SPC5533MVM80R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5533MVM80RLast Revision (GMT):
Wednesday, 27 July 2022, 07:58:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5533MVM80RSOT1513-1BGA208799.735386 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 098 435182021-11-153 / 168 hours24030 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-81.46805597.6350000.183568
Gold and its compoundsGold, metal7440-57-50.0025500.1696000.000319
Palladium and its compoundsPalladium, metal7440-05-30.0330102.1954000.004128
Subtotal1.503616100.00000000.188014
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-514.7801683.0895001.848132
Arsenic and its compoundsArsenic, metal7440-38-20.0047840.0010000.000598
Cadmium and its compoundsCadmium, metal7440-43-90.0047840.0010000.000598
Epoxy ResinsProprietary Material-Other Epoxy resins14.7801683.0895001.848132
Inorganic Silicon compoundsSilica, vitreous60676-86-0418.77174687.53590052.363788
Inorganic compoundsCarbon Black1333-86-41.4782560.3090000.184843
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0047840.0010000.000598
Organic Phosphorus compoundsOther organic phosphorous compounds1.4782560.3090000.184843
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins27.0970545.6641003.388253
Subtotal478.400000100.000000059.819786
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.21500045.0000000.151925
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0002700.0100000.000034
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1350005.0000000.016881
PolymersPlastic: EP - Epoxide, Epoxy1.34973049.9900000.168772
Subtotal2.700000100.00000000.337612
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped45.54233598.0000005.694675
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9294352.0000000.116218
Subtotal46.471770100.00000005.810893
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0017510.0010000.000219
Arsenic and its compoundsArsenic, metal7440-38-20.0017510.0010000.000219
Bismuth and its compoundsBismuth, metal7440-69-90.0017510.0010000.000219
Copper and its compoundsCopper, metal7440-50-81.2254200.7000000.153228
Iron and its compoundsIron, metal7439-89-60.0031510.0018000.000394
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0098030.0056000.001226
Silver and its compoundsSilver, metal7440-22-46.5822563.7600000.823054
Tin and its compoundsTin, metal7440-31-5167.23411895.52960020.911182
Subtotal175.060000100.000000021.889740
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-826.75308899.9800003.345242
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0053520.0200000.000669
Subtotal26.758440100.00000003.345912
Copper PlatingCopper and its compoundsCopper, metal7440-50-829.31465699.9800003.665544
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0058640.0200000.000733
Subtotal29.320520100.00000003.666278
Gold PlatingGold and its compoundsGold, metal7440-57-50.26765399.9900000.033468
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000270.0100000.000003
Subtotal0.267680100.00000000.033471
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0005160.0300000.000065
Nickel and its compoundsNickel, metal7440-02-01.72028499.9700000.215107
Subtotal1.720800100.00000000.215171
Solder MaskBarium and its compoundsBarium sulfate7727-43-73.64158629.1000000.455349
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0750840.6000000.009389
Magnesium and its compoundsTalc14807-96-60.3754213.0000000.046943
Organic compoundsOther organic compounds.0.4505053.6000000.056332
PolymersPlastic: EP - Epoxide, Epoxy2.45275219.6000000.306695
PolymersPlastic: PAK5.51869244.1000000.690065
Subtotal12.514040100.00000001.564772
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-32.36132050.0000000.295263
Inorganic Silicon compoundsSilica, vitreous60676-86-00.2361325.0000000.029526
PolymersPlastic: EP - Epoxide, Epoxy2.12518845.0000000.265736
Subtotal4.722640100.00000000.590525
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-37.50947637.0000000.938995
Inorganic Silicon compoundsSilica, vitreous60676-86-03.24734116.0000000.406052
PolymersPlastic: PI - Polyimide9.53906447.0000001.192778
Subtotal20.295880100.00000002.537824
Total799.735386100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5533MVM80R
Product content declaration of SPC5533MVM80R
上次修订 Last Revision (GMT):
Wednesday, 27 July 2022, 07:58:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5533MVM80RLast Revision (GMT):
Wednesday, 27 July 2022, 07:58:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveTest Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Semiconductor DieTest Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Solder Ball - SAC, Lead FreeTest Report
20 Aug 2020
Test Report
20 Aug 2020
Test Report
20 Aug 2020
Test Report
20 Aug 2020
SubstrateNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.