T1042NSN7WQB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of T1042NSN7WQBLast Revision (GMT):
Tuesday, 19 March 2024, 07:38:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
T1042NSN7WQBSOT1652-1FBGA7801482.880000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 237 495572023-11-2493 / 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-3110.38720089.6000007.444109
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1088000.9000000.074773
Nickel and its compoundsNickel, metal7440-02-00.6160000.5000000.041541
Silver and its compoundsSilver, metal7440-22-40.3880800.3150000.026171
Tin and its compoundsTin, metal7440-31-510.6999208.6850000.721563
Subtotal123.200000100.00000008.308157
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.9684000.5000000.065305
Silver and its compoundsSilver, metal7440-22-45.8104003.0000000.391832
Tin and its compoundsTin, metal7440-31-5186.90120096.50000012.603933
Subtotal193.680000100.000000013.061070
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8502.54746999.90000033.889962
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5030500.1000000.033924
Subtotal503.050520100.000000033.923886
SolderCopper and its compoundsCopper, metal7440-50-80.1036980.5000000.006993
Silver and its compoundsSilver, metal7440-22-40.6221883.0000000.041958
Tin and its compoundsTin, metal7440-31-520.01371496.5000001.349652
Subtotal20.739600100.00000001.398603
Solder MaskBarium and its compoundsBarium sulfate7727-43-78.67168831.1000000.584787
Copper and its compoundsCopper phthalocyanine147-14-80.0557660.2000000.003761
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1394160.5000000.009402
Magnesium and its compoundsTalc14807-96-61.0037973.6000000.067692
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3067161.1000000.020684
Organic compoundsProprietary Material-Other organic compounds.0.0278830.1000000.001880
PolymersPlastic: EP - Epoxide, Epoxy17.67797463.4000001.192138
Subtotal27.883240100.00000001.880344
Substrate Build UpEpoxy ResinsBisphenol A diglycidyl ether1675-54-330.73516520.8400002.072667
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-515.35283510.4100001.035339
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-67.6690435.2000000.517172
Inorganic Silicon compoundsSilicon dioxide7631-86-930.73516520.8400002.072667
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-44.6014263.1200000.310303
PolymersPlastic: EP - Epoxide, Epoxy58.38796539.5900003.937471
Subtotal147.481600100.00000009.945619
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3226.52252050.00000015.275850
Inorganic Silicon compoundsSilica, vitreous60676-86-090.60900820.0000006.110340
PolymersPlastic: EP - Epoxide, Epoxy135.91351230.0000009.165510
Subtotal453.045040100.000000030.551699
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-08.28000060.0000000.558373
Inorganic compoundsCarbon Black1333-86-40.0138000.1000000.000931
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1242000.9000000.008376
PolymersPlastic: EP - Epoxide, Epoxy5.38200039.0000000.362942
Subtotal13.800000100.00000000.930621
Total1482.880000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 T1042NSN7WQB
Product content declaration of T1042NSN7WQB
上次修订 Last Revision (GMT):
Tuesday, 19 March 2024, 07:38:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of T1042NSN7WQBLast Revision (GMT):
Tuesday, 19 March 2024, 07:38:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - SAC, Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
SubstrateBUILD UPNot AvailableNot AvailableNot AvailableNot Available
CORENot AvailableNot AvailableNot AvailableNot Available
CU FOILNot AvailableNot AvailableNot AvailableNot Available
SOLDER MASKNot AvailableNot AvailableNot AvailableNot Available
SOLDER PASTENot AvailableNot AvailableNot AvailableNot Available
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.