SC16C852SVIET,115

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SC16C852SVIET,115Last Revision (GMT):
Thursday, 24 August 2023, 09:07:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SC16C852SVIET,115SOT912TFBGA3627.631860 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 864 511152023-09-0461 / Unlimited26030 sec.NA / Not Available24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000010.0020000.000000
Gold and its compoundsGold, metal7440-57-50.00183798.8400000.006653
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0080000.000000
Palladium and its compoundsPalladium, metal7440-05-30.0000211.1500000.000077
Subtotal0.001860100.00000000.006731
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.54500010.3000005.591372
Inorganic Silicon compoundsOther silica compounds13.45500089.70000048.693790
Subtotal15.000000100.000000054.285162
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.04000010.0000000.144760
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0080002.0000000.028952
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.04000010.0000000.144760
Silver and its compoundsSilver, metal7440-22-40.31200078.0000001.129131
Subtotal0.400000100.00000001.447604
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-32.18540098.0000007.908986
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0446002.0000000.161408
Subtotal2.230000100.00000008.070394
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0185000.5000000.066952
Silver and its compoundsSilver, metal7440-22-40.0370001.0000000.133903
Tin and its compoundsTin, metal7440-31-53.64450098.50000013.189485
Subtotal3.700000100.000000013.390340
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-20.5676309.0100002.054259
Arsenic and its compoundsArsenic, metal7440-38-20.0006300.0100000.002280
Barium and its compoundsBarium sulfate7727-43-70.0485100.7700000.175558
Copper and its compoundsCopper phthalocyanine147-14-80.0006300.0100000.002280
Copper and its compoundsCopper, metal7440-50-81.70226027.0200006.160497
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.6281109.9700002.273137
Glycol Ethers and Acetates - SpecificEthanol, 2-(2-methoxyethoxy)-, acetate629-38-90.0006300.0100000.002280
Gold and its compoundsGold, metal7440-57-50.0119700.1900000.043320
Inorganic Silicon compoundsFibrous-glass-wool65997-17-31.70226027.0200006.160497
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0245700.3900000.088919
Magnesium and its compoundsTalc14807-96-60.0245700.3900000.088919
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0844201.3400000.305517
Nickel and its compoundsNickel, metal7440-02-00.0554400.8800000.200638
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.6281109.9700002.273137
Organic compounds1,3,5-Triazine290-87-90.6281109.9700002.273137
Organic compounds3-Methoxy-3-methylbutyl acetate103429-90-90.0535500.8500000.193798
Organic compoundsDipropylene glycol monomethyl ether34590-94-80.0340200.5400000.123119
Organic compoundsHeavy aliphatic petroleum solvent64742-94-50.0088200.1400000.031920
PolymersOther acrylic resins0.0957601.5200000.346556
Subtotal6.300000100.000000022.799768
Total27.631860100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SC16C852SVIET,115
Product content declaration of SC16C852SVIET,115
上次修订 Last Revision (GMT):
Thursday, 24 August 2023, 09:07:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SC16C852SVIET,115Last Revision (GMT):
Thursday, 24 August 2023, 09:07:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Semiconductor DieTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Solder Ball - SAC, Lead FreeTest Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
SubstrateAUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
7 Oct 2023
Test Report
7 Oct 2023
COPPERTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
HL832NXATest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
11 Mar 2022
Test Report
29 Dec 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.