S912XEG384J3VAA

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of S912XEG384J3VAALast Revision (GMT):
Tuesday, 07 November 2023, 12:50:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
S912XEG384J3VAASOT1103QFP80962.554496 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 140 555572020-09-1743 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-80.79519599.9948000.082613
Inorganic compoundsSulfur7704-34-90.0000080.0010000.000001
Iron and its compoundsIron, metal7439-89-60.0000080.0010000.000001
Manganese and its compoundsManganese, metal7439-96-50.0000080.0010000.000001
Nickel and its compoundsNickel, metal7440-02-00.0000080.0010000.000001
Silver and its compoundsSilver, metal7440-22-40.0000100.0012000.000001
Subtotal0.795236100.00000000.082617
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-8194.08095197.29100020.163113
Iron and its compoundsIron, metal7439-89-64.7277942.3700000.491172
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0339120.0170000.003523
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3311450.1660000.034403
Tin and its compoundsTin, metal7440-31-50.0598460.0300000.006217
Zinc and its compoundsZinc, metal7440-66-60.2513510.1260000.026113
Subtotal199.485000100.000000020.724541
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0002010.0100000.000021
Silver and its compoundsSilver, metal7440-22-42.01479899.9900000.209318
Subtotal2.015000100.00000000.209339
Die EncapsulantDie EncapsulantEpoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-629.0121004.3000003.014073
Inorganic Silicon compoundsSilica, vitreous60676-86-0616.67580091.40000064.066586
Organic Phosphorus compoundsOther organic phosphorous compounds1.1469900.1700000.119161
Phenols and Phenolic Resins1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol25917-04-81.8216900.2700000.189256
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-626.0434203.8600002.705657
Subtotal674.700000100.000000070.094733
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.18500015.0000000.123110
Epoxy ResinsProprietary Material-Other Epoxy resins0.3160004.0000000.032829
Silver and its compoundsSilver, metal7440-22-46.39900081.0000000.664794
Subtotal7.900000100.00000000.820733
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0014800.0200000.000154
Tin and its compoundsTin, metal7440-31-57.39852099.9800000.768634
Subtotal7.400000100.00000000.768788
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-368.85407598.0000007.153265
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.4051852.0000000.145985
Subtotal70.259260100.00000007.299250
Total962.554496100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 S912XEG384J3VAA
Product content declaration of S912XEG384J3VAA
上次修订 Last Revision (GMT):
Tuesday, 07 November 2023, 12:50:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of S912XEG384J3VAALast Revision (GMT):
Tuesday, 07 November 2023, 12:50:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Copper Lead-FrameAG PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
CDA 194Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
12 Apr 2023
Test Report
12 Apr 2023
Test Report
12 Apr 2023
Test Report
12 Apr 2023
Post-plating - Lead FreeTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.