SPC5673FK0MVV2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5673FK0MVV2Last Revision (GMT):
Sunday, 24 December 2023, 04:57:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5673FK0MVV2SOT1527-2BGA5164446.720664 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 258 495572023-11-245Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-89.61935698.1000000.216325
Gold and its compoundsGold, metal7440-57-50.0098060.1000000.000220
Palladium and its compoundsPalladium, metal7440-05-30.1765021.8000000.003969
Subtotal9.805664100.00000000.220515
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins90.6950005.0000002.039593
Inorganic Silicon compoundsSilica, vitreous60676-86-01215.31300067.00000027.330545
Inorganic Silicon compoundsSilicon dioxide7631-86-9453.47500025.00000010.197965
Inorganic compoundsCarbon Black1333-86-49.0695000.5000000.203959
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins45.3475002.5000001.019796
Subtotal1813.900000100.000000040.791858
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.20000012.0000000.026986
Epoxy ResinsProprietary Material-Other Epoxy resins0.7000007.0000000.015742
Silver and its compoundsSilver, metal7440-22-48.10000081.0000000.182157
Subtotal10.000000100.00000000.224885
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped39.20000098.0000000.881548
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8000002.0000000.017991
Subtotal40.000000100.00000000.899539
Solder Ball - Low LeadSolder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1185.29740036.0000004.167057
Silver and its compoundsSilver, metal7440-22-410.2943002.0000000.231503
Tin and its compoundsTin, metal7440-31-5319.12330062.0000007.176599
Subtotal514.715000100.000000011.575159
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-8495.77374999.99000011.149199
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0495820.0100000.001115
Subtotal495.823331100.000000011.150314
Copper PlatingCopper and its compoundsCopper, metal7440-50-8805.19912899.98000018.107706
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1610720.0200000.003622
Subtotal805.360200100.000000018.111329
Gold PlatingGold and its compoundsGold, metal7440-57-50.02266099.9900000.000510
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000000
Subtotal0.022662100.00000000.000510
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000080.0300000.000000
Nickel and its compoundsNickel, metal7440-02-00.02847899.9700000.000640
Subtotal0.028487100.00000000.000641
Solder MaskBarium and its compoundsBarium sulfate7727-43-739.41007829.1000000.886273
Inorganic Silicon compoundsSilicon dioxide7631-86-90.8125790.6000000.018274
Magnesium and its compoundsTalc14807-96-64.0628953.0000000.091368
Organic compoundsOther organic compounds.4.8754743.6000000.109642
PolymersPlastic: EP - Epoxide, Epoxy26.54424519.6000000.596940
PolymersPlastic: PAK59.72455144.1000001.343114
Subtotal135.429821100.00000003.045611
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-3170.97698147.6200003.845013
Inorganic Silicon compoundsSilica, vitreous60676-86-017.0905174.7600000.384340
PolymersPlastic: PI - Polyimide170.97698147.6200003.845013
Subtotal359.044480100.00000008.074366
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-384.02912632.0000001.889687
Inorganic Silicon compoundsSilica, vitreous60676-86-015.7554616.0000000.354316
PolymersPlastic: PI - Polyimide162.80643262.0000003.661270
Subtotal262.591019100.00000005.905273
Total4446.720664100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5673FK0MVV2
Product content declaration of SPC5673FK0MVV2
上次修订 Last Revision (GMT):
Sunday, 24 December 2023, 04:57:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5673FK0MVV2Last Revision (GMT):
Sunday, 24 December 2023, 04:57:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - Low LeadTest Report
8 Oct 2021
Test Report
8 Oct 2021
Test Report
8 Oct 2021
Test Report
8 Nov 2021
Substrate, Pre-plated NiAuAUS 703Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
Test Report
15 Dec 2021
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
PHP-900 IR-6Test Report
18 Jun 2021
Test Report
19 Aug 2021
Test Report
18 Jun 2021
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.