SPC5673FF3MVR2R

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of SPC5673FF3MVR2RLast Revision (GMT):
Tuesday, 12 December 2023, 08:59:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5673FF3MVR2RSOT1705-1BGA4163104.422538 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 112 445182023-11-2463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-83.81892398.1000000.123016
Gold and its compoundsGold, metal7440-57-50.0038930.1000000.000125
Palladium and its compoundsPalladium, metal7440-05-30.0700721.8000000.002257
Subtotal3.892888100.00000000.125398
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins59.0750005.0000001.902930
Inorganic Silicon compoundsSilica, vitreous60676-86-0791.60500067.00000025.499267
Inorganic Silicon compoundsSilicon dioxide7631-86-9295.37500025.0000009.514652
Inorganic compoundsCarbon Black1333-86-45.9075000.5000000.190293
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins29.5375002.5000000.951465
Subtotal1181.500000100.000000038.058608
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.08800012.0000000.067259
Epoxy ResinsProprietary Material-Other Epoxy resins1.2180007.0000000.039234
Silver and its compoundsSilver, metal7440-22-414.09400081.0000000.453997
Subtotal17.400000100.00000000.560491
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped44.34073798.0000001.428309
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9049132.0000000.029149
Subtotal45.245650100.00000001.457458
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-412.2144403.5000000.393453
Tin and its compoundsTin, metal7440-31-5336.76956096.50000010.848058
Subtotal348.984000100.000000011.241511
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8395.35148199.99000012.735105
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0395390.0100000.001274
Subtotal395.391020100.000000012.736379
Copper PlatingCopper and its compoundsCopper, metal7440-50-8434.04437499.98000013.981485
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0868260.0200000.002797
Subtotal434.131200100.000000013.984282
Gold PlatingGold and its compoundsGold, metal7440-57-51.05507499.9900000.033986
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001060.0100000.000003
Subtotal1.055180100.00000000.033990
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0020800.0300000.000067
Nickel and its compoundsNickel, metal7440-02-06.93196099.9700000.223293
Subtotal6.934040100.00000000.223360
Solder MaskBarium and its compoundsBarium sulfate7727-43-719.43234629.1000000.625957
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4006670.6000000.012906
Magnesium and its compoundsTalc14807-96-62.0033353.0000000.064532
Organic compoundsOther organic compounds.2.4040023.6000000.077438
PolymersPlastic: EP - Epoxide, Epoxy13.08845319.6000000.421607
PolymersPlastic: PAK29.44901944.1000000.948615
Subtotal66.777820100.00000002.151054
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3215.56251147.6200006.943723
Inorganic Silicon compoundsSilica, vitreous60676-86-021.5471984.7600000.694081
PolymersPlastic: PI - Polyimide215.56251147.6200006.943723
Subtotal452.672220100.000000014.581527
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-348.14032632.0000001.550701
Inorganic Silicon compoundsSilica, vitreous60676-86-09.0263116.0000000.290756
PolymersPlastic: PI - Polyimide93.27188262.0000003.004484
Subtotal150.438520100.00000004.845942
Total3104.422538100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5673FF3MVR2R
Product content declaration of SPC5673FF3MVR2R
上次修订 Last Revision (GMT):
Tuesday, 12 December 2023, 08:59:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5673FF3MVR2RLast Revision (GMT):
Tuesday, 12 December 2023, 08:59:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.