S912XEQ512BCAG

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of S912XEQ512BCAGLast Revision (GMT):
Thursday, 09 November 2023, 10:27:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
S912XEQ512BCAGSOT486-2LQFP1443068.054043 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 246 145572020-06-1133 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - Cu 1Bonding Wire - CuCopper and its compoundsCopper, metal7440-50-81.49668697.0000000.048783
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0462893.0000000.001509
Subtotal1.542975100.00000000.050292
Bonding Wire - Cu 2Bonding Wire - CuCopper and its compoundsCopper, metal7440-50-81.43759399.9948000.046857
Inorganic compoundsSulfur7704-34-90.0000140.0010000.000000
Iron and its compoundsIron, metal7439-89-60.0000140.0010000.000000
Manganese and its compoundsManganese, metal7439-96-50.0000140.0010000.000000
Nickel and its compoundsNickel, metal7440-02-00.0000140.0010000.000000
Silver and its compoundsSilver, metal7440-22-40.0000170.0012000.000001
Subtotal1.437668100.00000000.046859
Copper Lead-Frame 1Copper AlloyCopper and its compoundsCopper, metal7440-50-8177.89952496.2000005.798448
Inorganic Silicon compoundsSilicon7440-21-31.2020240.6500000.039179
Magnesium and its compoundsMagnesium, metal7439-95-40.2773900.1500000.009041
Nickel and its compoundsNickel, metal7440-02-05.5478023.0000000.180825
Subtotal184.926740100.00000006.027493
Silver PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000870.0100000.000003
Silver and its compoundsSilver, metal7440-22-40.87317399.9900000.028460
Subtotal0.873260100.00000000.028463
Copper Lead-Frame 2Copper AlloyCopper and its compoundsCopper, metal7440-50-8178.95901197.2910005.832981
Iron and its compoundsIron, metal7439-89-64.3594252.3700000.142091
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0312700.0170000.001019
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3053440.1660000.009952
Tin and its compoundsTin, metal7440-31-50.0551830.0300000.001799
Zinc and its compoundsZinc, metal7440-66-60.2317670.1260000.007554
Subtotal183.942000100.00000005.995396
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001860.0100000.000006
Silver and its compoundsSilver, metal7440-22-41.85781499.9900000.060554
Subtotal1.858000100.00000000.060560
Die Encapsulant 1Die EncapsulantAluminum and its compoundsAluminum, metal7429-90-53.1895070.3005000.103959
Epoxy ResinsEpoxy resin, EPON Resin 809125928-94-39.5674600.9014000.311841
Inorganic Silicon compoundsSilica, vitreous60676-86-0933.82715087.98070030.437115
Inorganic compoundsCarbon Black1333-86-45.3154910.5008000.173253
Magnesium and its compoundsMagnesium, metal7439-95-48.5049980.8013000.277211
Organic Silicon compoundsSilicone modified epoxy resin218163-11-254.2184355.1082001.767193
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins46.7769594.4071001.524646
Subtotal1061.400000100.000000034.595219
Die Encapsulant 2Die EncapsulantEpoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-646.7016004.4000001.522190
Inorganic Silicon compoundsSilica, vitreous60676-86-0969.05820091.30000031.585435
Organic Phosphorus compoundsOther organic phosphorous compounds1.0614000.1000000.034595
Phenols and Phenolic Resins1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol25917-04-83.1842000.3000000.103786
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-641.3946003.9000001.349214
Subtotal1061.400000100.000000034.595219
Epoxy Adhesive 1Epoxy AdhesivePolymersPlastic: ABAK - Acrylonitrile-butadiene-acrylate1.91268015.1800000.062342
PolymersPlastic: EP - Epoxide, Epoxy0.8769606.9600000.028584
Silver and its compoundsSilver, metal7440-22-49.81036077.8600000.319758
Subtotal12.600000100.00000000.410684
Epoxy Adhesive 2Epoxy AdhesiveCopper and its compoundsCupric oxide1317-38-00.3150002.5000000.010267
Inorganic Silicon compoundsSilicon dioxide, syntetic112945-52-50.0025200.0200000.000082
PolymersPlastic: EP - Epoxide, Epoxy2.58048020.4800000.084108
Silver and its compoundsSilver, metal7440-22-49.70200077.0000000.316227
Subtotal12.600000100.00000000.410684
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0026400.0200000.000086
Tin and its compoundsTin, metal7440-31-513.19736099.9800000.430154
Subtotal13.200000100.00000000.430240
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-368.85407598.0000002.244226
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.4051852.0000000.045801
Subtotal70.259260100.00000002.290027
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped37.24000098.0000001.213799
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7600002.0000000.024771
Subtotal38.000000100.00000001.238570
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon, doped34.59400098.0000001.127555
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7060002.0000000.023011
Subtotal35.300000100.00000001.150566
Semiconductor Die 4Semiconductor DieInorganic Silicon compoundsSilicon, doped58.01938198.0000001.891081
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1840692.0000000.038594
Subtotal59.203450100.00000001.929674
Semiconductor Die 5Semiconductor DieInorganic Silicon compoundsSilicon7440-21-3126.12600098.0000004.110944
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.5740002.0000000.083897
Subtotal128.700000100.00000004.194841
Semiconductor Die 6Semiconductor DieInorganic Silicon compoundsSilicon, doped126.12600098.0000004.110944
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.5740002.0000000.083897
Subtotal128.700000100.00000004.194841
Semiconductor Die 7Semiconductor DieInorganic Silicon compoundsSilicon7440-21-370.66847698.0000002.303365
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.4422142.0000000.047007
Subtotal72.110690100.00000002.350372
Total3068.054043100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 S912XEQ512BCAG
Product content declaration of S912XEQ512BCAG
上次修订 Last Revision (GMT):
Thursday, 09 November 2023, 10:27:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu 1
焊丝-铜
Bonding Wire - Cu
OOOOOO
焊丝-铜
Bonding Wire - Cu 2
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架
Copper Lead-Frame 1
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
铜引线框架
Copper Lead-Frame 2
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 5
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 6
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 7
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of S912XEQ512BCAGLast Revision (GMT):
Thursday, 09 November 2023, 10:27:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - Cu 1Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Bonding Wire - Cu 2Test Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Copper Lead-Frame 1AG PLATINGTest Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
C7025Test Report
14 Feb 2023
Test Report
14 Feb 2023
Test Report
14 Feb 2023
Test Report
14 Feb 2023
Copper Lead-Frame 2AG PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
CDA 194Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Die Encapsulant 1Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Die Encapsulant 2Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy Adhesive 1Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Epoxy Adhesive 2Test Report
16 Dec 2022
Test Report
16 Dec 2022
Test Report
16 Dec 2022
Test Report
16 Dec 2022
Post-plating - Lead FreeTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor Die 1Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Semiconductor Die 2Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 3Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 4Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 5Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Semiconductor Die 6Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 7Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.