SPC5567MZP132

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5567MZP132Last Revision (GMT):
Tuesday, 03 September 2024, 05:25:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5567MZP132SOT1705-1BGA4163186.958698 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 254 335572023-11-244Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-56.79734899.9900000.213286
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0006800.0100000.000021
Subtotal6.798028100.00000000.213308
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins70.8900006.0000002.224378
Inorganic Silicon compoundsSilica, vitreous60676-86-0874.31000074.00000027.433992
Inorganic Silicon compoundsSilicon dioxide7631-86-9177.22500015.0000005.560944
Inorganic compoundsCarbon Black1333-86-45.9075000.5000000.185365
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-423.6300002.0000000.741459
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins29.5375002.5000000.926824
Subtotal1181.500000100.000000037.072962
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.08800012.0000000.065517
Epoxy ResinsProprietary Material-Other Epoxy resins1.2180007.0000000.038218
Silver and its compoundsSilver, metal7440-22-414.09400081.0000000.442240
Subtotal17.400000100.00000000.545975
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped57.71873798.0000001.811092
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1779332.0000000.036961
Subtotal58.896670100.00000001.848053
Solder Ball - Low LeadSolder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1149.38704036.0000004.687448
Silver and its compoundsSilver, metal7440-22-48.2992802.0000000.260414
Tin and its compoundsTin, metal7440-31-5257.27768062.0000008.072828
Subtotal414.964000100.000000013.020690
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8380.73116399.99000011.946536
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0380770.0100000.001195
Subtotal380.769240100.000000011.947731
Copper PlatingCopper and its compoundsCopper, metal7440-50-8592.89255899.98000018.603710
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1186020.0200000.003721
Subtotal593.011160100.000000018.607432
Gold PlatingGold and its compoundsGold, metal7440-57-51.65797499.9900000.052024
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001660.0100000.000005
Subtotal1.658140100.00000000.052029
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0032110.0300000.000101
Nickel and its compoundsNickel, metal7440-02-010.69932999.9700000.335722
Subtotal10.702540100.00000000.335823
Solder MaskBarium and its compoundsBarium sulfate7727-43-725.04710929.1000000.785925
Inorganic Silicon compoundsSilicon dioxide7631-86-90.5164350.6000000.016205
Magnesium and its compoundsTalc14807-96-62.5821763.0000000.081023
Organic compoundsOther organic compounds.3.0986113.6000000.097228
PolymersPlastic: EP - Epoxide, Epoxy16.87021819.6000000.529352
PolymersPlastic: PAK37.95799044.1000001.191041
Subtotal86.072540100.00000002.700774
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3118.29737547.6200003.711921
Inorganic Silicon compoundsSilica, vitreous60676-86-011.8247694.7600000.371036
PolymersPlastic: PI - Polyimide118.29737547.6200003.711921
Subtotal248.419520100.00000007.794877
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-359.76539532.0000001.875311
Inorganic Silicon compoundsSilica, vitreous60676-86-011.2060126.0000000.351621
PolymersPlastic: PI - Polyimide115.79545362.0000003.633416
Subtotal186.766860100.00000005.860348
Total3186.958698100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5567MZP132
Product content declaration of SPC5567MZP132
上次修订 Last Revision (GMT):
Tuesday, 03 September 2024, 05:25:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5567MZP132Last Revision (GMT):
Tuesday, 03 September 2024, 05:25:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
9 Apr 2024
Test Report
9 Apr 2024
Test Report
9 Apr 2024
Test Report
9 Apr 2024
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder Ball - Low LeadTest Report
8 Oct 2021
Test Report
8 Oct 2021
Test Report
8 Oct 2021
Test Report
8 Nov 2021
Substrate, Pre-plated NiAuAU PLATINGTest Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
AUS308Not AvailableNot AvailableNot AvailableNot Available
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
29 Mar 2024
Test Report
29 Mar 2024
Test Report
29 Mar 2024
Test Report
4 May 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Not AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.