SPC5534MVZ80R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5534MVZ80RLast Revision (GMT):
Monday, 04 March 2024, 02:26:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5534MVZ80RSOT1129-3BGA3241097.665640 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 102 685182023-11-2433 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-85.79267798.1000000.527727
Gold and its compoundsGold, metal7440-57-50.0059050.1000000.000538
Palladium and its compoundsPalladium, metal7440-05-30.1062881.8000000.009683
Subtotal5.904870100.00000000.537948
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins45.4260006.0000004.138419
Inorganic Silicon compoundsSilica, vitreous60676-86-0560.25400074.00000051.040497
Inorganic Silicon compoundsSilicon dioxide7631-86-9113.56500015.00000010.346047
Inorganic compoundsCarbon Black1333-86-43.7855000.5000000.344868
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-415.1420002.0000001.379473
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins18.9275002.5000001.724341
Subtotal757.100000100.000000068.973645
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.74000012.0000000.158518
Epoxy ResinsProprietary Material-Other Epoxy resins1.0150007.0000000.092469
Silver and its compoundsSilver, metal7440-22-411.74500081.0000001.069998
Subtotal14.500000100.00000001.320985
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped45.54233598.0000004.149017
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9294352.0000000.084674
Subtotal46.471770100.00000004.233691
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0027270.0010000.000248
Arsenic and its compoundsArsenic, metal7440-38-20.0027270.0010000.000248
Bismuth and its compoundsBismuth, metal7440-69-90.0027270.0010000.000248
Copper and its compoundsCopper, metal7440-50-81.9088230.7000000.173898
Iron and its compoundsIron, metal7439-89-60.0049080.0018000.000447
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0152710.0056000.001391
Silver and its compoundsSilver, metal7440-22-410.2531063.7600000.934083
Tin and its compoundsTin, metal7440-31-5260.49871195.52960023.732064
Subtotal272.689000100.000000024.842629
SubstrateCopper CoreCopper and its compoundsCopper, metal7440-50-80.34816599.9900000.031719
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000350.0100000.000003
Subtotal0.348200100.00000000.031722
Copper PlatingCopper and its compoundsCopper, metal7440-50-80.40182099.9800000.036607
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000800.0200000.000007
Subtotal0.401900100.00000000.036614
Gold PlatingGold and its compoundsGold, metal7440-57-50.00139999.9900000.000128
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.001400100.00000000.000128
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.0300000.000000
Nickel and its compoundsNickel, metal7440-02-00.00879799.9700000.000802
Subtotal0.008800100.00000000.000802
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.01469629.1000000.001339
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0003030.6000000.000028
Magnesium and its compoundsTalc14807-96-60.0015153.0000000.000138
Organic compoundsOther organic compounds.0.0018183.6000000.000166
PolymersPlastic: EP - Epoxide, Epoxy0.00989819.6000000.000902
PolymersPlastic: PAK0.02227044.1000000.002029
Subtotal0.050500100.00000000.004601
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.06127846.6700000.005582
Inorganic Silicon compoundsSilica, vitreous60676-86-00.0087456.6600000.000797
PolymersPlastic: PI - Polyimide0.06127846.6700000.005582
Subtotal0.131300100.00000000.011962
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.02702246.6700000.002462
Inorganic Silicon compoundsSilica, vitreous60676-86-00.0038566.6600000.000351
PolymersPlastic: PI - Polyimide0.02702246.6700000.002462
Subtotal0.057900100.00000000.005275
Total1097.665640100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5534MVZ80R
Product content declaration of SPC5534MVZ80R
上次修订 Last Revision (GMT):
Monday, 04 March 2024, 02:26:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5534MVZ80RLast Revision (GMT):
Monday, 04 March 2024, 02:26:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - SAC, Lead FreeTest Report
24 Jul 2023
Test Report
24 Jul 2023
Test Report
24 Jul 2023
Test Report
24 Jul 2023
SubstrateAU PLATINGTest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
AUS308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
7 Oct 2023
Test Report
7 Oct 2023
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
4 May 2023
Test Report
4 May 2023
Test Report
4 May 2023
Test Report
17 May 2022
E679FGTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.