SPC5605BK0MLL6

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of SPC5605BK0MLL6Last Revision (GMT):
Sunday, 24 December 2023, 05:00:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5605BK0MLL6SOT407-3LQFP1002681.795273 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 117 275572023-11-2483 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-51.39377799.9900000.051972
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001390.0100000.000005
Subtotal1.393916100.00000000.051977
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-80.57553397.0000000.021461
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0178003.0000000.000664
Subtotal0.593333100.00000000.022124
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.47961598.1000000.017884
Gold and its compoundsGold, metal7440-57-50.0004890.1000000.000018
Palladium and its compoundsPalladium, metal7440-05-30.0088001.8000000.000328
Subtotal0.488904100.00000000.018230
Copper Lead-Frame 1Copper AlloyCopper and its compoundsCopper, metal7440-50-8152.95105695.0160005.703308
Inorganic Silicon compoundsSilicon7440-21-31.1751100.7300000.043818
Iron and its compoundsIron, metal7439-89-60.2044370.1270000.007623
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0482920.0300000.001801
Magnesium and its compoundsMagnesium, metal7439-95-40.2849240.1770000.010624
Manganese and its compoundsManganese, metal7439-96-50.0965840.0600000.003602
Nickel and its compoundsNickel, metal7440-02-05.1994603.2300000.193880
Zinc and its compoundsZinc, metal7440-66-61.0141360.6300000.037816
Subtotal160.974000100.00000006.002472
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001630.0100000.000006
Silver and its compoundsSilver, metal7440-22-41.62583799.9900000.060625
Subtotal1.626000100.00000000.060631
Copper Lead-Frame 2Copper AlloyCopper and its compoundsCopper, metal7440-50-8156.61321497.2910005.839865
Iron and its compoundsIron, metal7439-89-63.8150842.3700000.142259
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0273660.0170000.001020
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.2672170.1660000.009964
Tin and its compoundsTin, metal7440-31-50.0482920.0300000.001801
Zinc and its compoundsZinc, metal7440-66-60.2028270.1260000.007563
Subtotal160.974000100.00000006.002472
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001630.0100000.000006
Silver and its compoundsSilver, metal7440-22-41.62583799.9900000.060625
Subtotal1.626000100.00000000.060631
Copper Lead-Frame 3Copper AlloyCopper and its compoundsCopper, metal7440-50-8156.61321497.2910005.839865
Iron and its compoundsIron, metal7439-89-63.8150842.3700000.142259
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0273660.0170000.001020
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.2672170.1660000.009964
Tin and its compoundsTin, metal7440-31-50.0482920.0300000.001801
Zinc and its compoundsZinc, metal7440-66-60.2028270.1260000.007563
Subtotal160.974000100.00000006.002472
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001630.0100000.000006
Silver and its compoundsSilver, metal7440-22-41.62583799.9900000.060625
Subtotal1.626000100.00000000.060631
Die Encapsulant 1Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins24.6700005.0000000.919906
Inorganic Silicon compoundsSilica, vitreous60676-86-098.68000020.0000003.679625
Inorganic Silicon compoundsSilicon dioxide7631-86-9347.84700070.50000012.970677
Inorganic compoundsCarbon Black1333-86-419.7360004.0000000.735925
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins2.4670000.5000000.091991
Subtotal493.400000100.000000018.398123
Die Encapsulant 2Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins29.6040006.0000001.103887
Inorganic Silicon compoundsSilica, vitreous60676-86-0362.64900073.50000013.522621
Inorganic Silicon compoundsSilicon dioxide7631-86-978.94400016.0000002.943700
Inorganic compoundsCarbon Black1333-86-42.4670000.5000000.091991
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins19.7360004.0000000.735925
Subtotal493.400000100.000000018.398123
Die Encapsulant 3Die EncapsulantEpoxy ResinsEpoxy resin, EPON Resin 809125928-94-324.6700005.0000000.919906
Inorganic Silicon compoundsSilica, vitreous60676-86-0370.05000075.00000013.798592
Inorganic Silicon compoundsSilicon dioxide7631-86-946.8730009.5000001.747822
Inorganic compoundsCarbon Black1333-86-42.4670000.5000000.091991
Organic Silicon compoundsSilicone modified epoxy resin218163-11-224.6700005.0000000.919906
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins24.6700005.0000000.919906
Subtotal493.400000100.000000018.398123
