SPC5123YVY400B

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of SPC5123YVY400BLast Revision (GMT):
Sunday, 16 October 2022, 08:30:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5123YVY400BSOT1665-1HBGA5165502.022742 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 189 445572020-10-1533 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-529.14582799.9900000.529729
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0029150.0100000.000053
Subtotal29.148742100.00000000.529782
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins145.1120008.0000002.637430
Inorganic Silicon compoundsSilica, vitreous60676-86-01215.31300067.00000022.088476
Inorganic Silicon compoundsSilicon dioxide7631-86-9371.84950020.5000006.758414
Inorganic compoundsCarbon Black1333-86-49.0695000.5000000.164839
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins72.5560004.0000001.318715
Subtotal1813.900000100.000000032.967875
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.20000012.0000000.021810
Epoxy ResinsProprietary Material-Other Epoxy resins0.7000007.0000000.012723
Silver and its compoundsSilver, metal7440-22-48.10000081.0000000.147219
Subtotal10.000000100.00000000.181751
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-81083.93066096.97000019.700585
Copper and its compoundsCupric oxide1317-38-01.1178000.1000000.020316
Inorganic compoundsCarbon Black1333-86-43.9123000.3500000.071107
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3353400.0300000.006095
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-328.5039002.5500000.518062
Subtotal1117.800000100.000000020.316165
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-339.20000098.0000000.712465
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8000002.0000000.014540
Subtotal40.000000100.00000000.727005
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-415.1505903.5000000.275364
Tin and its compoundsTin, metal7440-31-5417.72341096.5000007.592179
Subtotal432.874000100.00000007.867543
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8510.81897399.9900009.284203
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0510870.0100000.000928
Subtotal510.870060100.00000009.285132
Copper PlatingCopper and its compoundsCopper, metal7440-50-8810.39642899.98000014.729064
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1621120.0200000.002946
Subtotal810.558540100.000000014.732010
Gold PlatingGold and its compoundsGold, metal7440-57-52.67552299.9900000.048628
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002680.0100000.000005
Subtotal2.675790100.00000000.048633
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0051870.0300000.000094
Nickel and its compoundsNickel, metal7440-02-017.28453399.9700000.314149
Subtotal17.289720100.00000000.314243
Solder MaskBarium and its compoundsBarium sulfate7727-43-736.05771129.1000000.655354
Inorganic Silicon compoundsSilicon dioxide7631-86-90.7434580.6000000.013512
Magnesium and its compoundsTalc14807-96-63.7172903.0000000.067562
Organic compoundsOther organic compounds.4.4607483.6000000.081075
PolymersPlastic: EP - Epoxide, Epoxy24.28629319.6000000.441407
PolymersPlastic: PAK54.64416044.1000000.993165
Subtotal123.909660100.00000002.252074
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3163.98117947.6200002.980380
Inorganic Silicon compoundsSilica, vitreous60676-86-016.3912314.7600000.297913
PolymersPlastic: PI - Polyimide163.98118047.6200002.980380
Subtotal344.353590100.00000006.258673
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-379.56564532.0000001.446116
Inorganic Silicon compoundsSilica, vitreous60676-86-014.9185586.0000000.271147
PolymersPlastic: PI - Polyimide154.15843762.0000002.801850
Subtotal248.642640100.00000004.519113
Total5502.022742100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5123YVY400B
Product content declaration of SPC5123YVY400B
上次修订 Last Revision (GMT):
Sunday, 16 October 2022, 08:30:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5123YVY400BLast Revision (GMT):
Sunday, 16 October 2022, 08:30:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Die EncapsulantTest Report
14 Mar 2022
Test Report
14 Mar 2022
Test Report
14 Mar 2022
Test Report
14 Mar 2022
Epoxy AdhesiveTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Heat SpreaderTest Report
8 Jul 2021
Test Report
8 Jul 2021
Test Report
8 Jul 2021
Test Report
8 Jul 2021
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - Lead FreeTest Report
19 Oct 2021
Test Report
19 Oct 2021
Test Report
19 Oct 2021
Test Report
19 Oct 2021
Substrate, Pre-plated NiAuAUTest Report
30 Jan 2019
Test Report
30 Jan 2019
Test Report
30 Jan 2019
Test Report
30 Jan 2019
AUS 308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
18 Oct 2021
Test Report
18 Oct 2021
COPPERTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
CU PLATINGTest Report
13 Feb 2018
Test Report
13 Feb 2018
Test Report
13 Feb 2018
Test Report
13 Feb 2018
E679FGBTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
NI PLATINGTest Report
13 Jan 2021
Test Report
13 Jan 2021
Test Report
13 Jan 2021
Test Report
13 Jan 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.