SPC5533MVF80R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5533MVF80RLast Revision (GMT):
Friday, 30 July 2021, 06:43:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5533MVF80RSOT1513-1BGA208871.352847 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 098 425182020-07-254Not ApplicableNot ApplicableNot Applicable3 / 168 hours24030 sec.3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-54.99857799.9900000.573657
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0005000.0100000.000057
Subtotal4.999077100.00000000.573715
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-514.7801683.0895001.696232
Arsenic and its compoundsArsenic, metal7440-38-20.0047840.0010000.000549
Cadmium and its compoundsCadmium, metal7440-43-90.0047840.0010000.000549
Epoxy ResinsProprietary Material-Other Epoxy resins14.7801683.0895001.696232
Inorganic Silicon compoundsSilica, vitreous60676-86-0418.77174687.53590048.059950
Inorganic compoundsCarbon Black1333-86-41.4782560.3090000.169651
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0047840.0010000.000549
Organic Phosphorus compoundsOther organic phosphorous compounds1.4782560.3090000.169651
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins27.0970545.6641003.109768
Subtotal478.400000100.000000054.903131
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.21500045.0000000.139438
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0002700.0100000.000031
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1350005.0000000.015493
PolymersPlastic: EP - Epoxide, Epoxy1.34973049.9900000.154900
Subtotal2.700000100.00000000.309863
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped45.54233598.0000005.226624
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9294352.0000000.106666
Subtotal46.471770100.00000005.333290
Solder Ball - Low LeadSolder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-174.69352036.0000008.572132
Silver and its compoundsSilver, metal7440-22-44.1496402.0000000.476230
Tin and its compoundsTin, metal7440-31-5128.63884062.00000014.763117
Subtotal207.482000100.000000023.811479
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAromatic hydrocarbon compoundsProprietary Material-Other Aromatic carbonyl compounds0.8438650.6427000.096845
Barium and its compoundsBarium sulfate7727-43-75.2284973.9821000.600044
Copper and its compoundsCopper, metal7440-50-855.22950742.0636006.338363
Epoxy ResinsOther Epoxy resins26.57236320.2379003.049552
Epoxy ResinsProprietary Material-Other Epoxy resins7.1477095.4438000.820300
Gold and its compoundsGold, metal7440-57-50.1025450.0781000.011768
Inorganic Silicon compoundsQuartz14808-60-734.61356926.3622003.972394
Nickel and its compoundsNickel, metal7440-02-01.5619451.1896000.179255
Subtotal131.300000100.000000015.068522
Total871.352847100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5533MVF80R
Product content declaration of SPC5533MVF80R
上次修订 Last Revision (GMT):
Friday, 30 July 2021, 06:43:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5533MVF80RLast Revision (GMT):
Friday, 30 July 2021, 06:43:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Die EncapsulantTest Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Epoxy AdhesiveTest Report
8 Sep 2020
Test Report
8 Sep 2020
Test Report
8 Sep 2020
Not Available
Semiconductor DieTest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Solder Ball - Low LeadTest Report
28 Feb 2019
Test Report
28 Feb 2019
Test Report
28 Feb 2019
Test Report
5 Sep 2018
Substrate, Pre-plated NiAuAUS308Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
E679FG SERIESTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
22 Jan 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.