Die Encapsulant 4Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins19.7360004.0000000.735925
Inorganic Silicon compoundsSilica, vitreous60676-86-0362.64900073.50000013.522621
Inorganic Silicon compoundsSilicon dioxide7631-86-978.94400016.0000002.943700
Inorganic compoundsCarbon Black1333-86-42.4670000.5000000.091991
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins29.6040006.0000001.103887
Subtotal493.400000100.000000018.398123
Epoxy Adhesive 1Epoxy AdhesiveCopper and its compoundsCupric oxide1317-38-00.0022090.1004000.000082
PolymersPlastic: EP - Epoxide, Epoxy0.48179321.8997000.017965
Silver and its compoundsSilver, metal7440-22-41.71599877.9999000.063987
Subtotal2.200000100.00000000.082035
Epoxy Adhesive 2Epoxy AdhesiveCopper and its compoundsCupric oxide1317-38-00.0022090.1004000.000082
PolymersPlastic: EP - Epoxide, Epoxy0.48179321.8997000.017965
Silver and its compoundsSilver, metal7440-22-41.71599877.9999000.063987
Subtotal2.200000100.00000000.082035
Epoxy Adhesive 3Epoxy AdhesivePolymersPlastic: ABAK - Acrylonitrile-butadiene-acrylate0.33396015.1800000.012453
PolymersPlastic: EP - Epoxide, Epoxy0.1531206.9600000.005710
Silver and its compoundsSilver, metal7440-22-41.71292077.8600000.063872
Subtotal2.200000100.00000000.082035
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0019800.0200000.000074
Tin and its compoundsTin, metal7440-31-59.89802099.9800000.369082
Subtotal9.900000100.00000000.369156
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-355.55673998.0000002.071625
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1338112.0000000.042278
Subtotal56.690550100.00000002.113903
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-364.80599998.0000002.416516
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.3225712.0000000.049317
Subtotal66.128570100.00000002.465832
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon, doped38.51400098.0000001.436128
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7860002.0000000.029309
Subtotal39.300000100.00000001.465436
Semiconductor Die 4Semiconductor DieInorganic Silicon compoundsSilicon, doped38.51400098.0000001.436128
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7860002.0000000.029309
Subtotal39.300000100.00000001.465436
Total2681.795273100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5605BK0MLL6
Product content declaration of SPC5605BK0MLL6
上次修订 Last Revision (GMT):
Sunday, 24 December 2023, 05:00:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架
Copper Lead-Frame 1
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
铜引线框架
Copper Lead-Frame 2
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
铜引线框架
Copper Lead-Frame 3
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 3
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 4
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5605BK0MLL6Last Revision (GMT):
Sunday, 24 December 2023, 05:00:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
6 May 2023
Test Report
6 May 2023
Test Report
6 May 2023
Test Report
6 May 2023
Bonding Wire - CuTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Bonding Wire - CuPdAuTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Copper Lead-Frame 1AG PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
C7025Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Copper Lead-Frame 2AG SPOT PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
CDA 194Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Copper Lead-Frame 3AG PLATINGTest Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
C194Test Report
14 Feb 2023
Test Report
14 Feb 2023
Test Report
14 Feb 2023
Test Report
14 Feb 2023
Die Encapsulant 1Test Report
9 Feb 2023
Test Report
9 Feb 2023
Test Report
9 Feb 2023
Test Report
9 Feb 2023
Die Encapsulant 2Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Die Encapsulant 3Test Report
25 Apr 2023
Test Report
25 Apr 2023
Test Report
25 Apr 2023
Test Report
25 Apr 2023
Die Encapsulant 4Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Epoxy Adhesive 1Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Epoxy Adhesive 2Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Epoxy Adhesive 3Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Post-plating - Lead FreeTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor Die 1Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Semiconductor Die 2Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Semiconductor Die 3Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Semiconductor Die 4Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.