TDA8026ET/C2,557

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of TDA8026ET/C2,557Last Revision (GMT):
Thursday, 24 August 2023, 06:15:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
TDA8026ET/C2,557SOT1073TFBGA64106.202432 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 882 865572023-11-2542 / 1 year26030 sec.2 / 1 year24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000140.0010000.000013
Calcium and its compoundsCalcium7440-70-20.0000280.0020000.000026
Copper and its compoundsCopper, metal7440-50-80.0000140.0010000.000013
Gold and its compoundsGold, metal7440-57-51.38670698.8420001.305719
Iron and its compoundsIron, metal7439-89-60.0000140.0010000.000013
Magnesium and its compoundsMagnesium, metal7439-95-40.0000140.0010000.000013
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000140.0010000.000013
Palladium and its compoundsPalladium, metal7440-05-30.0161341.1500000.015192
Silver and its compoundsSilver, metal7440-22-40.0000140.0010000.000013
Subtotal1.402952100.00000001.321017
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins4.42900010.3000004.170338
Inorganic Silicon compoundsOther silica compounds38.57100089.70000036.318377
Subtotal43.000000100.000000040.488715
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.50000010.0000000.470799
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1000002.0000000.094160
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.50000010.0000000.470799
Silver and its compoundsSilver, metal7440-22-43.90000078.0000003.672232
Subtotal5.000000100.00000004.707990
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-33.72349098.0000003.506031
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0759902.0000000.071552
Subtotal3.799480100.00000003.577583
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.1450000.5000000.136532
Silver and its compoundsSilver, metal7440-22-40.2900001.0000000.273063
Tin and its compoundsTin, metal7440-31-528.56500098.50000026.896748
Subtotal29.000000100.000000027.306343
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-82.30657899.8000002.171869
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0046220.2000000.004352
Subtotal2.311200100.00000002.176221
Copper PlatingCopper and its compoundsCopper, metal7440-50-87.84035099.7500007.382458
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0196500.2500000.018502
Subtotal7.860000100.00000007.400961
Gold PlatingGold and its compoundsGold, metal7440-57-50.09815499.7500000.092422
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002460.2500000.000232
Subtotal0.098400100.00000000.092653
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0022800.2500000.002147
Nickel and its compoundsNickel, metal7440-02-00.90972099.7500000.856591
Subtotal0.912000100.00000000.858737
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.89534929.1000000.843059
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0184610.6000000.017383
Magnesium and its compoundsTalc14807-96-60.0923043.0000000.086913
Organic compoundsOther organic compounds.0.1107653.6000000.104296
PolymersPlastic: EP - Epoxide, Epoxy0.60305319.6000000.567833
PolymersPlastic: PAK1.35686944.1000001.277625
Subtotal3.076800100.00000002.897109
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-62.12366921.8000001.999642
Inorganic Silicon compoundsFibrous-glass-wool65997-17-34.36423744.8000004.109357
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1168991.2000000.110072
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6234626.4000000.587051
Phenols - SpecificBisphenol A80-05-70.0974161.0000000.091727
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)1.40279014.4000001.320865
PolymersPlastic: EP - Epoxide, Epoxy1.01312610.4000000.953958
Subtotal9.741600100.00000009.172671
Total106.202432100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 TDA8026ET/C2,557
Product content declaration of TDA8026ET/C2,557
上次修订 Last Revision (GMT):
Thursday, 24 August 2023, 06:15:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of TDA8026ET/C2,557Last Revision (GMT):
Thursday, 24 August 2023, 06:15:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Test Report
29 Jun 2023
Semiconductor DieTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Solder Ball - SAC, Lead FreeTest Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
SubstrateAU PLATINGTest Report
24 Nov 2021
Test Report
24 Nov 2021
Test Report
24 Nov 2021
Test Report
24 Nov 2021
AUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
7 Oct 2023
Test Report
7 Oct 2023
COPPERTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
CU PLATINGTest Report
17 Nov 2021
Test Report
17 Nov 2021
Test Report
17 Nov 2021
Test Report
17 Nov 2021
HL832NXATest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
11 Mar 2022
Test Report
29 Dec 2023
NI PLATINGTest Report
11 Jun 2021
Test Report
11 Jun 2021
Test Report
11 Jun 2021
Test Report
11 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.