S908QC16E0VDSE

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of S908QC16E0VDSELast Revision (GMT):
Thursday, 28 December 2023, 11:40:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
S908QC16E0VDSESOT360-2TSSOP2078.375608 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 144 845742023-11-2463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.39998899.9900000.510348
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000400.0100000.000051
Subtotal0.400028100.00000000.510399
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-835.05978597.29100044.733031
Iron and its compoundsIron, metal7439-89-60.8540532.3700001.089693
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0061260.0170000.007816
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0598200.1660000.076325
Tin and its compoundsTin, metal7440-31-50.0108110.0300000.013794
Zinc and its compoundsZinc, metal7440-66-60.0454050.1260000.057933
Subtotal36.036000100.000000045.978591
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000360.0100000.000046
Silver and its compoundsSilver, metal7440-22-40.36396499.9900000.464384
Subtotal0.364000100.00000000.464430
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins3.0780009.0000003.927242
Inorganic Silicon compoundsSilica, vitreous60676-86-028.72800084.00000036.654261
Inorganic compoundsCarbon Black1333-86-40.1710000.5000000.218180
Phenols and Phenolic ResinsPhenolic resin, Formaldehyde polymer with 1,1'-biphenyl and phenol628290-34-62.2230006.5000002.836342
Subtotal34.200000100.000000043.636025
Epoxy AdhesiveEpoxy AdhesiveAliphatic AminesDiaminopolypropylene glycol9046-10-00.0175001.7500000.022328
Copper and its compoundsCupric oxide1317-38-00.0175001.7500000.022328
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.0625006.2500000.079744
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0550005.5000000.070175
PolymersFatty acids, C18-unsatd., dimers, polymers with epichlorohydrin68475-94-50.0625006.2500000.079744
Silver and its compoundsSilver, metal7440-22-40.78500078.5000001.001587
Subtotal1.000000100.00000001.275907
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0005600.0200000.000714
Tin and its compoundsTin, metal7440-31-52.79944099.9800003.571826
Subtotal2.800000100.00000003.572540
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped3.50406898.0000004.470866
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0715122.0000000.091242
Subtotal3.575580100.00000004.562108
Total78.375608100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 S908QC16E0VDSE
Product content declaration of S908QC16E0VDSE
上次修订 Last Revision (GMT):
Thursday, 28 December 2023, 11:40:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of S908QC16E0VDSELast Revision (GMT):
Thursday, 28 December 2023, 11:40:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Test Report
5 Jun 2023
Copper Lead-FrameAG PLATINGTest Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
C194Test Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Test Report
14 Aug 2023
Die EncapsulantTest Report
7 Aug 2023
Test Report
7 Aug 2023
Test Report
7 Aug 2023
Test Report
7 Aug 2023
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Post-plating - Lead FreeTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.