SPC5565MZQ132R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5565MZQ132RLast Revision (GMT):
Monday, 06 September 2021, 11:44:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5565MZQ132RSOT1129-3BGA3241756.001159 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 253 775182019-05-212Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-510.31045899.9900000.587156
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0010310.0100000.000059
Subtotal10.311489100.00000000.587214
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-523.3906043.0895001.332038
Arsenic and its compoundsArsenic, metal7440-38-20.0075710.0010000.000431
Cadmium and its compoundsCadmium, metal7440-43-90.0075710.0010000.000431
Epoxy ResinsProprietary Material-Other Epoxy resins23.3906043.0895001.332038
Inorganic Silicon compoundsSilica, vitreous60676-86-0662.73429987.53590037.741108
Inorganic compoundsCarbon Black1333-86-42.3394390.3090000.133225
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0075710.0010000.000431
Organic Phosphorus compoundsOther organic phosphorous compounds2.3394390.3090000.133225
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins42.8829015.6641002.442077
Subtotal757.100000100.000000043.115006
Epoxy AdhesiveEpoxy AdhesiveAromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.1225390.8451000.006978
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.87889612.9579000.106998
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.1225390.8451000.006978
Silver and its compoundsSilver, metal7440-22-412.37602685.3519000.704785
Subtotal14.500000100.00000000.825740
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped57.71873798.0000003.286942
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1779332.0000000.067080
Subtotal58.896670100.00000003.354022
Solder Ball - Low LeadSolder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1116.34948036.0000006.625820
Silver and its compoundsSilver, metal7440-22-46.4638602.0000000.368101
Tin and its compoundsTin, metal7440-31-5200.37966062.00000011.411135
Subtotal323.193000100.000000018.405056
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-8206.80930399.98000011.777287
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0413700.0200000.002356
Subtotal206.850673100.000000011.779643
Copper PlatingCopper and its compoundsCopper, metal7440-50-8233.09465299.98000013.274174
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0466280.0200000.002655
Subtotal233.141280100.000000013.276830
Gold PlatingGold and its compoundsGold, metal7440-57-50.76956499.9900000.043825
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000770.0100000.000004
Subtotal0.769641100.00000000.043829
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0015100.0300000.000086
Nickel and its compoundsNickel, metal7440-02-05.03074599.9700000.286489
Subtotal5.032255100.00000000.286575
Solder MaskBarium and its compoundsBarium sulfate7727-43-79.76831229.1000000.556282
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2014080.6000000.011470
Magnesium and its compoundsTalc14807-96-61.0070423.0000000.057349
Organic compoundsOther organic compounds.1.2084513.6000000.068818
PolymersPlastic: EP - Epoxide, Epoxy6.57934419.6000000.374678
PolymersPlastic: PAK14.80352444.1000000.843025
Subtotal33.568081100.00000001.911621
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-317.03477246.6666000.970087
Inorganic Silicon compoundsSilica, vitreous60676-86-02.4335496.6667000.138585
PolymersPlastic: PI - Polyimide17.03477246.6667000.970089
Subtotal36.503057100.00000002.078760
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-328.16995537.0000001.604210
Inorganic Silicon compoundsSilica, vitreous60676-86-012.18160216.0000000.693713
PolymersPlastic: PI - Polyimide35.78345647.0000002.037781
Subtotal76.135013100.00000004.335704
Total1756.001159100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5565MZQ132R
Product content declaration of SPC5565MZQ132R
上次修订 Last Revision (GMT):
Monday, 06 September 2021, 11:44:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5565MZQ132RLast Revision (GMT):
Monday, 06 September 2021, 11:44:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Die EncapsulantTest Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Epoxy AdhesiveTest Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Semiconductor DieTest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Solder Ball - Low LeadTest Report
28 Aug 2019
Test Report
28 Aug 2019
Test Report
28 Aug 2019
Test Report
5 Sep 2018
Substrate, Pre-plated NiAuAU PLATINGTest Report
11 Jun 2021
Test Report
11 Jun 2021
Test Report
11 Jun 2021
Test Report
11 Jun 2021
AUS 308Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
CU FOILTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Not Available
CU PLATINGTest Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Test Report
4 Jun 2021
E679FGBTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Not Available
NI PLATINGTest Report
3 Jun 2021
Test Report
3 Jun 2021
Test Report
3 Jun 2021
Test Report
3 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.