SPC5775BDK3MME2R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5775BDK3MME2RLast Revision (GMT):
Friday, 08 March 2024, 08:37:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5775BDK3MME2RSOT1528BGA4161307.866404 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 715 935182023-11-2483 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.00271796.5500000.000208
Gold and its compoundsGold, metal7440-57-50.0000100.3500000.000001
Palladium and its compoundsPalladium, metal7440-05-30.0000873.1000000.000007
Subtotal0.002814100.00000000.000215
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins46.0850005.0000003.523678
Inorganic Silicon compoundsSilica, vitreous60676-86-0617.53900067.00000047.217284
Inorganic Silicon compoundsSilicon dioxide7631-86-9230.42500025.00000017.618390
Inorganic compoundsCarbon Black1333-86-44.6085000.5000000.352368
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins23.0425002.5000001.761839
Subtotal921.700000100.000000070.473559
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-94.14000045.0000000.316546
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0009200.0100000.000070
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.4600005.0000000.035172
PolymersPlastic: EP - Epoxide, Epoxy4.59908049.9900000.351648
Subtotal9.200000100.00000000.703436
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-326.43999898.0000002.021613
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5395922.0000000.041257
Subtotal26.979590100.00000002.062870
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-412.2144403.5000000.933921
Tin and its compoundsTin, metal7440-31-5336.76956096.50000025.749538
Subtotal348.984000100.000000026.683459
SubstrateCopper CoreCopper and its compoundsCopper, metal7440-50-80.35676499.9900000.027278
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000360.0100000.000003
Subtotal0.356800100.00000000.027281
Copper PlatingCopper and its compoundsCopper, metal7440-50-80.41131899.9800000.031449
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000820.0200000.000006
Subtotal0.411400100.00000000.031456
Gold PlatingGold and its compoundsGold, metal7440-57-50.00109999.9900000.000084
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.001100100.00000000.000084
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0300000.000000
Nickel and its compoundsNickel, metal7440-02-00.00699899.9700000.000535
Subtotal0.007000100.00000000.000535
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.01359029.1000000.001039
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0002800.6000000.000021
Magnesium and its compoundsTalc14807-96-60.0014013.0000000.000107
Organic compoundsOther organic compounds.0.0016813.6000000.000129
PolymersPlastic: EP - Epoxide, Epoxy0.00915319.6000000.000700
PolymersPlastic: PAK0.02059544.1000000.001575
Subtotal0.046700100.00000000.003571
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.05507146.6700000.004211
Inorganic Silicon compoundsSilica, vitreous60676-86-00.0078596.6600000.000601
PolymersPlastic: PI - Polyimide0.05507146.6700000.004211
Subtotal0.118000100.00000000.009022
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.02753546.6700000.002105
Inorganic Silicon compoundsSilica, vitreous60676-86-00.0039296.6600000.000300
PolymersPlastic: PI - Polyimide0.02753546.6700000.002105
Subtotal0.059000100.00000000.004511
Total1307.866404100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5775BDK3MME2R
Product content declaration of SPC5775BDK3MME2R
上次修订 Last Revision (GMT):
Friday, 08 March 2024, 08:37:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5775BDK3MME2RLast Revision (GMT):
Friday, 08 March 2024, 08:37:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
SubstrateNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.