SC511658MZP40R2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SC511658MZP40R2Last Revision (GMT):
Tuesday, 27 February 2024, 02:33:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SC511658MZP40R2SOT698-2BGA2722700.314443 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 212 245182023-11-246Not ApplicableNot ApplicableNot Applicable3 / 168 hours23530 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Solder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-121.79501736.0000000.807129
Silver and its compoundsSilver, metal7440-22-41.2108342.0000000.044840
Tin and its compoundsTin, metal7440-31-537.53586362.0000001.390055
Subtotal60.541715100.00000002.242025
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-516.69805899.9900000.618375
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0016700.0100000.000062
Subtotal16.699728100.00000000.618436
Die EncapsulantDie EncapsulantAntimony OxidesAntimony(III) oxide1309-64-46.9139040.6010000.256041
Brominated Flame Retardants (excluding banned groups)Bromophenol, formaldehyde, epichlorohydrin polymer68541-56-010.3697060.9014000.384018
Epoxy Resins2,5-Di-tert-butyl-1,4-phenylenebis(oxymethyloxirane)64777-22-634.5672193.0048001.280118
Epoxy ResinsBenzaldehyde, 2-hydroxy-, polymer with (chloromethyl)oxirane and phenol120206-26-023.0448132.0032000.853412
Inorganic Silicon compoundsSilica, vitreous60676-86-01012.13112387.98080037.481973
Inorganic compoundsCarbon Black1333-86-45.7612030.5008000.213353
Organic Silicon compoundsOther siloxanes and silicones17.2836101.5024000.640059
Phenols and Phenolic ResinsOther phenolic resins40.3284223.5056001.493471
Subtotal1150.400000100.000000042.602446
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-53.24000012.0000000.119986
Epoxy ResinsProprietary Material-Other Epoxy resins1.8900007.0000000.069992
Silver and its compoundsSilver, metal7440-22-421.87000081.0000000.809906
Subtotal27.000000100.00000000.999884
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped88.20000098.0000003.266286
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.8000002.0000000.066659
Subtotal90.000000100.00000003.332945
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0055580.0010000.000206
Antimony and its compoundsAntimony, metal7440-36-00.0055580.0010000.000206
Arsenic and its compoundsArsenic, metal7440-38-20.0111160.0020000.000412
Bismuth and its compoundsBismuth, metal7440-69-90.0061140.0011000.000226
Copper and its compoundsCopper, metal7440-50-80.0055580.0010000.000206
Iron and its compoundsIron, metal7439-89-60.0094480.0017000.000350
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1200.08661736.0015007.409752
Nickel and its compoundsNickel, metal7440-02-00.0205640.0037000.000762
Silver and its compoundsSilver, metal7440-22-411.0698871.9918000.409948
Tin and its compoundsTin, metal7440-31-5344.54702561.99420012.759515
Zinc and its compoundsZinc, metal7440-66-60.0055580.0010000.000206
Subtotal555.773000100.000000020.581788
Substrate, Pre-plated NiAuCopper PlatingCopper and its compoundsCopper, metal7440-50-8135.65264199.0000005.023587
Nickel and its compoundsNickel, metal7440-02-01.3702291.0000000.050743
Subtotal137.022870100.00000005.074330
Gold PlatingGold and its compoundsGold, metal7440-57-51.43953299.9800000.053310
Nickel and its compoundsNickel, metal7440-02-00.0002880.0200000.000011
Subtotal1.439820100.00000000.053320
Nickel PlatingInorganic compoundsSodium7440-23-50.0855891.0000000.003170
Nickel and its compoundsNickel, metal7440-02-08.47334199.0000000.313791
Subtotal8.558930100.00000000.316960
Solder MaskBarium and its compoundsBarium sulfate7727-43-734.86677734.2411001.291212
Inorganic Silicon compoundsSilicon dioxide7631-86-91.6092781.5804000.059596
Non-Halogenated Organic Compounds - Specific2-Methyl-4'-(methylthio)-2-morpholino propiophenone71868-10-50.1120100.1100000.004148
Organic compoundsOther organic compounds.3.7335993.6666000.138265
PolymersPlastic: EP - Epoxide, Epoxy16.45610116.1608000.609414
PolymersPlastic: PAK45.04950444.2411001.668306
Subtotal101.827270100.00000003.770941
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-6119.20493721.8000004.414484
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3244.97161544.8000009.071966
Inorganic Silicon compoundsSilicon dioxide7631-86-96.5617401.2000000.242999
Miscellaneous substancesOther miscellaneous substances (less than 10%).34.9959456.4000001.295995
Phenols - SpecificBisphenol A80-05-75.4681161.0000000.202499
PolymersBT Resin (CAS# 13676-54-5/25722-66-1) [Brominated Compound]78.74087614.4000002.915989
PolymersPlastic: EP - Epoxide, Epoxy56.86841110.4000002.105992
Subtotal546.811640100.000000020.249925
Via PluggingPhenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-61.79753542.4000000.066568
PolymersPlastic: EP - Epoxide, Epoxy2.44193557.6000000.090431
Subtotal4.239470100.00000000.156999
Total2700.314443100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SC511658MZP40R2
Product content declaration of SC511658MZP40R2
上次修订 Last Revision (GMT):
Tuesday, 27 February 2024, 02:33:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)

焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

有机基质通道堵塞
Via Plugging
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SC511658MZP40R2Last Revision (GMT):
Tuesday, 27 February 2024, 02:33:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Die EncapsulantTest Report
3 Mar 2021
Test Report
3 Mar 2021
Test Report
10 Mar 2020
Test Report
10 Mar 2020
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuCOPPER FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
HL832Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.