S9KEAZN64AMLHR

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of S9KEAZN64AMLHRLast Revision (GMT):
Monday, 03 June 2024, 02:20:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
S9KEAZN64AMLHRSOT1699-1LQFP64320.951253 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 183 035282023-11-2463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-84.21329096.5500001.312751
Gold and its compoundsGold, metal7440-57-50.1352793.1000000.042149
Palladium and its compoundsPalladium, metal7440-05-30.0152740.3500000.004759
Subtotal4.363843100.00000001.359659
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-854.93020797.29100017.114813
Iron and its compoundsIron, metal7439-89-61.3380952.3700000.416915
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0095980.0170000.002991
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0937230.1660000.029202
Tin and its compoundsTin, metal7440-31-50.0169380.0300000.005277
Zinc and its compoundsZinc, metal7440-66-60.0711390.1260000.022165
Subtotal56.459700100.000000017.591363
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000570.0100000.000018
Silver and its compoundsSilver, metal7440-22-40.57024399.9900000.177673
Subtotal0.570300100.00000000.177691
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins17.2109007.0000005.362465
Inorganic Silicon compoundsSilica, vitreous60676-86-0201.49046581.95000062.779149
Inorganic Silicon compoundsSilicon dioxide7631-86-919.6696008.0000006.128532
Inorganic compoundsCarbon Black1333-86-41.3522850.5500000.421337
Phenols and Phenolic ResinsOther phenolic resins6.1467502.5000001.915166
Subtotal245.870000100.000000076.606649
Epoxy AdhesiveEpoxy AdhesiveAcrylates2-propenoic acid, (1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediyl) ester24447-78-70.0833007.0000000.025954
AcrylatesDicyclopentenyloxyethyl acrylate65983-31-50.0535504.5000000.016685
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.0238002.0000000.007416
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.0130901.1000000.004078
Organic compoundsOther Organic Peroxides0.0035700.3000000.001112
Polymers1,3-Butadiene, homopolymer, epoxidized, cyclized68441-49-60.0476004.0000000.014831
PolymersPoly(acrylonitrile-co-butadiene-co-acrylic acid), dicarboxy terminated68891-50-90.0130901.1000000.004078
Silver and its compoundsSilver, metal7440-22-40.95200080.0000000.296618
Subtotal1.190000100.00000000.370773
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0009280.0200000.000289
Tin and its compoundsTin, metal7440-31-54.63907299.9800001.445413
Subtotal4.640000100.00000001.445702
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped7.70026298.0000002.399200
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1571482.0000000.048963
Subtotal7.857410100.00000002.448163
Total320.951253100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 S9KEAZN64AMLHR
Product content declaration of S9KEAZN64AMLHR
上次修订 Last Revision (GMT):
Monday, 03 June 2024, 02:20:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of S9KEAZN64AMLHRLast Revision (GMT):
Monday, 03 June 2024, 02:20:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuNot AvailableNot AvailableNot AvailableNot Available
Copper Lead-FrameAG PLATINGNot AvailableNot AvailableNot AvailableNot Available
C7025Not AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
19 Jul 2023
Test Report
19 Jul 2023
Test Report
19 Jul 2023
Test Report
19 Jul 2023
Epoxy AdhesiveTest Report
12 Jul 2023
Test Report
12 Jul 2023
Test Report
12 Jul 2023
Test Report
12 Jul 2023
Post-plating - Lead FreeTest Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Semiconductor DieTest Report
30 May 2024
Test Report
30 May 2024
Test Report
30 May 2024
Test Report
15 Apr 2020Test Report
30 May 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.