SPC5567MVR132

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5567MVR132Last Revision (GMT):
Tuesday, 30 May 2023, 02:28:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5567MVR132SOT1705-1BGA4163122.114698 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 099 555572023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-56.79734899.9900000.217716
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0006800.0100000.000022
Subtotal6.798028100.00000000.217738
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins70.8900006.0000002.270576
Inorganic Silicon compoundsSilica, vitreous60676-86-0874.31000074.00000028.003776
Inorganic Silicon compoundsSilicon dioxide7631-86-9177.22500015.0000005.676441
Inorganic compoundsCarbon Black1333-86-45.9075000.5000000.189215
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-423.6300002.0000000.756859
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins29.5375002.5000000.946074
Subtotal1181.500000100.000000037.842940
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.08800012.0000000.066878
Epoxy ResinsProprietary Material-Other Epoxy resins1.2180007.0000000.039012
Silver and its compoundsSilver, metal7440-22-414.09400081.0000000.451425
Subtotal17.400000100.00000000.557315
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped57.71873798.0000001.848707
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1779332.0000000.037729
Subtotal58.896670100.00000001.886435
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0035010.0010000.000112
Arsenic and its compoundsArsenic, metal7440-38-20.0035010.0010000.000112
Bismuth and its compoundsBismuth, metal7440-69-90.0035010.0010000.000112
Copper and its compoundsCopper, metal7440-50-82.4508400.7000000.078499
Iron and its compoundsIron, metal7439-89-60.0063020.0018000.000202
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0196070.0056000.000628
Silver and its compoundsSilver, metal7440-22-413.1645123.7600000.421654
Tin and its compoundsTin, metal7440-31-5334.46823595.52960010.712875
Subtotal350.120000100.000000011.214194
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8380.73116399.99000012.194657
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0380770.0100000.001220
Subtotal380.769240100.000000012.195876
Copper PlatingCopper and its compoundsCopper, metal7440-50-8592.89255899.98000018.990095
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1186020.0200000.003799
Subtotal593.011160100.000000018.993894
Gold PlatingGold and its compoundsGold, metal7440-57-51.65797499.9900000.053104
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001660.0100000.000005
Subtotal1.658140100.00000000.053109
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0032110.0300000.000103
Nickel and its compoundsNickel, metal7440-02-010.69932999.9700000.342695
Subtotal10.702540100.00000000.342798
Solder MaskBarium and its compoundsBarium sulfate7727-43-725.04710929.1000000.802248
Inorganic Silicon compoundsSilicon dioxide7631-86-90.5164350.6000000.016541
Magnesium and its compoundsTalc14807-96-62.5821763.0000000.082706
Organic compoundsOther organic compounds.3.0986113.6000000.099247
PolymersPlastic: EP - Epoxide, Epoxy16.87021819.6000000.540346
PolymersPlastic: PAK37.95799044.1000001.215778
Subtotal86.072540100.00000002.756867
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3118.29737547.6200003.789014
Inorganic Silicon compoundsSilica, vitreous60676-86-011.8247694.7600000.378742
PolymersPlastic: PI - Polyimide118.29737547.6200003.789014
Subtotal248.419520100.00000007.956771
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-359.76539532.0000001.914260
Inorganic Silicon compoundsSilica, vitreous60676-86-011.2060126.0000000.358924
PolymersPlastic: PI - Polyimide115.79545362.0000003.708879
Subtotal186.766860100.00000005.982063
Total3122.114698100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5567MVR132
Product content declaration of SPC5567MVR132
上次修订 Last Revision (GMT):
Tuesday, 30 May 2023, 02:28:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5567MVR132Last Revision (GMT):
Tuesday, 30 May 2023, 02:28:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
6 May 2023
Test Report
6 May 2023
Test Report
6 May 2023
Test Report
6 May 2023
Die EncapsulantTest Report
8 Mar 2023
Test Report
8 Mar 2023
Test Report
8 Mar 2023
Test Report
8 Mar 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - SAC, Lead FreeTest Report
24 Jul 2023
Test Report
24 Jul 2023
Test Report
24 Jul 2023
Test Report
24 Jul 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
6 Jun 2023
Test Report
6 Jun 2023
Test Report
6 Jun 2023
Test Report
6 Jun 2023
AUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
4 May 2023
Test Report
4 May 2023
Test Report
4 May 2023
Test Report
4 May 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Not AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.