SJA1110CEL/0Y

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SJA1110CEL/0YLast Revision (GMT):
Tuesday, 12 July 2022, 11:34:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SJA1110CEL/0YSOT1020LFBGA256531.029710 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 756 665182023-11-25173 / 168 hours26030 sec.NA / Not Available24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.43393696.9000000.270029
Palladium and its compoundsPalladium, metal7440-05-30.0458743.1000000.008639
Subtotal1.479810100.00000000.278668
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins14.3330885.3184002.699112
Inorganic Silicon compoundsSilica, vitreous60676-86-0236.57707187.78370044.550628
Inorganic compoundsCarbon Black1333-86-47.0048442.5992001.319106
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins11.5849974.2987002.181610
Subtotal269.500000100.000000050.750456
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.29000010.0000000.054611
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0580002.0000000.010922
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.29000010.0000000.054611
Silver and its compoundsSilver, metal7440-22-42.26200078.0000000.425965
Subtotal2.900000100.00000000.546109
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-319.55090298.0000003.681697
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3989982.0000000.075137
Subtotal19.949900100.00000003.756833
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0009020.0010000.000170
Antimony and its compoundsAntimony, metal7440-36-00.0451000.0500000.008493
Arsenic and its compoundsArsenic, metal7440-38-20.0270600.0300000.005096
Bismuth and its compoundsBismuth, metal7440-69-90.0902000.1000000.016986
Cadmium and its compoundsCadmium, metal7440-43-90.0018040.0020000.000340
Copper and its compoundsCopper, metal7440-50-80.4510000.5000000.084929
Germanium and its compoundsGermanium7440-56-40.0090200.0100000.001699
Indium and its compoundsIndium, metal7440-74-60.0090200.0100000.001699
Inorganic compoundsSulfur7704-34-90.0009020.0010000.000170
Iron and its compoundsIron, metal7439-89-60.0180400.0200000.003397
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0451000.0500000.008493
Nickel and its compoundsNickel, metal7440-02-00.0451000.0500000.008493
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0009020.0010000.000170
Silver and its compoundsSilver, metal7440-22-42.7060003.0000000.509576
Tin and its compoundsTin, metal7440-31-586.74894896.17400016.335988
Zinc and its compoundsZinc, metal7440-66-60.0009020.0010000.000170
Subtotal90.200000100.000000016.985867
Substrate, Pre-plated NiAuCopper Foil 1Chromium and Chromium III compoundsChromium, metal7440-47-30.0009730.0100000.000183
Copper and its compoundsCopper, metal7440-50-89.72653499.9500001.831637
Zinc and its compoundsZinc, metal7440-66-60.0038930.0400000.000733
Subtotal9.731400100.00000001.832553
Copper Foil 2Chromium and Chromium III compoundsChromium, metal7440-47-30.0054530.0100000.001027
Copper and its compoundsCopper, metal7440-50-854.50342599.95000010.263724
Zinc and its compoundsZinc, metal7440-66-60.0218120.0400000.004108
Subtotal54.530691100.000000010.268859
Copper PlatingCopper and its compoundsCopper, metal7440-50-819.46776199.9500003.666040
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0097390.0500000.001834
Subtotal19.477500100.00000003.667874
Gold PlatingGold and its compoundsGold, metal7440-57-50.23517799.9900000.044287
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000230.0100000.000004
Subtotal0.235200100.00000000.044291
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0035870.2000000.000675
Nickel and its compoundsNickel, metal7440-02-01.78981399.8000000.337046
Subtotal1.793400100.00000000.337721
Solder MaskBarium and its compoundsBarium sulfate7727-43-73.47349229.1000000.654105
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0716180.6000000.013487
Magnesium and its compoundsTalc14807-96-60.3580923.0000000.067433
Organic compoundsOther organic compounds.0.4297103.6000000.080920
PolymersPlastic: EP - Epoxide, Epoxy2.33953419.6000000.440566
PolymersPlastic: PAK5.26395244.1000000.991273
Subtotal11.936400100.00000002.247784
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-64.81788921.8000000.907273
Inorganic Silicon compoundsFibrous-glass-wool65997-17-39.90098344.8000001.864488
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2652051.2000000.049942
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.4144266.4000000.266355
Phenols - SpecificBisphenol A80-05-70.2210041.0000000.041618
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)3.18245914.4000000.599300
PolymersPlastic: EP - Epoxide, Epoxy2.29844310.4000000.432827
Subtotal22.100409100.00000004.161803
Substrate PrepregAluminum and its compoundsAluminum hydroxide oxide24623-77-67.96813529.3000001.500506
Inorganic Silicon compoundsFibrous-glass-wool65997-17-37.07070026.0000001.331507
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4623151.7000000.087060
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.2299908.2000000.419937
Phenols - SpecificBisphenol A80-05-70.2719501.0000000.051212
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)5.35741519.7000001.008873
PolymersPlastic: EP - Epoxide, Epoxy3.83449514.1000000.722087
Subtotal27.195000100.00000005.121182
Total531.029710100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SJA1110CEL/0Y
Product content declaration of SJA1110CEL/0Y
上次修订 Last Revision (GMT):
Tuesday, 12 July 2022, 11:34:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SJA1110CEL/0YLast Revision (GMT):
Tuesday, 12 July 2022, 11:34:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Substrate, Pre-plated NiAuAU PLATINGTest Report
5 May 2023
Test Report
5 May 2023
Test Report
5 May 2023
Test Report
5 May 2023
AUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
26 Aug 2022
Not Available
CU FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Not AvailableNot Available
CU PLATINGTest Report
5 May 2023
Test Report
5 May 2023
Test Report
7 May 2021Test Report
5 May 2023
Test Report
5 May 2023
HL832NXATest Report
29 Dec 2023
Test Report
29 Dec 2023
Not AvailableNot Available
NI PLATINGTest Report
5 May 2023
Test Report
5 May 2023
Test Report
6 May 2022Test Report
5 May 2023
Test Report
6 May 2022Test Report
5 May 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.