TDF8546TH/N2ZJ

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of TDF8546TH/N2ZJLast Revision (GMT):
Friday, 09 July 2021, 02:48:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
TDF8546TH/N2ZJSOT851HSOP362545.344902 mg YesNoYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 049 251182020-12-0771 / Unlimited24530 sec.1 / Unlimited22520 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-82.89967299.9900000.113921
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002900.0100000.000011
Subtotal2.899962100.00000000.113932
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-8169.28634097.2910006.650821
Iron and its compoundsIron, metal7439-89-64.1238002.3700000.162013
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0295800.0170000.001162
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.2888400.1660000.011348
Tin and its compoundsTin, metal7440-31-50.0522000.0300000.002051
Zinc and its compoundsZinc, metal7440-66-60.2192400.1260000.008613
Subtotal174.000000100.00000006.836009
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins76.20000012.0000002.993700
Inorganic Silicon compoundsQuartz14808-60-7558.80000088.00000021.953803
Subtotal635.000000100.000000024.947503
Heat SinkHeat SinkCopper and its compoundsCopper, metal7440-50-81606.39200099.90000063.110976
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.6080000.1000000.063174
Subtotal1608.000000100.000000063.174150
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0004800.0030000.000019
Bismuth and its compoundsBismuth, metal7440-69-90.0001600.0010000.000006
Copper and its compoundsCopper, metal7440-50-80.0001600.0010000.000006
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0008000.0050000.000031
Tin and its compoundsTin, metal7440-31-515.99840099.9900000.628536
Subtotal16.000000100.00000000.628598
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0003300.0100000.000013
Silver and its compoundsSilver, metal7440-22-43.29967099.9900000.129635
Subtotal3.300000100.00000000.129648
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-326.66574198.0000001.047628
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5441992.0000000.021380
Subtotal27.209940100.00000001.069008
Solder WireSolder WireLead and its compoundsLead, metallic lead and lead alloys7439-92-162.01292595.5000002.436327
Silver and its compoundsSilver, metal7440-22-41.6233752.5000000.063778
Tin and its compoundsTin, metal7440-31-51.2987002.0000000.051023
Subtotal64.935000100.00000002.551128
UnderfillUnderfillNon-Halogenated Organic Compounds - SpecificDecamethylcyclopentasiloxane541-02-60.0001400.0010000.000005
Non-Halogenated Organic Compounds - SpecificOctamethylcyclotetrasiloxane556-67-20.0001400.0010000.000005
Organic Silicon compounds1,1,3,3-Tetramethyl-1,3-divinyldisiloxane2627-95-40.0249480.1782000.000980
Organic Silicon compounds2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane2554-06-50.1145480.8182000.004500
Organic Silicon compoundsCyclosiloxanes, di-Me, polymers with Me Ph cyclosiloxanes and vinyl group-terminated di-Me siloxanes69430-27-913.24499494.6071000.520362
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.4581783.2727000.018001
Organic Silicon compoundsPlatinum, 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane complexes68478-92-20.0005040.0036000.000020
Organic Silicon compoundsPoly(methylhydrosiloxane)63148-57-20.0420000.3000000.001650
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.1145480.8182000.004500
Subtotal14.000000100.00000000.550024
Total2545.344902100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 TDF8546TH/N2ZJ
Product content declaration of TDF8546TH/N2ZJ
上次修订 Last Revision (GMT):
Friday, 09 July 2021, 02:48:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
散热器
Heat Sink
散热器
Heat Sink
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊丝
Solder Wire
焊丝
Solder Wire
XOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of TDF8546TH/N2ZJLast Revision (GMT):
Friday, 09 July 2021, 02:48:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuNot AvailableNot AvailableNot AvailableNot Available
Copper Lead-FrameAG PLATINGTest Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
CDA 194Test Report
26 Feb 2021
Test Report
26 Feb 2021
Test Report
26 Feb 2021
Test Report
26 Feb 2021
Die EncapsulantTest Report
16 Dec 2020
Test Report
16 Dec 2020
Test Report
16 Dec 2020
Test Report
16 Dec 2020
Heat SinkTest Report
3 Sep 2019
Test Report
3 Sep 2019
Test Report
3 Sep 2019
Not Available
Post-plating - Lead FreeTest Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Pre-plating - Precious metal - AgNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
9 Feb 2021
Test Report
9 Feb 2021
Test Report
9 Feb 2021
Test Report
9 Feb 2021
Solder WireNot AvailableNot AvailableNot AvailableNot Available
UnderfillATest Report
13 Aug 2020
Test Report
13 Aug 2020
Test Report
13 Aug 2020
Not Available
BTest Report
13 Aug 2020
Test Report
13 Aug 2020
Test Report
13 Aug 2020
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.