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000670.0100000.000013
Subtotal0.666269100.00000000.127824
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0012780.0300000.000245
Nickel and its compoundsNickel, metal7440-02-04.26006599.9700000.817292
Subtotal4.261343100.00000000.817537
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0259570.1000000.004980
Barium and its compoundsBarium sulfate7727-43-77.55340329.1000001.449118
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1557400.6000000.029879
Magnesium and its compoundsTalc14807-96-60.7787013.0000000.149394
Organic compoundsOther organic compounds.0.9344423.6000000.179272
PolymersPlastic: EP - Epoxide, Epoxy5.06155919.5000000.971059
PolymersPlastic: PAK11.44691044.1000002.196086
Subtotal25.956713100.00000004.979787
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-314.18675646.6666002.721719
Inorganic Silicon compoundsSilica, vitreous60676-86-02.0266886.6667000.388819
PolymersPlastic: PI - Polyimide14.18675646.6667002.721725
Subtotal30.400169100.00000005.832263
Total521.241426100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 S32K314EHT1MMMST
Product content declaration of S32K314EHT1MMMST
上次修订 Last Revision (GMT):
Tuesday, 17 September 2024, 12:40:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of S32K314EHT1MMMSTLast Revision (GMT):
Tuesday, 17 September 2024, 12:40:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Solder Ball - Lead FreeTest Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
SubstrateAU PLATINGTest Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
AUS308Not AvailableNot AvailableNot AvailableNot Available
CU FOILTest Report
7 Dec 2023Test Report
7 Jan 2021
Test Report
7 Dec 2023Test Report
7 Jan 2021
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
29 Mar 2024
Test Report
29 Mar 2024
Test Report
29 Mar 2024
Test Report
29 Mar 2024
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.