SAC57D54HCVMOR

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of SAC57D54HCVMORLast Revision (GMT):
Saturday, 21 January 2023, 01:38:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SAC57D54HCVMORSOT1527-1BGA5162908.274419 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 132 695182020-06-1093 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-82.94341198.1000000.101208
Gold and its compoundsGold, metal7440-57-50.0030000.1000000.000103
Palladium and its compoundsPalladium, metal7440-05-30.0540071.8000000.001857
Subtotal3.000419100.00000000.103168
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins46.2450005.0000001.590118
Inorganic Silicon compoundsSilica, vitreous60676-86-0619.68300067.00000021.307583
Inorganic Silicon compoundsSilicon dioxide7631-86-9231.22500025.0000007.950591
Inorganic compoundsCarbon Black1333-86-44.6245000.5000000.159012
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins23.1225002.5000000.795059
Subtotal924.900000100.000000031.802363
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-94.27500045.0000000.146994
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0009500.0100000.000033
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.4750005.0000000.016333
PolymersPlastic: EP - Epoxide, Epoxy4.74905049.9900000.163294
Subtotal9.500000100.00000000.326654
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-346.84400098.0000001.610715
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9560002.0000000.032872
Subtotal47.800000100.00000001.643586
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-415.1505903.5000000.520948
Tin and its compoundsTin, metal7440-31-5417.72341096.50000014.363274
Subtotal432.874000100.000000014.884221
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8532.99123699.99000018.326718
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0533040.0100000.001833
Subtotal533.044540100.000000018.328550
Copper PlatingCopper and its compoundsCopper, metal7440-50-8589.85218699.98000020.281861
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1179940.0200000.004057
Subtotal589.970180100.000000020.285919
Gold PlatingGold and its compoundsGold, metal7440-57-51.93706699.9900000.066605
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001940.0100000.000007
Subtotal1.937260100.00000000.066612
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0038000.0300000.000131
Nickel and its compoundsNickel, metal7440-02-012.66290099.9700000.435409
Subtotal12.666700100.00000000.435540
Solder MaskBarium and its compoundsBarium sulfate7727-43-723.33027329.1000000.802203
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4810370.6000000.016540
Magnesium and its compoundsTalc14807-96-62.4051833.0000000.082701
Organic compoundsOther organic compounds.2.8862193.6000000.099242
PolymersPlastic: EP - Epoxide, Epoxy15.71386119.6000000.540316
PolymersPlastic: PAK35.35618744.1000001.215710
Subtotal80.172760100.00000002.756712
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-341.65903346.6700001.432431
Inorganic Silicon compoundsSilica, vitreous60676-86-05.9449156.6600000.204414
PolymersPlastic: PI - Polyimide41.65903346.6700001.432431
Subtotal89.262980100.00000003.069276
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-367.76386537.0000002.330037
Inorganic Silicon compoundsSilica, vitreous60676-86-029.30329316.0000001.007583
PolymersPlastic: PI - Polyimide86.07842347.0000002.959776
Subtotal183.145580100.00000006.297397
Total2908.274419100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SAC57D54HCVMOR
Product content declaration of SAC57D54HCVMOR
上次修订 Last Revision (GMT):
Saturday, 21 January 2023, 01:38:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SAC57D54HCVMORLast Revision (GMT):
Saturday, 21 January 2023, 01:38:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Die EncapsulantTest Report
14 Mar 2022
Test Report
14 Mar 2022
Test Report
14 Mar 2022
Test Report
14 Mar 2022
Epoxy AdhesiveTest Report
29 Jun 2022
Test Report
29 Jun 2022
Test Report
29 Jun 2022
Test Report
29 Jun 2022
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - Lead FreeTest Report
28 Sep 2022
Test Report
28 Sep 2022
Test Report
28 Sep 2022
Test Report
28 Sep 2022
Substrate, Pre-plated NiAuAUS 703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
PHP-900 IR-6Test Report
17 Feb 2022
Test Report
19 Aug 2021
Test Report
18 Jun 2021
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.