T1022NSE7PQB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of T1022NSE7PQBLast Revision (GMT):
Friday, 11 December 2020, 04:36:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
T1022NSE7PQBSOT1652-1FBGA7801482.880000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 258 665572020-10-15103 / 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped110.38720089.6000007.444109
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1088000.9000000.074773
Nickel and its compoundsNickel, metal7440-02-00.6160000.5000000.041541
Silver and its compoundsSilver, metal7440-22-40.3880800.3150000.026171
Tin and its compoundsTin, metal7440-31-510.6999208.6850000.721563
Subtotal123.200000100.00000008.308157
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.9684000.5000000.065305
Silver and its compoundsSilver, metal7440-22-45.8104003.0000000.391832
Tin and its compoundsTin, metal7440-31-5186.90120096.50000012.603933
Subtotal193.680000100.000000013.061070
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-2115.29258910.0063007.774910
Barium and its compoundsBarium sulfate7727-43-79.0182690.7827000.608159
Copper and its compoundsCopper phthalocyanine147-14-80.0576100.0050000.003885
Copper and its compoundsCopper, metal7440-50-8405.46494135.19050027.343072
Epoxy ResinsProprietary Material-Other Epoxy resins183.88190215.95920012.400322
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3217.12748118.84460014.642283
Inorganic Silicon compoundsSilicon dioxide7631-86-959.8372035.1933004.035202
Magnesium and its compoundsTalc14807-96-61.0335230.0897000.069697
Organic Phosphorus compoundsOther organic phosphorous compounds12.5428491.0886000.845844
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-614.1109931.2247000.951594
PolymersProprietary Material-Other polymers115.22000010.0000007.770015
Silver and its compoundsSilver, metal7440-22-40.5611210.0487000.037840
Tin and its compoundsTin, metal7440-31-518.0515171.5667001.217328
Subtotal1152.200000100.000000077.700151
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-08.28000060.0000000.558373
Inorganic compoundsCarbon Black1333-86-40.0138000.1000000.000931
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1242000.9000000.008376
PolymersPlastic: EP - Epoxide, Epoxy5.38200039.0000000.362942
Subtotal13.800000100.00000000.930621
Total1482.880000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 T1022NSE7PQB
Product content declaration of T1022NSE7PQB
上次修订 Last Revision (GMT):
Friday, 11 December 2020, 04:36:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of T1022NSE7PQBLast Revision (GMT):
Friday, 11 December 2020, 04:36:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieTest Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Solder Ball - SAC, Lead FreeTest Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
SubstrateABF-GX13Test Report
26 Aug 2020
Test Report
26 Aug 2020
Test Report
26 Aug 2020
Test Report
26 Aug 2020
UnderfillTest Report
10 Mar 2020
Test Report
10 Mar 2020
Test Report
10 Mar 2020
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.