SPC5644AF0MVZ2R

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5644AF0MVZ2RLast Revision (GMT):
Tuesday, 05 March 2024, 01:47:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5644AF0MVZ2RSOT1129-3BGA3241086.931451 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 152 815182023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-82.43928896.5500000.224420
Gold and its compoundsGold, metal7440-57-50.0088430.3500000.000813
Palladium and its compoundsPalladium, metal7440-05-30.0783203.1000000.007206
Subtotal2.526451100.00000000.232439
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins37.8550005.0000003.482740
Inorganic Silicon compoundsSilica, vitreous60676-86-0507.25700067.00000046.668720
Inorganic Silicon compoundsSilicon dioxide7631-86-9189.27500025.00000017.413702
Inorganic compoundsCarbon Black1333-86-43.7855000.5000000.348274
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins18.9275002.5000001.741370
Subtotal757.100000100.000000069.654807
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.74000012.0000000.160084
Epoxy ResinsProprietary Material-Other Epoxy resins1.0150007.0000000.093382
Silver and its compoundsSilver, metal7440-22-411.74500081.0000001.080565
Subtotal14.500000100.00000001.334031
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped39.20000098.0000003.606483
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8000002.0000000.073602
Subtotal40.000000100.00000003.680085
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-49.5131753.5000000.875232
Tin and its compoundsTin, metal7440-31-5262.29182596.50000024.131404
Subtotal271.805000100.000000025.006637
SubstrateCopper CoreCopper and its compoundsCopper, metal7440-50-80.35536599.9900000.032694
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000360.0100000.000003
Subtotal0.355400100.00000000.032698
Copper PlatingCopper and its compoundsCopper, metal7440-50-80.39232199.9800000.036094
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000780.0200000.000007
Subtotal0.392400100.00000000.036102
Gold PlatingGold and its compoundsGold, metal7440-57-50.00119999.9900000.000110
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.001200100.00000000.000110
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0300000.000000
Nickel and its compoundsNickel, metal7440-02-00.00729899.9700000.000671
Subtotal0.007300100.00000000.000672
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.01521929.1000000.001400
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0003140.6000000.000029
Magnesium and its compoundsTalc14807-96-60.0015693.0000000.000144
Organic compoundsOther organic compounds.0.0018833.6000000.000173
PolymersPlastic: EP - Epoxide, Epoxy0.01025119.6000000.000943
PolymersPlastic: PAK0.02306444.1000000.002122
Subtotal0.052300100.00000000.004812
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-30.02977546.6700000.002739
Inorganic Silicon compoundsSilica, vitreous60676-86-00.0042496.6600000.000391
PolymersPlastic: PI - Polyimide0.02977546.6700000.002739
Subtotal0.063800100.00000000.005870
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-30.04721237.0000000.004344
Inorganic Silicon compoundsSilica, vitreous60676-86-00.02041616.0000000.001878
PolymersPlastic: PI - Polyimide0.05997247.0000000.005518
Subtotal0.127600100.00000000.011739
Total1086.931451100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5644AF0MVZ2R
Product content declaration of SPC5644AF0MVZ2R
上次修订 Last Revision (GMT):
Tuesday, 05 March 2024, 01:47:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5644AF0MVZ2RLast Revision (GMT):
Tuesday, 05 March 2024, 01:47:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
SubstrateNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.