SPC5643LF2MMM1

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of SPC5643LF2MMM1Last Revision (GMT):
Tuesday, 05 March 2024, 01:46:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5643LF2MMM1SOT1547-1LFBGA257523.692154 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 152 315572023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.34799698.1000000.257402
Gold and its compoundsGold, metal7440-57-50.0013740.1000000.000262
Palladium and its compoundsPalladium, metal7440-05-30.0247341.8000000.004723
Subtotal1.374104100.00000000.262388
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins11.8950005.0000002.271373
Inorganic Silicon compoundsSilica, vitreous60676-86-0159.39300067.00000030.436393
Inorganic Silicon compoundsSilicon dioxide7631-86-959.47500025.00000011.356863
Inorganic compoundsCarbon Black1333-86-41.1895000.5000000.227137
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins5.9475002.5000001.135686
Subtotal237.900000100.000000045.427452
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.67500045.0000000.128892
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001500.0100000.000029
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0750005.0000000.014321
PolymersPlastic: EP - Epoxide, Epoxy0.74985049.9900000.143185
Subtotal1.500000100.00000000.286428
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped92.23666998.00000017.612765
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.8823812.0000000.359444
Subtotal94.119050100.000000017.972209
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0021380.0032000.000408
Antimony and its compoundsAntimony, metal7440-36-00.0083500.0125000.001594
Arsenic and its compoundsArsenic, metal7440-38-20.0050100.0075000.000957
Bismuth and its compoundsBismuth, metal7440-69-90.0125580.0188000.002398
Cadmium and its compoundsCadmium, metal7440-43-90.0008680.0013000.000166
Copper and its compoundsCopper, metal7440-50-80.0042080.0063000.000804
Gold and its compoundsGold, metal7440-57-50.0042080.0063000.000804
Indium and its compoundsIndium, metal7440-74-60.0042080.0063000.000804
Inorganic compoundsSulfur7704-34-90.0006680.0010000.000128
Iron and its compoundsIron, metal7439-89-60.0083500.0125000.001594
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0209080.0313000.003992
Nickel and its compoundsNickel, metal7440-02-00.0021380.0032000.000408
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0042080.0063000.000804
Silver and its compoundsSilver, metal7440-22-42.3380993.5002000.446464
Tin and its compoundsTin, metal7440-31-564.38181196.38140012.293828
Zinc and its compoundsZinc, metal7440-66-60.0012690.0019000.000242
Subtotal66.799000100.000000012.755395
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-838.36516399.9900007.325900
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0038370.0100000.000733
Subtotal38.369000100.00000007.326633
Copper PlatingCopper and its compoundsCopper, metal7440-50-837.42211499.9800007.145823
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0074860.0200000.001429
Subtotal37.429600100.00000007.147252
Gold PlatingGold and its compoundsGold, metal7440-57-50.35376599.9900000.067552
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000350.0100000.000007
Subtotal0.353800100.00000000.067559
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0006630.0300000.000127
Nickel and its compoundsNickel, metal7440-02-02.20753799.9700000.421533
Subtotal2.208200100.00000000.421660
Solder MaskBarium and its compoundsBarium sulfate7727-43-74.71111529.1000000.899596
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0971360.6000000.018548
Magnesium and its compoundsTalc14807-96-60.4856823.0000000.092742
Organic compoundsOther organic compounds.0.5828183.6000000.111290
PolymersPlastic: EP - Epoxide, Epoxy3.17312219.6000000.605914
PolymersPlastic: PAK7.13952544.1000001.363306
Subtotal16.189400100.00000003.091396
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-310.01528946.6700001.912438
Inorganic Silicon compoundsSilica, vitreous60676-86-01.4292236.6600000.272913
PolymersPlastic: PI - Polyimide10.01528946.6700001.912438
Subtotal21.459800100.00000004.097789
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-32.79562646.6700000.533830
Inorganic Silicon compoundsSilica, vitreous60676-86-00.3989476.6600000.076180
PolymersPlastic: PI - Polyimide2.79562646.6700000.533830
Subtotal5.990200100.00000001.143840
Total523.692154100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5643LF2MMM1
Product content declaration of SPC5643LF2MMM1
上次修订 Last Revision (GMT):
Tuesday, 05 March 2024, 01:46:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5643LF2MMM1Last Revision (GMT):
Tuesday, 05 March 2024, 01:46:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
AUS308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
7 Oct 2023
Test Report
7 Oct 2023
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
4 May 2023
Test Report
4 May 2023
Test Report
4 May 2023
Test Report
17 May 2022
E679FGTest Report
7 Dec 2023
Test Report
14 Dec 2022
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
Test Report
22 May 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.