TDA3683J/N2S,112

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of TDA3683J/N2S,112Last Revision (GMT):
Thursday, 14 April 2022, 02:26:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
TDA3683J/N2S,112SOT411DBS23P6161.454990 mg NoNoYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 891 411122021-03-299NA / Not AvailableNot ApplicableNot ApplicableNA / Not AvailableNot ApplicableNot ApplicableNot ApplicableKaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-82.31975899.9900000.037650
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002320.0100000.000004
Subtotal2.319990100.00000000.037653
Copper Lead-Frame, Pre-Plated AgCopper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-81215.23269497.29100019.723145
Iron and its compoundsIron, metal7439-89-629.6029592.3700000.480454
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.2123420.0170000.003446
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-02.0734560.1660000.033652
Tin and its compoundsTin, metal7440-31-50.3747210.0300000.006082
Zinc and its compoundsZinc, metal7440-66-61.5738280.1260000.025543
Subtotal1249.070000100.000000020.272322
Die EncapsulantDie EncapsulantAntimony OxidesAntimony(III) oxide1309-64-466.0884403.6000001.072611
Epoxy ResinsProprietary Material-Other Epoxy resins420.39591022.9000006.822997
Halogenated Organic CompoundsProprietary Material-Other brominated organic hydrocarbons27.5368501.5000000.446921
Inorganic Silicon compoundsQuartz14808-60-71321.76880072.00000021.452219
Subtotal1835.790000100.000000029.794748
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-82953.930000100.00000047.942085
Subtotal2953.930000100.000000047.942085
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0018960.0030000.000031
Bismuth and its compoundsBismuth, metal7440-69-90.0006320.0010000.000010
Copper and its compoundsCopper, metal7440-50-80.0006320.0010000.000010
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0031590.0050000.000051
Tin and its compoundsTin, metal7440-31-563.18368199.9900001.025467
Subtotal63.190000100.00000001.025570
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000610.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.60993999.9900000.009899
Subtotal0.610000100.00000000.009900
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-324.50000098.0000000.397633
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5000002.0000000.008115
Subtotal25.000000100.00000000.405748
Solder WireSolder WireLead and its compoundsLead, metallic lead and lead alloys7439-92-113.75623091.8000000.223263
Nickel and its compoundsNickel, metal7440-02-00.0299700.2000000.000486
Silver and its compoundsSilver, metal7440-22-40.4495503.0000000.007296
Tin and its compoundsTin, metal7440-31-50.7492505.0000000.012160
Subtotal14.985000100.00000000.243206
UnderfillUnderfillNon-Halogenated Organic Compounds - SpecificDecamethylcyclopentasiloxane541-02-60.0001660.0010000.000003
Non-Halogenated Organic Compounds - SpecificOctamethylcyclotetrasiloxane556-67-20.0001660.0010000.000003
Organic Silicon compounds1,1,3,3-Tetramethyl-1,3-divinyldisiloxane2627-95-40.0295100.1782000.000479
Organic Silicon compounds2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane2554-06-50.1354940.8182000.002199
Organic Silicon compoundsCyclosiloxanes, di-Me, polymers with Me Ph cyclosiloxanes and vinyl group-terminated di-Me siloxanes69430-27-915.66693694.6071000.254273
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.5419593.2727000.008796
Organic Silicon compoundsPlatinum, 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane complexes68478-92-20.0005960.0036000.000010
Organic Silicon compoundsPoly(methylhydrosiloxane)63148-57-20.0496800.3000000.000806
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.1354940.8182000.002199
Subtotal16.560000100.00000000.268768
Total6161.454990100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 TDA3683J/N2S,112
Product content declaration of TDA3683J/N2S,112
上次修订 Last Revision (GMT):
Thursday, 14 April 2022, 02:26:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊丝
Solder Wire
焊丝
Solder Wire
XOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of TDA3683J/N2S,112Last Revision (GMT):
Thursday, 14 April 2022, 02:26:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
12 Nov 2021
Test Report
12 Nov 2021
Test Report
12 Nov 2021
Test Report
12 Nov 2021
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
15 Nov 2021
Test Report
15 Nov 2021
Test Report
15 Nov 2021
Test Report
15 Nov 2021
CDA 194Test Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
Die EncapsulantTest Report
24 Aug 2021
Test Report
24 Aug 2021
Test Report
24 Aug 2021
Test Report
6 May 2020
Heat SpreaderNot AvailableNot AvailableNot AvailableNot Available
Post-plating - Lead FreeTest Report
28 May 2021
Test Report
28 May 2021
Test Report
28 May 2021
Test Report
28 May 2021
Pre-plating - Precious metal - AgNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
20 Aug 2021
Test Report
20 Aug 2021
Test Report
20 Aug 2021
Test Report
20 Aug 2021
Solder WireTest Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
14 Feb 2020
UnderfillATest Report
15 Sep 2021
Test Report
15 Sep 2021
Test Report
15 Sep 2021
Test Report
15 Sep 2021
BTest Report
15 Sep 2021
Test Report
15 Sep 2021
Test Report
15 Sep 2021
Test Report
15 Sep 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.