SPC5674FAMVR3R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5674FAMVR3RLast Revision (GMT):
Tuesday, 12 December 2023, 08:32:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5674FAMVR3RSOT1705-1BGA4163099.176888 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 156 915182023-11-2463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-83.81892398.1000000.123224
Gold and its compoundsGold, metal7440-57-50.0038930.1000000.000126
Palladium and its compoundsPalladium, metal7440-05-30.0700721.8000000.002261
Subtotal3.892888100.00000000.125610
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins59.0750005.0000001.906151
Inorganic Silicon compoundsSilica, vitreous60676-86-0791.60500067.00000025.542427
Inorganic Silicon compoundsSilicon dioxide7631-86-9295.37500025.0000009.530756
Inorganic compoundsCarbon Black1333-86-45.9075000.5000000.190615
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins29.5375002.5000000.953076
Subtotal1181.500000100.000000038.123026
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.08800012.0000000.067373
Epoxy ResinsProprietary Material-Other Epoxy resins1.2180007.0000000.039301
Silver and its compoundsSilver, metal7440-22-414.09400081.0000000.454766
Subtotal17.400000100.00000000.561439
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped39.20000098.0000001.264852
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8000002.0000000.025813
Subtotal40.000000100.00000001.290665
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-412.2144403.5000000.394119
Tin and its compoundsTin, metal7440-31-5336.76956096.50000010.866419
Subtotal348.984000100.000000011.260538
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-8362.41214699.99000011.693819
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0362450.0100000.001169
Subtotal362.448391100.000000011.694989
Copper PlatingCopper and its compoundsCopper, metal7440-50-8575.78884399.98000018.578767
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1151810.0200000.003717
Subtotal575.904024100.000000018.582483
Gold PlatingGold and its compoundsGold, metal7440-57-50.01659599.9900000.000535
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000000
Subtotal0.016597100.00000000.000536
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000050.0300000.000000
Nickel and its compoundsNickel, metal7440-02-00.01663799.9700000.000537
Subtotal0.016642100.00000000.000537
Solder MaskBarium and its compoundsBarium sulfate7727-43-731.20299629.1000001.006816
Inorganic Silicon compoundsSilicon dioxide7631-86-90.6433610.6000000.020759
Magnesium and its compoundsTalc14807-96-63.2168043.0000000.103795
Organic compoundsOther organic compounds.3.8601643.6000000.124554
PolymersPlastic: EP - Epoxide, Epoxy21.01645119.6000000.678130
PolymersPlastic: PAK47.28701444.1000001.525793
Subtotal107.226789100.00000003.459847
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-3124.98470247.6200004.032835
Inorganic Silicon compoundsSilica, vitreous60676-86-012.4932214.7600000.403114
PolymersPlastic: PI - Polyimide124.98470247.6200004.032835
Subtotal262.462624100.00000008.468785
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-363.78397932.0000002.058094
Inorganic Silicon compoundsSilica, vitreous60676-86-011.9594966.0000000.385893
PolymersPlastic: PI - Polyimide123.58145962.0000003.987557
Subtotal199.324934100.00000006.431544
Total3099.176888100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5674FAMVR3R
Product content declaration of SPC5674FAMVR3R
上次修订 Last Revision (GMT):
Tuesday, 12 December 2023, 08:32:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5674FAMVR3RLast Revision (GMT):
Tuesday, 12 December 2023, 08:32:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAUS 308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
18 Oct 2021
Test Report
18 Oct 2021
COPPERTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FGBTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.