SPC5565MVZ132

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5565MVZ132Last Revision (GMT):
Saturday, 10 September 2022, 12:52:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5565MVZ132SOT1129-3BGA3241711.085171 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 228 595572022-09-033 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-515.89791199.9900000.929113
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0015900.0100000.000093
Subtotal15.899501100.00000000.929206
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-523.3906043.0895001.367004
Arsenic and its compoundsArsenic, metal7440-38-20.0075710.0010000.000443
Cadmium and its compoundsCadmium, metal7440-43-90.0075710.0010000.000443
Epoxy ResinsProprietary Material-Other Epoxy resins23.3906043.0895001.367004
Inorganic Silicon compoundsSilica, vitreous60676-86-0662.73429987.53590038.731812
Inorganic compoundsCarbon Black1333-86-42.3394390.3090000.136722
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0075710.0010000.000443
Organic Phosphorus compoundsOther organic phosphorous compounds2.3394390.3090000.136722
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins42.8829015.6641002.506182
Subtotal757.100000100.000000044.246775
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.74000012.0000000.101690
Epoxy ResinsProprietary Material-Other Epoxy resins1.0150007.0000000.059319
Silver and its compoundsSilver, metal7440-22-411.74500081.0000000.686407
Subtotal14.500000100.00000000.847415
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped57.71873798.0000003.373224
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1779332.0000000.068841
Subtotal58.896670100.00000003.442065
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0027270.0010000.000159
Arsenic and its compoundsArsenic, metal7440-38-20.0027270.0010000.000159
Bismuth and its compoundsBismuth, metal7440-69-90.0027270.0010000.000159
Copper and its compoundsCopper, metal7440-50-81.9088230.7000000.111556
Iron and its compoundsIron, metal7439-89-60.0049080.0018000.000287
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0152710.0056000.000892
Silver and its compoundsSilver, metal7440-22-410.2531063.7600000.599217
Tin and its compoundsTin, metal7440-31-5260.49871195.52960015.224181
Subtotal272.689000100.000000015.936612
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-8206.80930399.98000012.086441
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0413700.0200000.002418
Subtotal206.850673100.000000012.088859
Copper PlatingCopper and its compoundsCopper, metal7440-50-8233.09465299.98000013.622621
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0466280.0200000.002725
Subtotal233.141280100.000000013.625346
Gold PlatingGold and its compoundsGold, metal7440-57-50.76956499.9900000.044975
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000770.0100000.000005
Subtotal0.769641100.00000000.044980
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0015100.0300000.000088
Nickel and its compoundsNickel, metal7440-02-05.03074599.9700000.294009
Subtotal5.032255100.00000000.294097
Solder MaskBarium and its compoundsBarium sulfate7727-43-79.76831229.1000000.570884
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2014080.6000000.011771
Magnesium and its compoundsTalc14807-96-61.0070423.0000000.058854
Organic compoundsOther organic compounds.1.2084513.6000000.070625
PolymersPlastic: EP - Epoxide, Epoxy6.57934419.6000000.384513
PolymersPlastic: PAK14.80352444.1000000.865154
Subtotal33.568081100.00000001.961801
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-317.03477246.6666000.995552
Inorganic Silicon compoundsSilica, vitreous60676-86-02.4335496.6667000.142223
PolymersPlastic: PI - Polyimide17.03477246.6667000.995554
Subtotal36.503057100.00000002.133328
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-328.16995537.0000001.646321
Inorganic Silicon compoundsSilica, vitreous60676-86-012.18160216.0000000.711923
PolymersPlastic: PI - Polyimide35.78345647.0000002.091273
Subtotal76.135013100.00000004.449516
Total1711.085171100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5565MVZ132
Product content declaration of SPC5565MVZ132
上次修订 Last Revision (GMT):
Saturday, 10 September 2022, 12:52:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5565MVZ132Last Revision (GMT):
Saturday, 10 September 2022, 12:52:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Die EncapsulantTest Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Epoxy AdhesiveTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Semiconductor DieTest Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Solder Ball - SAC, Lead FreeTest Report
20 Aug 2020
Test Report
20 Aug 2020
Test Report
20 Aug 2020
Test Report
20 Aug 2020
Substrate, Pre-plated NiAuAU PLATINGTest Report
11 Jun 2021
Test Report
11 Jun 2021
Test Report
11 Jun 2021
Test Report
11 Jun 2021
AUS 308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
CU FOILTest Report
21 Dec 2021
Test Report
7 Jan 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
CU PLATINGTest Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
E679FGBTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
NI PLATINGTest Report
25 Jun 2021
Test Report
25 Jun 2021
Test Report
25 Jun 2021
Test Report
25 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.