SPC5566MZP80

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5566MZP80Last Revision (GMT):
Tuesday, 10 August 2021, 06:25:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5566MZP80SOT1705-1BGA4163044.546022 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 169 695572020-06-113Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-510.48097499.9900000.344254
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0010480.0100000.000034
Subtotal10.482022100.00000000.344288
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-536.5024433.0895001.198945
Arsenic and its compoundsArsenic, metal7440-38-20.0118150.0010000.000388
Cadmium and its compoundsCadmium, metal7440-43-90.0118150.0010000.000388
Epoxy ResinsProprietary Material-Other Epoxy resins36.5024433.0895001.198945
Inorganic Silicon compoundsSilica, vitreous60676-86-01034.23665887.53590033.970144
Inorganic compoundsCarbon Black1333-86-43.6508350.3090000.119914
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0118150.0010000.000388
Organic Phosphorus compoundsOther organic phosphorous compounds3.6508350.3090000.119914
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins66.9213415.6641002.198073
Subtotal1181.500000100.000000038.807099
Epoxy AdhesiveEpoxy AdhesiveAromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.1470470.8451000.004830
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.25467512.9579000.074056
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.1470470.8451000.004830
Silver and its compoundsSilver, metal7440-22-414.85123185.3519000.487798
Subtotal17.400000100.00000000.571514
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped31.85000098.0000001.046133
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6500002.0000000.021350
Subtotal32.500000100.00000001.067483
Solder Ball - Low LeadSolder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1149.38704036.0000004.906710
Silver and its compoundsSilver, metal7440-22-48.2992802.0000000.272595
Tin and its compoundsTin, metal7440-31-5257.27768062.0000008.450445
Subtotal414.964000100.000000013.629750
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAromatic hydrocarbon compoundsOther Aromatic carbonyl compounds10.6505970.7675000.349826
Barium and its compoundsBarium sulfate7727-43-777.0686955.5537002.531369
Copper and its compoundsCopper, metal7440-50-8488.73406335.21900016.052773
Epoxy ResinsEpikote 86228064-14-4104.2842677.5149003.425281
Gold and its compoundsGold, metal7440-57-5149.31790810.7601004.904439
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.5381030.1829000.083366
Nickel and its compoundsNickel, metal7440-02-019.6775861.4180000.646323
Phosphorus compoundsDiphenyl cresyl phosphate26444-49-5174.37005612.5654005.727292
Small Mineral and Ceramic FibersSilica, crystalline - tridymite15468-32-3361.05872426.01850011.859198
Subtotal1387.700000100.000000045.579866
Total3044.546022100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5566MZP80
Product content declaration of SPC5566MZP80
上次修订 Last Revision (GMT):
Tuesday, 10 August 2021, 06:25:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5566MZP80Last Revision (GMT):
Tuesday, 10 August 2021, 06:25:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Die EncapsulantTest Report
27 Jul 2018
Test Report
27 Jul 2018
Test Report
27 Jul 2018
Test Report
27 Jul 2018
Epoxy AdhesiveTest Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Semiconductor DieTest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Solder Ball - Low LeadTest Report
28 Aug 2019
Test Report
28 Aug 2019
Test Report
28 Aug 2019
Test Report
5 Sep 2018
Substrate, Pre-plated NiAuAUS 703Test Report
6 Aug 2020
Test Report
6 Aug 2020
Test Report
26 Sep 2019
Test Report
26 Sep 2019
COPPER FOILTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
E679FG SERIESTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
PHP-900 IR-6Test Report
16 Jul 2020
Test Report
22 Nov 2018
Test Report
19 Sep 2018
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.